Mindspeed to Present Next Generation of 4G Base Station Technology

Company Executive to Discuss Mindspeed's Transcede Family of SoC Wireless Baseband Processors and Their Role in Today's Major Industry Network Upgrade

NEWPORT BEACH, Calif., Aug 23, 2010 --Mindspeed Technologies, Inc. (NASDAQ:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced that Chief Technology Officer James Johnston will present an in-depth architectural overview of the Transcede(TM) family of 3G/4G/long-term evolution (LTE) wireless baseband processors at the HOT CHIPS 22 conference at Stanford University in Palo Alto, Calif.

Johnston's presentation, entitled "Transcede: Solving 4G Challenges for Pico, Micro and Macrocell Platforms," will detail the system-on-chip (SoC) approach to overcoming the computational challenges and complexities presented by the explosion of video traffic across worldwide mobile networks, as today's operators execute a massive infrastructure upgrade to new 4G standards. The presentation will take place during the SoC session on Monday, Aug. 23 at 1:45 pm PT. Other scheduled presentations during the SoC session will be "The New Xbox 360 SoC" from Rune Jensen of Microsoft Corporation and "Extensions to the ARMv7-A Architecture" from David Brash of ARM Ltd.

"The increasing use of smart phones and the surge of mobile video applications are key contributors to the network capacity crunch that many 3G subscribers are experiencing," said Johnston. "3G and 4G network operators are looking to migrate to a more flexible cellular landscape, which can accommodate compact base stations, such as microcells, picocells and metro femtocells. Mindspeed has designed the Transcede family of baseband processors to enable tomorrow's network architects to deploy powerful 4G macrocells and 'small cells,' which are built on a common framework."

Launched earlier this year at the 2010 Mobile World Congress trade show in Barcelona, Spain, the Transcede family of SoCs integrates an unprecedented 26 programmable processors into a single device, including two ARM(R)Cortex A9 (R) multi-core symmetric multiprocessing (SMP) reduced instruction set computer (RISC) processors, ten CEVA (R) digital signal processors (DSPs) and ten DSP accelerators that support the complete wideband code-division multiple access (W-CDMA), LTE or WiMAX (Layers 1, 2 and above) processing needs of single- and multi-sector base stations. The Transcede family of SoCs can deliver three sectors of LTE processing in a single device, while still providing substantial processing headroom, allowing manufacturers to deploy their own value-added features as part of an overall Transcede-based solution.

The Transcede family of wireless baseband processors are designed to:

• be software configurable for all flavors of LTE, W-CDMA and WiMAX;
• support wireless standards in China, including TD-SCDMA and TD-LTE;
• significantly reduce system bill of materials (BOM);
• provide the lowest possible latency;
• enable a simplified programming model allowing easy adaptation;
• offer a comprehensive roadmap of scalable SoCs across a wide range of base stations; and
• optimize power efficiency in wireless handset applications and reduce power; consumption during low-traffic periods.

About HOT CHIPS

Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry's leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August on the Stanford University campus in the center of the world's capital of electronics activity, Silicon Valley. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. HOT CHIPS 22 is sponsored by the IEEE Technical Committee on Microprocessors and Microcomputers. The event's technical affiliates include the IEEE Solid-State Circuits Society and the IEEE Computer Society.

About Mindspeed Technologies

Mindspeed Technologies, Inc. designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure, which includes today's separate but interrelated and converging enterprise, broadband access, metropolitan and wide area networks. Our products are classified into three focused product families: communications convergence processing, high-performance analog and wide area networking communications. Our products are sold to original equipment manufacturers (OEMs) for use in a variety of network infrastructure equipment, including voice and media gateways, high-speed routers, switches, access multiplexers, cross-connect systems, add-drop multiplexers, digital loop carrier equipment, IP private branch exchanges (PBXs), optical modules, broadcast video systems and wireless base station equipment. To learn more, visit us at www.mindspeed.com.