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Today on Design And Reuse
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
- February 11, 2026
Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
- February 11, 2026
RISC-V IP Core: T2M to Present Production-Proven RISC-V IP Core at Mobile World Congress, 2026
- February 9, 2026
Record quarter for Arm
- February 9, 2026
European firms eye investments in finance, semiconductors, AI in Vietnam
- February 9, 2026
STMicroelectronics expands strategic engagement with Amazon Web Services to enable new high performance compute infrastructure for cloud and AI data centers
- February 9, 2026
D&R Events
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- April 23
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, 2026
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- December 2
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- September 16
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, 2025
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- September 11
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, 2025
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Business
Ceva Wi-Fi 6 and Bluetooth IPs Power Renesas’ First Combo MCUs for IoT and Connected Home
- February 11, 2026
Record quarter for Arm
- February 9, 2026
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- February 9, 2026
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Artificial Intelligence
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- February 11, 2026
Keysight and Point2 Technology Collaborate to Advance Next-Generation AI Scale-Up Interconnects
- February 5, 2026
Siemens acquires Canopus AI to bring AI-based metrology to semiconductor manufacturing
- February 5, 2026
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RISC-V
RISC-V IP Core: T2M to Present Production-Proven RISC-V IP Core at Mobile World Congress, 2026
- February 9, 2026
Fabless Startup Aheesa Tapes Out First Indian RISC-V Network SoC
- February 9, 2026
Phison Selects Andes RISC-V Cores for its First aiDAPTIV+ AI Solution, Marking a Major Milestone in AI Architecture
- February 9, 2026
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Green Electronics
Biodegradable PCB targets short-lifetime electronics
- February 9, 2026
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- January 15, 2026
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Security
Siemens unveils virtualised substation protection platform
- February 9, 2026
EnSilica joins CHERI Alliance to boost chip security
- February 9, 2026
Microservice Store Announces Security Manager (iSM) for Embedded Systems
- January 26, 2026
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Design Platform
FAMES pilot line inaugurated after delivering first validated semiconductor results
- February 9, 2026
Indian Chip Design Services Provider Mirafra Tapes Out 22-nm SoC
- February 2, 2026
Keysight’s Machine Learning Toolkit to Speed Device Modeling and PDK Dev
- February 2, 2026
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Chiplet / Multi-Die
Chiplets Get Physical: The Days of Mix-and-Match Silicon Draw Nigh
- February 9, 2026
Chiplets Reach an Architectural Turning Point – Menta at Chiplet Summit 2026
- February 5, 2026
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Foundry
GF partners with Telsys to expand Israel presence
- February 9, 2026
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- February 9, 2026
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- February 5, 2026
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Design IP
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- February 9, 2026
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- February 9, 2026
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Automotive
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- February 4, 2026
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- February 2, 2026
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- January 19, 2026
D&R Events
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- April 23
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- December 2
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, 2025
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IP-SoC South Korea 25
- September 16
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- September 11
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, 2025
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