D&R News Alert
November 24th, 2025


Welcome to the issue of November 24th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Synopsys Discover Expert Insights on AI and HPC IP
  • Edge AI: PCIe 5.0 Performance
  • HPC: 64G UCIe Explained
  • Data Center: 1.6T MACsec Modules
  • RISC-V: Embedded Processor Performance

Foundry News
■ Samsung announces 2nm GAA process has 5% more perf, 8% more efficient than 3nm GAA
Interface IP
■ Maximizing SoC Longevity with PCIe 3.0: A Designer’s Guide - By Keyasic
Keysight
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  • Secure, AI-ready, scalable infrastructure built for modern semiconductor workflows
  • Streamlined version control and IP lifecycle management, try SOS free to see the difference
Learn more

RISC-V
■ Breker Verification Systems and Frontgrade Gaisler Collaborate on High-Reliability RISC-V Fault-Tolerant Processor Core
■ Fragmentation to Standardization: Evaluating RISC-V’s Path Across Data Centers, Automotive, and Security
■ d-Matrix and Andes Collaborate on RISC-V Accelerator for AI Inference
Automotive
■ Synopsys Convenes Industry Leaders to Discuss Future of Automotive Engineering for Software-Defined Vehicles
Artificial Intelligence
■ VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor
■ Cadence Adds 10 New VIP to Strengthen Verification IP Portfolio for AI Designs
■ Arm Neoverse platform integrates NVIDIA NVLink Fusion to accelerate AI data center adoption
■ Engineering Education in the Age of AI
■ Let's Visit the Zoo - by Quadric
A Microservice Store
A New Era for Embedded Systems Begins
Microservice Store - Zaya

• Secure by Design, From the Ground Up
• Empowering Developers & IP Vendors
• Accelerating Product Vendors
• A Secure and Connected Ecosystem
 Learn More >>

Security
■ ML-DSA explained: Quantum-Safe digital Signatures for secure embedded Systems - By Kivicore
Wireless
■ Oulu’s semiconductor industry: A rising European wireless technology hub
Photonics
■ Photonics Investments—Three Game-Changing Photonics Technologies
■ How Europe Can Build—and Keep—the Next Generation of Deep-Tech Giants
■ Beyond Silicon: Exploring new materials for Photonic Integrated Circuits
Green Electronics
■ Sustainability moves upstream delivering greener semiconductor design
Business News
■ Japanese government to invest 100 bil. yen in chipmaker Rapidus
■ TSMC gets NT$147bn in subsidies in two years
■ Rapidus Selected as Official Business Operator by Japan Government






1024-bit Vector DSP IP, Quad Core
• Four-way VLIW combining scalar and vector operations
• 128-bit, 256-bit, 512-bit, and 1024-bit vector word lengths

What they said at
IP SoC South Korea 25

Advanced Automotive AI/ML Networks
Seyoung (Sean) Park -, Applications Engineer, Quadric

Image compression for AI and machine learning
Jungmin Joo, Country Manager, intoPIX

How UCIe is Progressing to enable Chiplets
Hyoung-Bae Choi, Sr. Director, Synopsys, Inc.

Updated Methodology to Generate Optimal NoCs in 2025
John Min, VP of Customer Success, Arteris IP

Shaping the Future of High-Performance Chips: DRAM, SerDes, and Chiplet IP Innovations
Mason Li, VP, Director (ASIA ex-China), Innosilicon

Analog IP Solution for SAMSUNG Foundry
Myeonglyong Ko, R&D Center Director, LeoLSI

Advancing Power Telemetry
David Steer, VP Wordwide Sales, Movellus, Inc.

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