D&R News Alert
Innovation in the Semiconductor World
May 28th, 2026

Welcome to the issue of May 28th, 2026 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Microelectronics for Sensing, Imaging,
and Data Acquisition Systems
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Foundry Ecosystem News
SkyeChip's World-First HBM4/HBM3E Combo PHY IP for SF4X Listed on Samsung Foundry CONNECT
Technology News
STMicroelectronics’ new GaN semiconductors improve energy efficiency for high-demand applications from AI servers to robotics
Chiplet Solutions
Samsung May Launch Physical AI Chiplet Platform Next Year
Fraunhofer IPMS Develops High-Density Chiplet Systems at the Wafer Level
Interconnect
EXTOLL and Chip Interfaces introduce the Industry´s first Integrated UCIe IP Solution for GlobalFoundries FDX Technology ajouter dans SOIL
Design and Verification Platform
Case Study: Completing CDC sign-off by linking static & dynamic verification – with Real Intent Meridian CDC
Keysight to Showcase Spectrum Innovations at IMS 2026
Siemens introduces new Simcenter PhysicsAI add-on for AI-powered CFD design exploration
Agnisys SystemRDL VS Code Extension: A Must-Have for Modern SystemRDL Development
Analog & Mixed Signal IP
TES offers a new 30V Hysteretic Buck LED Driver IP with precise current control and wide dimming range
Interface IP
DCD-SEMI Introduces eSPI Combo for Next-Generation Intel-Based Platforms
MIPI Alliance Launches Compliance Program to Strengthen A-PHY Automotive Ecosystem
Memory Interface
Rambus Enables Next-Generation AI PC Memory with Complete Client Chipset for CUDIMM and CSODIMM Modules
AI Solutions
Global Unichip Corp (GUC) showcases VSORA’s Jotunn8 AI inference processor at the TSMC Europe Technology Symposium
INTERA Group Announces Next-Generation Neuromorphic Semiconductor Platform
Security
PAZI vs. Traditional Security: Why Conventional Security Fails in the QAAS Era
Quantum Safe is the New Cloud Migration
AI-Accelerated Vulnerability Discovery: An Emergency in Software Security. Is Hardware Next?
Beyond the Firewall: Hardware-Enforced Network Isolation for Critical OT Infrastructure
Audio
Three Audio Collaborations Tuning Up the Listening Experience
IoT
Edge AI-Driven Matter Controller for Next-Generation Smart Homes
Partner News
Quanta Computer selects Siemens Xcelerator to advance manufacturing innovation
BOS Semiconductors Appoints Former Tenstorrent and AMD Executive David Bennett as Strategic Advisor
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What they said at
IP SoC Silicon Valley 26


Advanced mathematics foundation IP that accelerates AI accelerators
Marc Greenberg, VP Product, Cassia.ai


Semiconductor IP in the AI era
Gabrièle Saucier, CEO, Design And Reuse


High performance, Low Power IP calibration
Esko Mikkola, Alphacore, Inc.


Managing Power and Performance in the Age of AI
Pranshu Kalra, Analog Bits Inc.


SLM PVT IP Tutorial in N2P GAA tech node using DAA architecture
Rohan Bhatnagar, Product Management, Synopsys, Inc.


New SRAM IP to break AI SoC Memory Wall
Dr. KyungRok Kim, CEO, Ternell


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