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Today on Design And Reuse
Launch of BrainChip Developer Hub Accelerates Event-Based AI Innovation on Akida™ Platform with Release of MetaTF 2.13
- June 22, 2025
True Circuits Introduces the Low-jitter Digital Ultra+ PLL at the Design Automation Conference
- June 20, 2025
CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications
- June 19, 2025
BT Group Joins the CHERI Alliance to Advance Cybersecurity Innovation
- June 19, 2025
Keysight Enables AMD to Showcase Electrical PCI Express® Compliance up to 64 GT/s
- June 19, 2025
CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
- June 19, 2025
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- September 11
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- September 16
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- April 24
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, 2025
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- December 10
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, 2024
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Embedded Processing
Launch of BrainChip Developer Hub Accelerates Event-Based AI Innovation on Akida™ Platform with Release of MetaTF 2.13
- June 22, 2025
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Design IP
True Circuits Introduces the Low-jitter Digital Ultra+ PLL at the Design Automation Conference
- June 20, 2025
CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications
- June 19, 2025
DCD-SEMI Joins MIPI Alliance and Unveils Latest I3C IP at MIPI Plugfest Warsaw 2025
- June 18, 2025
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Security
BT Group Joins the CHERI Alliance to Advance Cybersecurity Innovation
- June 19, 2025
CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits
- June 19, 2025
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- June 16, 2025
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Design Platform
Keysight Enables AMD to Showcase Electrical PCI Express® Compliance up to 64 GT/s
- June 19, 2025
Siemens collaborates with Samsung Foundry on advanced node product certifications and EDA innovation
- June 18, 2025
Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- June 17, 2025
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Business
Nordic Semiconductor accelerates edge AI leadership with acquisition of Neuton.AI
- June 17, 2025
Xylon Celebrates 30 Years of Innovation in Embedded Electronics
- June 17, 2025
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- June 13, 2025
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Foundry
TSMC: King Of Data Center AI
- June 16, 2025
Samsung, TSMC set stage for fierce race in 2nm chip tech
- June 15, 2025
Samsung Foundry Struggles With 3nm Yields at 50% as TSMC Climbs Past 90%
- June 13, 2025
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Green Electronics
Sustainable semiconductor manufacturing - too little too late or Europe protectionism?
- June 16, 2025
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Internet of Things
Nordic Semiconductor to showcase cutting-edge cellular IoT solutions at MWC Shanghai 2025
- June 13, 2025
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Artificial Intelligence
Risks of Lack of Strategy for AI in Supply Chains
- June 13, 2025
Ai drives power management into top ten fabless chip list
- June 13, 2025
UK plans $1bn AI supercomputer
- June 11, 2025
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RISC-V
IAR Platform Accelerates Embedded Development with Updated Toolchains for Arm and RISC-V
- June 10, 2025
Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V
- June 10, 2025
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Audio / Video
IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- June 10, 2025
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- September 16
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- April 24
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- December 10
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, 2024
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