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Today on Design And Reuse
T2M Brings White-Box Licensing to ADC, DAC and PLL IP Cores, High-Performance, Full Modification Rights and Unlimited Usage
- September 14, 2026
Q2 Global Foundry Revenue Up 11.5%: Gap Widens Between TSMC and Samsung
- September 14, 2026
Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems
- September 14, 2026
SkyeChip eyes next growth phase as homegrown IP starts to scale, Kenanga sees royalty potential
- September 14, 2026
Keysight EDA Software Expands Access for European Chip Startups
- September 14, 2026
Arm introduces new AI-native compute platform built for agentic AI and mobile graphics
- September 14, 2026
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Design IP
T2M Brings White-Box Licensing to ADC, DAC and PLL IP Cores, High-Performance, Full Modification Rights and Unlimited Usage
- September 14, 2026
Silvaco Group unveils new MIPI PHY IP for GlobalFoundries 22FDX Plus and 12LP Plus
- September 7, 2026
Cadence Subsystem for PCIe 6.0 Architecture Achieves First-Pass PCI Express Specification Compliance
- September 2, 2026
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Business
Q2 Global Foundry Revenue Up 11.5%: Gap Widens Between TSMC and Samsung
- September 14, 2026
SkyeChip eyes next growth phase as homegrown IP starts to scale, Kenanga sees royalty potential
- September 14, 2026
Keysight EDA Software Expands Access for European Chip Startups
- September 14, 2026
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Artificial Intelligence
Arm introduces new AI-native compute platform built for agentic AI and mobile graphics
- September 14, 2026
Arm unveils Arm AI Portal to accelerate optimized AI apps across the Arm compute platform
- September 14, 2026
OpenAI Samsung collaboration extends to next-generation chips
- September 14, 2026
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RISC-V
Quintauris expands RISC-V ecosystem with new industry partnerships
- September 14, 2026
RISC-V extensions for high performance embedded computing
- September 10, 2026
ChipAgents Helps Andes Technology Dramatically Accelerate Custom Processor Design and Verification
- September 3, 2026
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Chiplet / Multi-Die
Chiplet-Based FPGAs Optimize Performance for Space Applications
- September 14, 2026
Samsung Targets Memory Limits With 3D-Stacked HBM
- September 3, 2026
proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- August 24, 2026
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Foundry
GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions
- September 14, 2026
SMIC Outgrows TSMC and Samsung With 20% Surge, Overtaking GlobalFoundries as World’s Third-Largest Foundry
- September 14, 2026
Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?
- September 14, 2026
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Audio / Video
Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
- September 10, 2026
intoPIX Titanium FPGA SoC EDK Achieves IPMX Certification
- September 2, 2026
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- September 2, 2026
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Security
Altera Adds Post-Quantum Security to Agilex 3 and Agilex 5 FPGAs
- September 10, 2026
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Design Platform and Service
SoC PLANNER: A New Generation of Automated SoC Design Exploration Managing Cost-Effectiveness and Sustainability
- September 10, 2026
Overcoming the thermal barrier in next-generation AI ASICs
- September 7, 2026
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- September 7, 2026
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Networking
EnSilica to open Space and Communications Semiconductor Centre of Excellence in Milan
- September 10, 2026
Ceva and LG Electronics Partner to Accelerate UWB Adoption Across Automotive, Industrial and Consumer SoCs
- September 10, 2026
CAST Introduces 100 Gbps TCP/IP Hardware Stack IP Core for High-Performance ASIC and FPGA Designs
- September 8, 2026
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Automotive
Keysight Collaborates with the Centre for Assuring Autonomy at the University of York to Advance AI Safety Assurance for Software-Defined Vehicles
- September 7, 2026
TIER IV and Renesas target AI-native SDV platform
- August 24, 2026
BOS Semiconductors Tapes Out Automotive AI Accelerator 'Eagle-N'... Begins Evaluation with German and Chinese Automakers
- August 20, 2026
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Internet of Things
Why semiconductors are critical to the future of IoT
- September 7, 2026
LG Electronics Taps Samsung Foundry for AI Home Chips
- September 3, 2026
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eFPGA / FPGA
QuickLogic Unveils Next-Generation eFPGA Hard IP for GlobalFoundries 12LP
- September 2, 2026
D&R Events
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