D&R News Alert
November 20th, 2025


Welcome to the issue of November 20th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry and Technology News
■ CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links
■ GlobalFoundries Acquires Advanced Micro Foundry, Accelerating Silicon Photonics Global Leadership and Expanding AI Infrastructure Portfolio
■ Powering the future: Why GF’s new agreement with TSMC is supercharging GaN innovation
■ Chinese crypto-mining manufacturers order next-gen 2nm GAA chips from Samsung Foundry
Bluetooth Low Energy 6.2 PHY IP
CSEM

• Channel Sounding; Automotive Grade 1
• 22nm CMOS, 0.57mm2 area incl references and LDOs
• 3.9mW Rx (LE1M), 6.8mW Tx (0dBm); -100dBm sensitivity
 See full specifications >>

Chiplets
■ Cadence Debuts Its First System Chiplet Silicon To Accelerate Physical AI Development
Design Platforms
■ QuickLogic eFPGA Hard IP Selected by Chipus for 12 nm High Performance Data Center ASIC
■ Siemens and Microsoft team up to deliver Polarion X on Azure
Interface IP
■ Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market
eTopus
PCIe 5.0 / 6.0 PHY + Controller Full-stack IP Solution
• Super transmit capability in high insertion loss channels
• Completed high-speed interoperability with PC motherboards
• Superior BER performance in high insertion loss channels
• Low power consumption with optimized low latency and area
 Learn more >>

RISC-V
■ d-Matrix and Andes Team on World's Highest Performing, Most Efficient Accelerator for AI Inference at Scale
■ RISC-V And Its Modularity Shine Across Applications
■ proteanTecs and Akeana Announce Joint Initiative to Drive Next-Generation RISC-V Processor Performance
Artificial Intelligence
■ Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost
■ AMD maps out strategy for leadership in future compute and AI
■ Arm Neoverse platform integrates NVIDIA NVLink Fusion to accelerate AI data center adoption
■ Scintil Photonics: AI at the speed of light
Internet of Things
■ Ceva Receives 2025 IoT Edge Computing Excellence Award from IoT Evolution World
Ecodesign of electronics for e-waste reduction
How to ease environmental assessment and anticipate circularity strategies
Listen Now >>                                    

Networking
■ EagleChip Selects CAST TSN IP Core to Enhance Advanced Intelligent Control SoC
■ Three Ethernet Design Challenges in Industrial Automation - By Keyasic
Automotive
■ Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
■ SAICEC and Siemens to accelerate chip-to-vehicle validation using digital twin technology
Space
■ GlobalFoundries and BAE Systems Collaborate on Semiconductors for Space
Security
■ Why anti-tamper sensors matter - by Agile Analog
Business News
■ Denmark Opens 300-mm Wafer Fab to Strengthen Europe’s Sovereignty





New IP
• 180SMIC_LPF_05 - 1 to 200 MHz Low-pass filter with frequency adjustment system by NTLab

What they said at
IP SoC South Korea 25

Interview with Suk Keun Youn - Director, Silicon IP - Rambus, Inc.

Interview with Hweihn Chung - EVP - OPENEDGES Technology, Inc.

Interview with Seyoung (Sean) Park - - Applications Engineer - Quadric

Interview with Jungmin Joo - Country Manager - intoPIX

Interview with Mason Li - VP, Director (ASIA ex-China) - Innosilicon

Interview with Yoon Kim - PM - 4lynx

Interview with Shahram Mossayebi - CEO - Crypto Quantique

Interview with Evan Price - CAST

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