Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Videos
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Videos
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller & PHY
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Design Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2026
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC 2025
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
Partner Highlight
New Products
5 GHz 150 fs jitter Phase Locked Loop (PLL) IP Block GlobalFoundries 22nm
Network on Chip (NoC)
JPEG-E-XL JPEG XL Encoder
Arasan xSPI + eMMC Combo PHY IP
ReRAM (RRAM) NVM in DB HiTek 130nm BCD (1Mb)
Blogs
Synopsys Delivers First Complete UFS 5.0 and M‑PHY v6.0 IP Solution for Next‑Gen Storage
LJ Chen
Synopsys, Inc.
Flexible Ethernet IP Licensing for Secure, Scalable Silicon Development
Comcores
Transforming the Automotive Experience with Cadence Tensilica DSPs
SriramK
Cadence Design Systems, Inc.
Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design
Amlendu Shekhar Choubey
Synopsys, Inc.
Accelerating Chiplet Innovation with a New Partner Ecosystem
Mick Posner
Cadence Design Systems, Inc.
From Fab to the Field: Accelerating Trusted U.S. Semiconductor Onshoring for Mission-Critical Defense
GlobalFoundries
IC Manufacturing and Packaging: The Engine Powering the Digital and AI World
P R Sivakumar
Maven Silicon
Working in electronics engineering
Harith Haboubi
Agile Analog
Intelligently Assembling SoCs the Agnisys Way
Anupam Bakshi
Agnisys, Inc.
Akida Pico: The Tiny Brain Making “Always-On” AI a Reality
BrainChip Inc.
Bridging the Gap to Chiplet Interoperability
Andy Nightingale
Arteris
Rambus Announces Industry-Leading Ultra Ethernet Security IP Solutions for AI and HPC
Rambus, Inc.
Articles
Securing UALink: Introducing Synopsys UALinkSec_200 Security Module
Dana Neustadter, Vincent van der Leest
Synopsys, Inc.
Creating a Frequency Plan for a System using a PLL
Julian Jenkins
Perceptia Devices
PUF-PQC Integrated with PUFrt to Solve PPA Challenge for SoCs
eMemory & PUFsecurity
eMemory Technology Inc.
From Silos to Systems, from Data to Insight
Keysight Technologies
Security certification and the crucial role of anti-tamper sensor solutions
Chris Morrison
Agile Analog
Beyond the Core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight
Francisca Tan, Senior Product Manager
Siemens EDA
Three Ethernet Design Challenges in Industrial Automation
Key ASIC
ST silicon photonics and BiCMOS technologies: the winning portfolio for AI optical interconnects
STMicroelectronics
AI in VLSI Physical Design: Opportunities and Challenges
Japesh Kumar, Qualcomm
AI-Driven and Traditional Approaches to Accident Scenario Reconstruction
Nitin Swamy
Vayavya Labs
From Theory to the Field: Why Side-Channel Protection Defines Post-Quantum Security
PQSecure Technologies
PCIe 5.0: The universal high-speed interconnect for High Bandwidth and Low Latency Applications Design Challenges & Solutions
Innosilicon Technology Ltd
Search IP
16,000 IP Cores
from 450 Vendors
Special IP Request
Provider List
Asic Technology
Select your target foundry and technology
TSMC
Samsung
GlobalFoundries
SMIC
CSMC
DBHiTek
HHGrace
Intel
LFoundry
Silterra
SkyWater
STMicroelectronics
Tower
UMC
VIS
X-FAB
XMC
Search IP
FPGA and eFPGA Corner
Select your target vendor and device
All
Xilinx AMD
Menta
Altera
Rapid Flex
Rapid Silicon
Microchip
Actel
Efinix
Lattice
Quicklogic
Achronix
Search IP
Today on Design And Reuse
TES Unveils High-Performance 8/40MHz Oscillator and Clock Buffer IPs for Reliable On-Chip Timing Solutions for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
- March 12, 2026
Soitec Secures Multi- Year Agreement to Supply POI Wafers for Skyworks’ Sky5 Platform
- March 12, 2026
BOS Semiconductors’ AI Semiconductor Design Technology for Future Mobility Recognized as National Strategic Technology
- March 12, 2026
Movellus Advanced Clocking IP Selected for QuickLogic’s Strategic Radiation Hardened FPGA Program
- March 12, 2026
GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
- March 12, 2026
CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects
- March 12, 2026
D&R Events
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Register Now >>
IP-SoC EU 25
- December 2
nd
-3
rd
, 2025
