SMSC and TransDimension Team to Achieve First USB-IF Certification of ULPI Controller and Transceiver

HAUPPAUGE, N.Y. & IRVINE, Calif. -- (BUSINESS WIRE) -- Nov. 5, 2004 -- SMSC (Nasdaq: SMSC), a leading semiconductor company delivering innovative system solutions spanning analog, digital and mixed-signal technologies, and TransDimension, a leading provider of USB connectivity solutions for embedded applications, today announced the successful completion of high-speed USB compliance testing of the industry's first controller/transceiver solution utilizing the new UTMI+ Low Pin Interface (ULPI).

TransDimension's high-speed USB controller IP, a ULPI interface block, and SMSC's USB3300 ULPI stand-alone physical layer transceiver (PHY), are the first products to pass the high-speed USB Implementers Forum (USB-IF) compliance testing using the new ULPI interface. ULPI modifies the well-known UTMI+ link/PHY interface to significantly reduce the pin count for discrete USB transceiver implementations supporting host, device and On-The-Go (OTG) functionality. This low pin count interface allows for transceivers to be kept separate from the associated digital ASICs as the technology nodes become smaller and integrating the PHY becomes more complex and expensive.

"Achieving this high-speed USB certification with SMSC not only demonstrates our ongoing dedication to interoperability with other USB products on the market, but also demonstrates that solid, proven solutions will exist to ease the complexity of future SoC developments," said John Cassidento, IP Marketing Manager at TransDimension. "By implementing external PHYs with a proven, low pin count interface such as ULPI, SoC manufacturers will be able to keep this difficult analog technology out of their designs and thus lower risk and improve time-to-market. We are proud to have SMSC as a proven, certified partner for our high-speed IP."

"We are very excited to complete this significant milestone and announce the market's first ULPI PHY to pass USB-IF compliance testing," said Steve Nelson, Vice President of Marketing - Connectivity Solutions at SMSC. "As we ramp production of the USB3300, we will deliver significant cost and time-to-market benefits to ASIC and SoC designers for a broad range of portable consumer electronics applications. Partnering with TransDimension has significantly accelerated interoperability testing between the USB3300 and TransDimension's ULPI Link, resulting in a ULPI solution that is ready to support customers developing broad-based ASIC and SoC solutions."

The USB3300 is SMSC's third generation high-speed USB stand-alone PHY and the first that utilizes the low pin count ULPI interface. Today's product announcement expands SMSC's USB2.0 PHY family, which includes the GT3200 and USB3250 UTMI PHYs. Delivering the industry's smallest packaging, the USB3300 is available in a 5mm x 5mm x 0.9mm 32-pin QFN package. Leveraging reductions in footprint, profile, pin count and current consumption, the USB3300 is ideal for the portable handheld electronics market including devices such as digital still cameras, PDAs, cell phones and MP3 players.

Pricing & Availability: General samples and production quantities of the SMSC USB3300 will be available in the first quarter of 2005. Pricing will be $2.00 per unit (U.S. list price) in 10K quantities. TransDimension's high-speed link IP blocks are available today. Pricing is available upon request.

About USB Implementers Forum (USB-IF) Compliance Workshop

The USB-IF Compliance Workshop provides a forum for the leading USB OTG integrators to meet and perform supervised testing of OTG dual-role devices against OTG electrical and protocol compliance programs. Designed to complement the specification and enable measurement of compliance in real products, the USB-IF has instituted a compliance program that provides rigorous measures of acceptability. Products that pass this level of acceptability are added to the Integrators List and have the right to license the USB-IF logo.

About TransDimension

Headquartered in Irvine, California, TransDimension is a privately held company founded in 1997 to develop and market solutions targeting peripheral connectivity. TransDimension's product lines include the integrated circuits, IP cores and USB software stacks that enable direct connectivity for a wide range of PC peripheral applications and mobile devices. Until now, these products have required an indirect means, such as a PC host, for exchanging data. TransDimension's SoftConnex USB software is a complete software solution for USB, including the broadest OS and CPU platform support and the largest library of peripheral class drivers available. More information about TransDimension can be found at http://www.transdimension.com.

About SMSC

Many of the world's most successful global technology companies rely upon SMSC as a go-to resource for integrated circuits and semiconductor system solutions that span analog, digital and mixed-signal technologies. SMSC delivers products that solve the challenges of space, cost and time-to-market for high-speed computing, connectivity and embedded networking applications.

SMSC addresses computing, communications and consumer electronics markets through world-leading positions in Input/Output and non-PCI Ethernet products; innovations in USB2.0 and other high-speed serial solutions; and integrated networking products employed in a broad range of applications. Leveraging substantial intellectual property and a comprehensive global infrastructure, SMSC thrives at the intersection of silicon, software and customized OEM applications. SMSC is based in Hauppauge, New York with operations in North America, Taiwan, Japan, Korea, China and Europe. Engineering design centers are located in Arizona, New York and Texas. Additional information is available at www.smsc.com.

Forward Looking Statements:

Except for historical information contained herein, the matters discussed in this announcement are forward-looking statements about expected future events and financial and operating results that involve risks and uncertainties. These include the timely development and market acceptance of new products; the impact of competitive products and pricing; the effect of changing economic conditions in domestic and international markets; changes in customer order patterns, including loss of key customers, order cancellations or reduced bookings; and excess or obsolete inventory and variations in inventory valuation, among others. Such statements are qualified in their entirety by the inherent risks and uncertainties surrounding future expectations and may not reflect the potential impact of any future acquisitions, mergers or divestitures.

SMSC competes in the semiconductor industry, which has historically been characterized by intense competition, rapid technological change, cyclical market patterns, price erosion and periods of mismatched supply and demand. In addition, sales of many of the Company's products depend largely on sales of personal computers and peripheral devices, and reductions in the rate of growth of the PC, consumer electronics and embedded markets could adversely affect its operating results. SMSC conducts business outside the United States and is subject to tariff and import regulations and currency fluctuations, which may have an effect on its business. All forward-looking statements speak only as of the date hereof and are based upon the information available to SMSC at this time. Such information is subject to change, and the Company may not necessarily inform, or be required to inform, investors of such changes. These and other risks and uncertainties, including potential liability resulting from pending or future litigation, are detailed from time to time in the Company's reports filed with the SEC. Investors are advised to read the Company's Annual Report on Form 10-K and quarterly reports on Form 10-Q filed with the Securities and Exchange Commission, particularly those sections entitled "Other Factors That May Affect Future Operating Results" for a more complete discussion of these and other risks and uncertainties.

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