D&R News Alert
November 17th, 2025


Welcome to the issue of November 17th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Dolphin Design
 Save Power with Meerkat, the Silicon Telemetry Solution
• Power reduction > 15% vs standard regulation schemes
• Reliability enhancement thanks to reduced aging effects
• Safety improvement via ultra-fast protection mechanisms
Learn more >>

Foundry
■ Intel's 18A process technology – a lifeline for the Intel Foundry department?
■ TSMC, Samsung Reportedly Cut 8-Inch Wafer Output, Boosting Korea’s DB HiTek
Packaging
■ GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers
■ Silicon Photonic Chiplets with In-memory Computing Accelerate LLM Inference, Surpassing H100 Efficiency
Connectivity
■ Industrial gateway for IO-Link to build smarter connectivity
Creonic SDA OCT Encoder and Decoder
Creonic
• SDA OCT 4.0 Standard-compliant coding
• Robust error correction ensures reliable data
• Low-power design optimized for FPGA or ASIC
 Learn more >>

Design platform
■ New Ultra-Fast Debug Solution for Palladium Emulation with Verisium Debug by Cadence Design Systems
Memory Interface
■ Renesas’ Industry-First Gen6 DDR5 Registered Clock Driver Sets Performance Benchmark by Delivering 9600 MT/s
Processor Initiative
■ EPI announces SC25 attendance to present results: Proactive Compute showcases FAUST and FEVER - European Processor Initiative
■ EPI announces the open-source release of the CEA-List VPSim simulator - European Processor Initiative
Internet of Things
■ IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs
■ Bluetooth Channel Sounding: The Next Leap in Bluetooth Innovation
Security
■ EnSilica to develop quantum-resilient secure processor chip for critical national infrastructure applications backed by £5m UK Government ‘Contract for Innovation’
Multimedia
■ CAST Introduces JPEG XL Encoder IP Core for High-Quality, On-Camera Still-Image Compression
Artificial Intelligence
■ AI's Speed Problem Sparks Light-Based Chip Revolution
■ Samsung & Nvidia: Rewiring Manufacturing With AI Megafactory
Partner News
■ SkyeChip Berhad and Persimmons, Inc. Announce Strategic IP Licensing Partnership
■ Fortune & Great Place To Work Name Cadence to 2025 World’s Best Workplaces List
Business News
■ GlobalFoundries Reports Third Quarter 2025 Financial Results






Synopsys LPDDR6/5X/5 PHY IP for TSMC N2P
• Support for LPDDR6 with data rates up to 14.4 Gbps, LPDDR5X...
• Flexible implementation to support discrete DRAM-on-PCB...

Featured Products
• Creonic oFEC Encoder and Decoder IP core
• Creonic Doppler Channel IP core

What they said at
IP SoC South Korea 25

Unlocking Generative AI at the Edge: How LPDDR enables Scalable & Efficient Intelligence
Suk Keun Youn, Director, Silicon IP, Rambus, Inc.

The Next Evolution of AI: Edge First!
Seung-Kee Kim, Korea & SEA Sales manager, Ceva, Inc.

High-performance LPDDR IP Solution for Automotive AI
Hweihn Chung, EVP, OPENEDGES Technology, Inc.

Interview with Khal Lee - GM, Sales & Marketing Team - ARKCHIPS

Interview with Erin Kang - Strategic Marketing Manager - Qualitas Semiconductor

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