D&R News Alert
Innovation in the Semiconductor World
July 9th, 2026

Welcome to the issue of July 9th, 2026 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry News
■ TSMC Highlights 2nm and Advanced Packaging Progress
■ Rapidus Pursues 2-nanometer Semiconductor Production in Japan
■ MOSIS 2.0 and GlobalFoundries Partnership: A Strategic Alliance for Semiconductor Innovation
Interconnect and Chiplet IP
■ Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
■ Discuss Silicon-Ready UCIe IP at DAC 2026, Long Beach, California
Design Platform
■ Keysight Targets the Hidden Cost of UI Test Authoring and Maintenance
■ Asset Lifecycle Management at the Edge
RISC-V
■ MIPS on the RISC-V Shift: ‘Physical AI Is Agentic AI at the Edge’
■ SUSE, Openchip partner to develop European RISC-V hardware
AI Solutions
■ SkyeChip Advances Custom Interface IP Engagement with Cerebras for Wafer-Scale AI Platforms
■ Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era
Automotive IP
■ CAST Expands Functional Safety IP Line with ASIL B Ready SENT/SAE J2716 Receiver Core
Multimedia iP
■ TAKUMI starts licensing new Warping IPs “TW270” and “TW290”
Rambus The Rambus CryptoManager RT-648 HSM with Arm Cortex-M33 Processor
• ISO 26262 ASIL-B compliant hardware security core
• Strong Integration into the Arm CSS framework
• Built-in crypto support covers common standards like AES, SHA-2, RSA, and ECC
• Supports global and next-gen encryption, including Chinese standards and quantum-resistant algorithms
• Extra protections for tampering, keys, and system control
 Learn More >>

Networking
■ CAST Licenses TCP/IP Hardware Stack Core for Keysight FieldFox Handheld Spectrum Analyzers
■ Multi-Protocol Communication Systems Deliver a Richer User Experience
Security
■ SEALSQ and GlobalFoundries Partner to Accelerate PostQuantum Cryptography and Quantum Computing Technologies
Partner News
■ SemiWiki Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
Business News
■ Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure
■ Samsung Electronics Delays Mass Production of CXL 3.1 Memory Modules
■ Global Semiconductor Sales Increase 9.2% Month-to-Month in May
■ Top Semiconductor Companies To Watch In 2026
■ India approves 12 semiconductor manufacturing projects with investments totalling around US$17.2 billion





Embedded flash IP, 1.5V/5V SMIC 90nmBCD
• 10K P/E cycles@125C, more than 10 years data retention of 125 degree, AG1 qualification


12 bit Digital-to-Analog Converter (12-bit DAC)
• Resolution: 12 bits
• Sampling Rate (Fs): up to 20Msps
• Input Signal Bandwidth: Typ Fs/2

What they said at
IP SoC Silicon Valley 26

New SRAM IP to break AI SoC Memory Wall
Dr. KyungRok Kim, CEO, Ternell

The Widespread Use of LPDDR Memory Subsystems
Byul Choi, Head of Sales & Marketing, OPENEDGES Technology, Inc.

LPDDR6/5X: The Future of Memory for AI, Security & Automotive
Farzad Zarrinfar, Senior Vice President of Sales & Marketing, Innosilicon

AI Inference needs a mix-and-match memory strategy
Nidish Kamath, Director of Product Management, Silicon IP, Rambus, Inc.

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