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IC Manufacturing and Packaging: The Engine Powering the Digital and AI World
P R Sivakumar
Maven Silicon
Working in electronics engineering
Harith Haboubi
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Intelligently Assembling SoCs the Agnisys Way
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Creating a Frequency Plan for a System using a PLL
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From Silos to Systems, from Data to Insight
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Security certification and the crucial role of anti-tamper sensor solutions
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Key ASIC
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STMicroelectronics
AI in VLSI Physical Design: Opportunities and Challenges
Japesh Kumar, Qualcomm
AI-Driven and Traditional Approaches to Accident Scenario Reconstruction
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Vayavya Labs
From Theory to the Field: Why Side-Channel Protection Defines Post-Quantum Security
PQSecure Technologies
PCIe 5.0: The universal high-speed interconnect for High Bandwidth and Low Latency Applications Design Challenges & Solutions
Innosilicon Technology Ltd
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Today on Design And Reuse
QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
- March 5, 2026
Infineon and UMC partner in driving decarbonization across the supply chain
- March 5, 2026
ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform
- March 5, 2026
Keysight and Qualcomm Advance RF Digital Twins to Scale Massive MIMO and AI-Native 6G Research
- March 5, 2026
Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
- March 5, 2026
Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications
- March 5, 2026
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- September 16
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Business
QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
- March 5, 2026
Renesas Advances Its India and China Strategy with Strengthened Leadership
- March 4, 2026
Synopsys Posts Financial Results for First Quarter Fiscal Year 2026
- March 2, 2026
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Green Electronics
Infineon and UMC partner in driving decarbonization across the supply chain
- March 5, 2026
EU approves €3B German State aid for cleantech manufacturing
- February 11, 2026
Biodegradable PCB targets short-lifetime electronics
- February 9, 2026
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Automotive
Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
- March 5, 2026
Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications
- March 5, 2026
Renesas Looks to the Future of Automotive With New Memory and SoC Tech
- March 2, 2026
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Security
Kudelski Labs Addresses Device Lifecycle Security, Edge AI, Post Quantum Cryptography and Regulatory Compliance at Embedded World 2026
- March 5, 2026
Jmem Tek Joins the Intel Foundry Accelerator Ecosystem Alliance Program, Enabling JPUF and Post-Quantum Security Designs
- March 2, 2026
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- February 9, 2026
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Artificial Intelligence
Keysight and Samsung Demonstrate End-to-End AI-RAN Validation Workflow with NVIDIA
- March 5, 2026
Samsung Electronics Announces Strategy To Transition Global Manufacturing Into ‘AI-Driven Factories’ by 2030
- March 2, 2026
SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- February 23, 2026
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RISC-V
The Rise of RISC-V
- March 5, 2026
RISC-V IP Core, Powering Next-Gen Automotive & AI SoCs
- March 3, 2026
RISC-V IP Core - TAE520 : R52, Comparable Performance functional-safety processor
- February 23, 2026
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Design IP
Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP
- March 5, 2026
Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets
- March 3, 2026
TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
- March 2, 2026
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Design Platform and Service
Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices
- March 4, 2026
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- March 2, 2026
Kaynes Semicon Pvt Ltd Adopts Advanced Simulation Solutions from Synopsys to Strengthen OSAT Capabilities
- February 26, 2026
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Networking
Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals
- March 4, 2026
Fraunhofer IPMS develops new 10G TSN endpoint IP Core for deterministic high-speed Ethernet networks
- February 16, 2026
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Processor
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- March 2, 2026
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Internet of Things
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- March 2, 2026
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Foundry
ASML announces breakthrough in EUV light source to boost chip output
- March 2, 2026
Moon Photonics: moving towards large-scale quantum photonics
- February 26, 2026
Europe’s stealth leading-edge process technology
- February 26, 2026
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Chiplet / Multi-Die
GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- February 26, 2026
Siemens wins Best of Show Award for "Packaging: Design" at 2026 Chiplet Summit
- February 23, 2026
Chiplet Summit Announces 2026 Best of Show Award Winners
- February 19, 2026
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