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Friday, October 24, 2025

• Airbus, Leonardo and Thales unite to form European space powerhouse
• SOI Technology: Powering the Next Wave of AI and Advanced Computing with Unprecedented Efficiency

Thursday, October 23, 2025

• RISC-V Exceeding Expectations in AI, China Deployment
• Arteris Selected by Axelera AI to Accelerate Computer Vision for Edge Devices
• Siemens updates Designcenter Solid Edge with AI and cloud-driven enhancements
• From Polish photonics to European EMS insights
• Axelera Announces Europa AIPU, Setting New Industry Benchmark for AI Accelerator Performance, Power Efficiency and Affordability
• Preliminary Characterisation Report for Perceptia’s pPLL08W in GF 22FDX Now Available
• Samsung Electronics Ranks 5th in Global Brands for the Sixth Consecutive Year
• Photonics21 and European industry campaign to secure photonics’ future
• Tata Technologies collaborates with Synopsys to accelerate Software‑Defined Vehicle innovation
• Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology
• Keysight Enables SK hynix to Achieve Top-Tier OCP S.A.F.E. Evaluation for Solid-State Drive Solution
• SiPearl Unveils Athena1 Processor for Europe’s Dual-Use Needs
• Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing
• Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem
• TSMC Reportedly Doubles Lithography Patents From 2016 to 2023, Extending Lead Over Rivals

Wednesday, October 22, 2025

• Semidynamics Inferencing Tools Accelerate AI App Deployment on Cervell NPU
• Arteris and Alibaba DAMO Academy Extend Partnership to Accelerate High-Performance RISC-V SoC Designs
• CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program
• Menta Brings its Pioneering eFPGA Technology to Embedded World North America 2025
• Weebit Nano delivers record quarterly customer receipts
• Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems

Tuesday, October 21, 2025

• Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions
• Arteris Selected by 2V Systems for IO Chiplet for Data Center
• Ethernet IP Core Leaders – Comprehensive Portfolio from 10M to 10G
• Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access

Monday, October 20, 2025

• Nordic Semiconductor showcases comprehensive range of chip-to-cloud solutions at embedded world North America 2025
• TSMC Raises 2025 Revenue Forecast on AI Boom, U.S. Stock Rallies 1.6%
• Keysight Technologies Completes Acquisition of Spirent Communications PLC
• Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist
• The Green Revolution in Silicon: How the Semiconductor Industry is Forging a Sustainable Future
• Google's €5 Billion AI Bet in Belgium Ignites European Tech Landscape
• AI Chips Shifting from Round to Rectangular
• SEALSQ Announces Development of QASIC, the Quantum-Resistant ASIC, By IC’Alps
• Get Your Board On Board: Talking To Leadership About Post-Quantum Cryptography
• The Road to embedded world North America: PQShield Future-Proofs Embedded Security
• Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing
• Andes Showcases Expanding RISC-V Ecosystem and Next-Generation "Cuzco" High-Performance CPU at RISC-V Summit North America 2025
• Synopsys Unveils ‘Silicon Bring-Up’ of LPDDR6 IP On TSMC’s Cutting-Edge N2P Node, Reaching Bandwidth Up to a Whopping 86 GB/s
• Intel Foundry Reportedly Secures 18A Order from Microsoft for Maia 3 Accelerator
• NVIDIA partners with TSMC, and the first wafer of the Blackwell chips manufactured in the United States is unveiled.

Friday, October 17, 2025

• TSN Technology from CAST Powers Advanced Cancer Treatment

Thursday, October 16, 2025

• Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities
• MIPI Alliance Releases New Groundbreaking Audio Interface Specification for High-Bandwidth, Low-Latency Consumer Electronics, Automotive and Industrial Applications
• Ceva Leads Next Gen Location: First IP Provider to Achieve Bluetooth 6.0 Qualification with Channel Sounding, Strong Momentum with 10+ Customers
• Milestone in strengthening Europe's semiconductor manufacturing capacity under Chips Act reached
• Nordic Semiconductor simplifies cellular IoT connectivity with nuSIM solution for nRF91 Series
• Keysight Introduces Optical Automotive Ethernet Transmitter Test Solution for nGBASE-AU Standard
• Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
• Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
• Intel's 18A production starts before TSMC’s competing N2 tech — here's how the two process nodes compare
• Samsung to buy ASML's most advanced lithography tools to rival TSMC
• Foundry Market Set to Grow as AI and Advanced Packaging Drive Demand
• GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program
• Arm and Meta Deepen Strategic Partnership to Power the Next Era of AI, from Megawatts to Milliwatts, for Billions Worldwide
• Why RISC-V + Blockchain Is the Conversation I've Been Waiting to Have
• Open Compute Project Expands Open Chiplet Economy Ecosystem

Wednesday, October 15, 2025

• Arm Sets the Standard for Open, Converged AI Data Centers

Tuesday, October 14, 2025

• Secure-IC Enables World's First PSA Level 4 Certification within Silicon Labs Series 3's Secure Vault
• Andes and Arculus System Collaborate to Integrate iPROfiler™ into AndeSysC, Expanding Virtual Platform Support for RISC-V SoC Design
• InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem