Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter

MILPITAS, Calif. — September 10, 2019 — Worldwide semiconductor manufacturing equipment billings reached US$13.3 billion in the second quarter of 2019, down 20 percent from the same quarter of 2018 and 3 percent from than the previous quarter, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 80 global equipment companies that provide data on a monthly basis.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

	2Q2019	1Q2019	2Q2018	2Q19/1Q19 (Qtr-over-Qtr)	2Q19/2Q18 (Year-over-Year)
China	3.36	2.36	3.79	43%	-11%
Taiwan	3.21	3.81	2.19	-16%	47%
Korea	2.58	2.89	4.86	-11%	-47%
North America	1.70	1.67	1.47	2%	15%
Japan	1.38	1.55	2.28	-11%	-39%
Europe	0.57	0.84	1.18	-32%	-52%
Rest of World	0.51	0.67	0.96	-24%	-47%
Total	13.31	13.79	16.74	-3%	-20%

Source: SEMI (www.semi.org) and SEAJ, September 2019

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About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more.