Texas Instruments introduces first SuperSpeed USB-compliant transceiver test chip

Transceiver to be shown at the USB Developers Conference will help speed implementation of SuperSpeed USB

DALLAS -- May 14, 2009 - Texas Instruments Incorporated (TI) (NYSE:TXN), an active member of the SuperSpeed USB 3.0 promoters group, today introduced a new 5-Gbps transceiver test chip designed to the USB 3.0 specification version 1.0. The new transceiver is capable of driving and receiving signals over 4-m USB 3.0 cables to ensure data integrity. This transceiver will be demonstrated at the USB Developers Conference in Tokyo, Japan on May 21-22, in booth #1. For more information on TI's SuperSpeed USB technology see: www.ti.com/superspeedusb3-pr.

The new SuperSpeed USB transceiver and Synopsys' intellectual property (IP) digital controller tested successfully at the USB-IF SuperSpeed Peripheral Interoperability Lab. "Demonstrating interoperability between Synopsys' DesignWare SuperSpeed USB digital controller and TI's USB transceiver gives designers confidence that the IP functions successfully in a real-world system environment," said John Koeter, vice president of marketing for the Solutions Group at Synopsys. "Synopsys and TI are working together to help advance new technology into the market quickly, while minimizing risk and speeding time-to-market."

Key Features

• Integrated spread spectrum PLL
  • Supports multiple input reference frequencies: 20 MHz, 25 MHz, 30 MHz and 40 MHz
• PIPE3 and ULPI compliant interfaces
• Tested successfully at the USB-IF PIL
• Programmable transmitter pre-emphasis
• Best-in-class adaptive receiver equalizer

Key Benefits

• Saves system cost by eliminating the need for an external spread spectrum clocking device
• Interoperability across a wide selection of ASIC / FPGA platforms eases designs by allowing designers to work with the same USB device, regardless of the processor platform

Availability

The first in TI's SuperSpeed USB family of devices, the TUSB1310, SuperSpeed USB transceiver, will sample in 4Q09 and volume production is expected in 1Q10. In addition, evaluation modules will be available to interface the TUSB1310 to a variety of processor and FPGA implementations.