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Securing SoC Reliability with Precision Power-On Reset IP for 0.8V Industrial Designs
Key ASIC
Satellite communications are no longer as secure as assumed
Xiphera Ltd
Why Post-Quantum Cryptography Doesn’t Replace Classical Cryptography
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Advancing In-Memory Computing: A Global Effort to Build More Efficient AI Hardware
Danny Lipovitch
Weebit Nano
Accelerating Next-Generation EMIB-T Packaging: A Collaboration Between Synopsys and Intel Foundry
Arun Bhattacharya
Synopsys, Inc.
The Architectural Evolution of 16GHz PLLs for Next-Gen AI and SerDes SoCs
Key ASIC
ISE 2026 Recap: IntoPIX Showcases IPMX, JPEG XS, 8K And AI-Powered Workflows
intoPIX
ChiPy®: Bridge Neural Networks and C++ on Silicon — Full Inference Pipelines with Zero CPU Round-Trips
Quadric
Chiplet innovation isn’t waiting for perfect standards
Andy Nightingale
Arteris
Powering the AI Supercycle: Design for AI and AI for Design
Reela Samuel
Cadence Design Systems, Inc.
Advancing High‑Performance Silicon Photonics and Silicon Germanium (SiGe) for the Next Era of Optical Connectivity
Radhika Arora
GlobalFoundries
Synopsys Delivers First Complete UFS 5.0 and M‑PHY v6.0 IP Solution for Next‑Gen Storage
LJ Chen
Synopsys, Inc.
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Beyond the Core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight
Francisca Tan, Senior Product Manager, Tessent Embedded Analytics
Siemens Digital Industries Software
Securing UALink: Introducing Synopsys UALinkSec_200 Security Module
Dana Neustadter, Vincent van der Leest
Synopsys, Inc.
Creating a Frequency Plan for a System using a PLL
Julian Jenkins
Perceptia Devices
PUF-PQC Integrated with PUFrt to Solve PPA Challenge for SoCs
eMemory & PUFsecurity
eMemory Technology Inc.
From Silos to Systems, from Data to Insight
Keysight Technologies
Security certification and the crucial role of anti-tamper sensor solutions
Chris Morrison
Agile Analog
Beyond the Core: Tackling system-wide debugging for complex SoCs with Tessent UltraSight
Francisca Tan, Senior Product Manager
Siemens EDA
Three Ethernet Design Challenges in Industrial Automation
Key ASIC
ST silicon photonics and BiCMOS technologies: the winning portfolio for AI optical interconnects
STMicroelectronics
AI in VLSI Physical Design: Opportunities and Challenges
Japesh Kumar, Qualcomm
AI-Driven and Traditional Approaches to Accident Scenario Reconstruction
Nitin Swamy
Vayavya Labs
From Theory to the Field: Why Side-Channel Protection Defines Post-Quantum Security
PQSecure Technologies
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Today on Design And Reuse
China plan for 80% semiconductor self-sufficiency
- March 30, 2026
GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation
- March 30, 2026
TSMC Widens Market Share Gap with Samsung While Foundry Market Nears $170 Trillion
- March 30, 2026
Weebit Nano announces A$80.0 million Placement
- March 30, 2026
Siemens launches Teamcenter Digital Reality Viewer and Digital Twin Composer in India
- March 30, 2026
Credo Launches 800G ZeroFlap Optical Transceivers Engineered for AI Networks
- March 30, 2026
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- September 11
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Business
China plan for 80% semiconductor self-sufficiency
- March 30, 2026
GlobalFoundries Files Patent Infringement Lawsuits Against Tower Semiconductor to Protect High-Performance American Chip Innovation
- March 30, 2026
TSMC Widens Market Share Gap with Samsung While Foundry Market Nears $170 Trillion
- March 30, 2026
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Networking
Credo Launches 800G ZeroFlap Optical Transceivers Engineered for AI Networks
- March 30, 2026
Keysight Introduces New 224G Test Solutions to Enable 1.6T Optical Network Validation
- March 16, 2026
CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs
- March 12, 2026
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Security
Security IP Market Accelerates as OEM Demand for Integrated, Certification-Ready Components Surges
- March 30, 2026
TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
- March 26, 2026
Jmem Tek Joins GlobalFoundries Ecosystem to Expand Post-Quantum Security Solutions
- March 23, 2026
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Artificial Intelligence
Altera and Arm Collaborate to Deliver Efficient, Programmable Solutions for AI Data Centers
- March 30, 2026
Innatera Launches Synfire to Unify the Neuromorphic Ecosystem and Accelerate Real-World Edge AI Deployment
- March 30, 2026
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Design Platform and Service
Arm expands compute platform to silicon products in historic company first
- March 30, 2026
Siemens launches Teamcenter Digital Reality Viewer and Digital Twin Composer in India
- March 26, 2026
Verification Engineers Are Poised to Become Verification Scientists
- March 26, 2026
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RISC-V
Switzerland is at the centre of a quiet rebellion in chip design
- March 30, 2026
Alibaba delivers RISC-V server chip optimized to run China’s top AI models
- March 26, 2026
Reliable performance with RISC-V: Why architecture, microarchitecture and compilers must work together
- March 26, 2026
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Processor
Synopsys Supports New Arm AGI CPU with Full-Stack Design Solutions
- March 26, 2026
STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
- March 9, 2026
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Design IP
Faraday Highlights 40nm SONOS eNVM as NOR Flash Alternative for MCU Designs
- March 26, 2026
Movellus Advanced Clocking IP Selected for QuickLogic’s Strategic Radiation Hardened FPGA Program
- March 12, 2026
Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP
- March 5, 2026
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Chiplet / Multi-Die
Scoping out the chiplet-based design flow
- March 26, 2026
Chiplets: 8 best practices for engineering multi-die designs
- March 26, 2026
Faster and more energy-efficient electronics with 3D chip design
- March 16, 2026
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Foundry
CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line
- March 26, 2026
IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes
- March 16, 2026
Samsung Applies 2nm Process to HBM Memory
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Automotive
Arteris Network-on-Chip IP Deployed in Renesas’ Next-Gen R-Car Automotive Technology
- March 24, 2026
GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
- March 12, 2026
Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
- March 5, 2026
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Audio / Video
CAST Introduces PDM-to-PCM IP Core for Easy Interfacing of Digital Microphones with SoCs
- March 24, 2026
Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio
- March 12, 2026
Allegro DVT Launches DWP300 DeWarp Semiconductor IP
- March 12, 2026
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Internet of Things
Is Your IoT Strategy Ready for the New Landscape?
- March 9, 2026
Nordic Semiconductor Expands Cellular IoT Portfolio
- March 9, 2026
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Green Electronics
Infineon and UMC partner in driving decarbonization across the supply chain
- March 5, 2026
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- September 11
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, 2025
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