D&R News Alert
March 5th, 2026


Welcome to the issue of March 5th, 2026 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry Ecosystem News
■ Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets
Memory Interface
■ Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP
■ Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
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Design Platform
■ Intelligently Assembling SoCs the Agnisys Way by Agnisys
RISC-V
■ The Rise of RISC-V
Intopix - jpeg-xs
New TicoRAW Codec ASIC IP & SoC Library
The Standard for RAW Sensor Data Compression — with Lossless / Math‑Lossless Quality
• Line-based latency enabling real‑time processing for AI pipelines
• Small footprint & low power for chip & SoC integration (minimal SRAM, no external DDR)
• Preserve sensor fidelity for safety critical applications
IPX-TICO-RAW-32MP       IPX-TICO-RAW-8MP       IPX-TICO-RAW-2MP

Artificial Intelligence
■ Keysight and Samsung Demonstrate End-to-End AI-RAN Validation Workflow with NVIDIA
■ Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices
Space Application
■ Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals
Rambus
Rambus UET-Security IP Solutions
for AI & HPC
• UET-TSS-IP-69: Inline, multi‑channel TSS transform engine up to 1.6Tbps.
• UET-TSS-IP-369: multi‑channel packet engine up to 1.6Tbps.
• For use in SmartNICs and NIC chiplets, and in the future to be part of UET-based NVMe-oF storage controllers

Security
■ Kudelski Labs Addresses Device Lifecycle Security, Edge AI, Post Quantum Cryptography and Regulatory Compliance at Embedded World 2026
Automotive
■ RISC-V IP Core, Powering Next-Gen Automotive & AI SoCs
■ DCD-SEMI to Showcase CAN XL with Functional Safety and RISC-V Subsystems at Embedded World 2026 – Booth 4-481
■ Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications
■ Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
Wireless
■ Keysight and Qualcomm Advance RF Digital Twins to Scale Massive MIMO and AI-Native 6G Research
■ ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform
Green Electronics
■ Infineon and UMC partner in driving decarbonization across the supply chain
How industrial materials are sorted, and prepared for further recovery ?

RISE         Dassault Systemes

Photonics
■ Nvidia Pours $4B Into Photonics To Scale AI Data Centers
Partner News
■ Working in electronics engineering Agile analog Blog
■ QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
Business News
■ EU backs €1.1bn French cleantech manufacturing push
■ Renesas Advances Its India and China Strategy with Strengthened Leadership
■ STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere





New IP
• Compact Low Power Digital Frequency Divider by Kamaten Technology Inc.
• Meridian DFT by Real Intent
• 14-bit, 12p5MSPS Analog-to-Digital Converter (ADC) IP block Tower 65nm by Alphacore, Inc.
• Crash-data-driven Edge-case Generation by Vayavya Labs
• HBM4E Memory Controller by Rambus, Inc.

What they said at
IP-SoC EU 25

JPEG XS TDC: Enabling Pristine Wireless Video with Ultra-Low Latency and Minimal Power
Catherine Stroobants, Market Lead for Prosumer and Consumer Electronics Solutions, intoPIX
Dolphin Semiconductor microphone

WhisperExtractor: When Every Mic Becomes Intelligent
Etienne Faucher;Constant Essey, Product Marketing Manager;Analog IC Design Engineer, Dolphin Semiconductor

Electrical verification - The invisible bottleneck in IC design
Jean-Pierre Goujon, Customer Success Manager, Aniah

Forks in the Fab Five Key drivers that can potentially change the competitive stack
P.SRINIVASA RAGHAVAN, Practice Head - Semiconductor BU, HCLTech

Advancing AI with game-changing photonics substrates
Yannick Larvor, Business Development Manager, Soitec

European policies on Semiconductors : from Chips Act1 to Chips Act 2.0
Dominique THOMAS, STMicroelectronics

Meet IC-DASH, The French Design Enablement Team of the European Chip Design Platform
Alexandre Valentian, CEA

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