Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
May 28, 2026 -
By Binay Konwar, SammyGuru
Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology.
In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Until now, the Korean firm has mainly produced and supplied custom single-chip solutions for individual fabless customers. However, the new platform can transform a range of semiconductor chips for Physical AI.