D&R News Alert
Innovation in the Semiconductor World
July 6th, 2026

Welcome to the issue of July 6th, 2026 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry and Foundry Ecosystem News
■ Samsung Reaffirms 1.4nm Chips for 2029 and Adds an Enhanced SF1.4+ Node
■ Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging
Chiplets
■ Socionext Addresses Datacenter Infrastructure Customer Demands for Advanced SoCs on TSMC A14 Technology
Cut silicon test costs with digital timing monitors
Dolphin Semiconductor
 • No trimming, no calibration, no LUTs​
• 100% digital, scan-based
• No dedicated pin, no analog tester needed​​
Learn more >>

Design Platforms
■ Electronics Digital Twin platform from Synopsys for accelerating physical AI development
■ Keysight and WIN Semiconductors Collaborate to Cut Design Risk for High Frequency RF Components
■ Nordic expands nRF Cloud with firmware vulnerability scanning
Analog IP
■ TES Electronic Solutions Introduces a Split Pi Boost Buck DC DC Converter IP for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology
Interface IP
■ High-Speed SerDes Design: Architecture, Equalization, and CDR Circuits
Memory IP
■ Rambus Targets AI PCs With 9,600 MT/s Client Memory Chipset
RISC-V
■ RISC-V Accelerates Physical AI Chips
Audio/Video
■ VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
■ Chips&Media to Supply APV IP for Future Google Smartphones
Automotive
■ Allegro DVT contributes to E https://www.automotiveworld.com/news/allegro-dvt-contributes-to-european-automotive-chiplet/uropean automotive chiplet
■ Imec extends auto chiplet program to edge computing
■ In the AI-native era, what exactly are autonomous vehicles competing on?
Security
■ Why crypto-agility requires real governance
■ Microsoft accelerates quantum-safe timeline for adoption by 2029
EECONE: giving electronic devices a second life
Thalès
UCLouvain

Thales and UCLouvain demonstrate how discarded smartphones can be securely repurposed into home routers, extending device lifecycles and reducing the need for new hardware.
 Listen Now !

Partner News
■ Qualcomm's Tenstorrent Deal Looks Less Likely
Business News
■ Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
■ KSIA Welcomes New Domestic Semiconductor Investment Plan
■ SemiFive Records First Overseas Mass Production Revenue
■ Vietnam advised to prioritize Edge AI, IoT and chiplet technologies
■ China's semiconductor companies speed up IPOs in 2026, as A-share market fuels bid for chip self-reliance
■ Malaysia launches program to accelerate next generation of homegrown semiconductor firms





What they said at
IP SoC Silicon Valley 26

Advancing AI SoCs through Full digital CIM NPU IP and SRAM Innovation
Hanwool Jeong, CEO, Articron

Advanced mathematics foundation IP that accelerates AI accelerators
Marc Greenberg, VP Product, Cassia.ai

High performance, Low Power IP calibration
Esko Mikkola, Alphacore, Inc.

Managing Power and Performance in the Age of AI
Pranshu Kalra, Analog Bits Inc.

SLM PVT IP Tutorial in N2P GAA tech node using DAA architecture
Rohan Bhatnagar, Product Management, Synopsys, Inc.
Innosilicon microphone

Interview with Farzad Zarrinfar - Senior Vice President of Sales & Marketing - Innosilicon

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