D&R News Alert
March 2nd, 2026


Welcome to the issue of March 2nd, 2026 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Get the Latest on IP for AI and Automotive
Synopsys • Securing UALink connections
• Ethernet standards for scale up AI
• Secure Storage Solution for OTP
• RISC-V Real-Time extensions for Auto responses
Learn More >>

Technology News
ASML announces breakthrough in EUV light source to boost chip output
Design Platform
Siemens accelerates integrated circuit design and verification with agentic AI in Questa One
CEVA
Ceva-NeuPro™-Nano
An ultra-efficient, self-contained NPU solution designed to execute Embedded ML workloads across low-power, compact AIoT devices.
 
• Weights de-compression and sparsity acceleration for reduced memory.
• Choice of two compatible NPUs – Ceva-NPN32 and Ceva-NPN64
• Ceva-NeuPro Studio AI SDK for simple Embedded ML apps development
Learn More >>>

Analog IP
TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
Security
Jmem Tek Joins the Intel Foundry Accelerator Ecosystem Alliance Program, Enabling JPUF and Post-Quantum Security Designs
Allegro DVT is exhibiting at Embedded World 2026
Allegro DVT
• Nuremberg, Germany, from March 10 to 12
• Meet our team at booth 4A-606 in Hall 4A
• Discover AI-based Video Enhancement & Preprocessing Demos
Book your Meeting >>

Artificial Intelligence
As AI scales, so do CPUs - by Arm
Samsung Electronics Announces Strategy To Transition Global Manufacturing Into ‘AI-Driven Factories’ by 2030
Internet of Things
Microservice Store Launches Automated Security Support Gateway to Solve IoT Compliance for Product Vendors
Reduce the Lag: From Hardware Specs to Software Simulation, 5x Faster.
Vayavya Labs
Meet Our Team at DVCON 2026
March 2-5, 2026
Santa Clara, CA, USA

Automotive
Renesas Looks to the Future of Automotive With New Memory and SoC Tech
Wireless
MWC: Ericsson and Intel join for 6G AI-RAN
Green Electronics

How can Industrial waste recovery and recycling be improved ?
WEEECycling     Dassault Systemes

Partner News
Weebit Nano achieves record half-year revenue; licenses ReRAM to Tier-1 Texas Instruments
BrainChip Named Official Technology Sponsor for Raytheon’s “Operation Touchdown” Autonomous Vehicle Competition
Keysight to Demonstrate AI-Driven Wireless Innovations and 6G Readiness at Mobile World Congress 2026
Synopsys Posts Financial Results for First Quarter Fiscal Year 2026
Business News
Rapidus Secures 267.6 Billion Yen in Funding from Japan Government and Private Sector Companies
TSMC Speeds up Expansion in Taiwan: up to 10 Fabs Reportedly under Construction or Starting in 2026







Synopsys HBM4 IP for TSMC N3P
• Supports JEDEC HBM4 DRAMs
• Supports data rates up to 12 Gbps

What they said at
IP-SoC EU 25


Equivalence checking: proving correctness of RISC-V implementations when model checking cannot scale
Jonathan Certes, Formal Verification Expert, Keysom


Building Trust from Edge to Cloud: Synopsys ARC-V Processor IP and the RISC-V Security Advantage
Ruud Derwig, Synopsys, Inc.


Sub-mW always-on Edge Neural processor with near-memory computing
Thomas Gillot, AI Business Developer, Asygn


Post-quantum Algorithms MS-KEM and MS-DSA Protected Against Physical Attacks, in Hardware and in Software
Yaacov Belenky, Chief Innovation Officer, FortifyIQ, Inc.


Post-Quantum Cryptography: Urgent Action Required by Chip Makers
Lamyae Lahlou, Product Line Manager Security IP, Kudelski Labs


Hardware-Rooted Security - How to Protect Already-Deployed Devices against Reverse Engineering & Firmware Cloning
Ruud Derwig;Marc Fyrbiak, Synopsys, Inc.;Emproof


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