Still Open ! Watch Now >>
IP-SoC South Korea 25
- September 16
th
, 2025
Still Open ! Watch Now >>
IP-SoC China 25
- September 11
th
, 2025
Still Open ! Watch Now >>
All News >>
Design Platform and Service
TES Unveils High-Performance 8/40MHz Oscillator and Clock Buffer IPs for Reliable On-Chip Timing Solutions for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
- March 12, 2026
Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC’s
- March 12, 2026
Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development
- March 12, 2026
All News >>
Business
Soitec Secures Multi- Year Agreement to Supply POI Wafers for Skyworks’ Sky5 Platform
- March 12, 2026
BOS Semiconductors’ AI Semiconductor Design Technology for Future Mobility Recognized as National Strategic Technology
- March 12, 2026
EnSilica plc - New Contract Wins and Programme Upgrades
- March 10, 2026
All News >>
Design IP
Movellus Advanced Clocking IP Selected for QuickLogic’s Strategic Radiation Hardened FPGA Program
- March 12, 2026
Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP
- March 5, 2026
Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets
- March 3, 2026
All News >>
Automotive
GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
- March 12, 2026
Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
- March 5, 2026
Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications
- March 5, 2026
All News >>
Audio / Video
Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio
- March 12, 2026
Allegro DVT Launches DWP300 DeWarp Semiconductor IP
- March 12, 2026
Silvaco Announces Immediate Availability of Production Ready Mixel MIPI PHY IP, Strengthening its Comprehensive Silicon IP Offering
- March 12, 2026
All News >>
Security
A CHERI on Top: A Better Way to Build Embedded Secure SoCs
- March 12, 2026
Microservice Store Launches the IoT Transparency Portal: Transparent view of SBOM, and live vulnerability status.
- March 10, 2026
Kudelski Labs Addresses Device Lifecycle Security, Edge AI, Post Quantum Cryptography and Regulatory Compliance at Embedded World 2026
- March 5, 2026
All News >>
Artificial Intelligence
Keysight Debuts Purpose-Built 1.6T Ethernet AI Workload Emulation Platform to Validate Next-Generation AI Fabrics
- March 12, 2026
Axelera® AI Adds Kudelski Labs’ Security IP to Europa® Chip to Enable Secure, High-Performance Edge AI
- March 12, 2026
Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development
- March 12, 2026
All News >>
RISC-V
Samsung to Make Ubitium’s Universal RISC-V Processor
- March 12, 2026
The path to RISC-V growth: Why software consistency is becoming crucial
- March 9, 2026
The Rise of RISC-V
- March 5, 2026
All News >>
Foundry
Samsung Applies 2nm Process to HBM Memory
- March 12, 2026
Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus
- March 9, 2026
Rapidus to Make Chips for Canon, Synopsys on Trial
- March 9, 2026
All News >>
Networking
CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs
- March 12, 2026
Ceva Launches Next-Generation UWB IP with Extended Range and Higher Throughput
- March 10, 2026
CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs
- March 10, 2026
All News >>
Internet of Things
Is Your IoT Strategy Ready for the New Landscape?
- March 9, 2026
Nordic Semiconductor Expands Cellular IoT Portfolio
- March 9, 2026
Microservice Store Launches Security Support Partnership Program
- March 2, 2026
All News >>
Processor
STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
- March 9, 2026
As AI scales, so do CPUs
- March 2, 2026
All News >>
Green Electronics
Infineon and UMC partner in driving decarbonization across the supply chain
- March 5, 2026
All News >>
Chiplet / Multi-Die
GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- February 26, 2026
Siemens wins Best of Show Award for "Packaging: Design" at 2026 Chiplet Summit
- February 23, 2026
Chiplet Summit Announces 2026 Best of Show Award Winners
- February 19, 2026
D&R Events
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
Register Now >>
IP-SoC EU 25
- December 2
nd
-3
rd
, 2025
Still Open ! Watch Now >>
IP-SoC South Korea 25
- September 16
th
, 2025
Still Open ! Watch Now >>
IP-SoC China 25
- September 11
th
, 2025
Still Open ! Watch Now >>
Partner Highlight
❮
❯
Latest News Alerts