D&R News Alert
Innovation in the Semiconductor World
May 18th, 2026

Welcome to the issue of May 18th, 2026 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Boost automotive SoC performance with advanced SRAM IP
Synopsys • Up to 30% lower power, 11% faster, 10% smaller
• Eliminate bottlenecks with major timing gains
• Advanced low-power modes & scaling
• Built for automotive reliability & safety
 Get the white paper >>

Foundry Ecosystem
■ UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays
■ IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
Design Platform
■ Keysight and SRC UK Collaborate to Advance EW Modernization with Advanced Test and Simulation
■ IC Manage GDP-AI Transforms IP Lifecycle Management with Generative and Agentic AI
■ The next EDA wave: Lessons from DATE 2026
Memory Interface
■ Niuxin's domestic advanced process DDR5/LPDDR5 IPs have both achieved a breakthrough of 6400Mbps
RISC-V
■ Tenstorrent Unveils TT-QuietBox 2, the First RISC-V AI Workstation With a Fully Open-Source Stack to Deliver Teraflop-Class Inference
■ RISC-V IP Cores: Built for functional safety (ASIL-B/D), high performance, and low power operation for automotive and industrial applications
AI Solutions
■ Smallest.ai and Tenstorrent Partnership Democratises Voice AI - 4x reduction in cost through hardware acceleration
Automotive
■ Synopsys Achieves First ISO/PAS 8800 Certification for AI-Driven Automotive Systems
■ Automotive silicon in the era of AI, functional safety, and cybersecurity
Multimedia
■ JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
Partner News
■ SkyeChip Berhad IPO: Financial Performance, Patents, and ESOS Details for 2026 Listing
■ Celebrating 4 Incredible Years Together at BOS Semiconductors
Business News
■ South Korea will invest more than 100 million dollars to support small and medium-sized enterprises, covering the semiconductor industry
■ Bangladesh hosts semiconductor roadshow in South Korea
■ TSMC forecasts $1.5 trillion global chip market by 2030
■ SEMIFIVE Reports 137% YoY Revenue Growth in Q1 2026, Accelerating Its Rise as a Key Global Player in AI ASIC
■ SEMI and semiconductor companies call for extended investment credit
Do not miss IP-SoC
Silicon Valley 2026 		Now Open! >>






What they said at
IP SoC Silicon Valley 26

From Monolithic SoCs to Chiplets: A new Hardware Security Paradigm
Berardino Carnevale, Senior Technical Marketing and Product Manager, Rambus, Inc.

Hardware-Software Co-Design and Side-Channel Resilience Challenges in Post-Quantum Cryptography IP
Reza Azarderakhsh;Patrick Manning, CEO, PQSecure Technologies

Future-Proofing SoCs: eFPGA IP Use Cases and Integration Made Predictable
Trey Peterson, Field Application Engineer, QuickLogic Corp.

Why Aren't You Considering eFPGA for Your Next ASIC? (And What It's Costing You)
Jayson Bethurem, VP, Business Development, Menta

Why Now Is A Critical Moment To Think About On-Chip Smarts For Power and Thermal Efficiency
Mahesh Tirupattur, CEO, Analog Bits Inc.

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