DR SoC News Alert
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December 9, 2003    


Welcome to issue of December 9, 2003 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

NEW ON D&R WEB SITE

SOI (Silicon on Insulator) Corner: Visit this new corner highlighting the benefits of Silicon On Insulator technology. In Cooperation with SOISIC

AES Co-processor from Jennic
AMBA 2.0 compliant DMA Controller from Global UniChip
Dual MAC 16-bit fixed point DSP from Ceva, Inc
USB2.0 PHY FS/HS 3.3/1.8/1.8 UTMI on SMIC 0.18um Digital CMOS process from ChipIdea Microelectronics
AHB Hardware Protocol Kit automatically creating properties and environment for AHB from TransEDA
Configurable UART with FIFO functionally identical to the TL16C750 from Digital Core Design
Wanted IPs :
  • 1394a and 1394b Analog PHY
  • Audio IPs (AC97 & IIS)
  • A Layered Verification Approach Applied to an AMBA-Based System
    Faster serdes links force system view
    Breakfast in the Valley: Who Owns the IP?
    Implementing IKE Capabilities in FPGA Designs
    Multiband-OFDM Alliance seeks to lift UWB licensing clouds
    Analog IP from LTrim Technologies rolls for TSMC processes
    Actel Enhances Libero Tool Suite to Boost Performance and Support for ProASICPLUS FPGAs
    Altera HardCopy Devices Speed Development of New Motorola Horizon II BTS Portfolio
    Faraday adopts Cadence Encounter Platform for Structured ASIC design
    Xilinx Unveils Revolutionary FPGA Architecture, Enables Next-Generation Platform FPGAs
    Tower Semiconductor standardizes on TriCN's interface IP
    AMI Semiconductor Integrates 8051 Core and I3T- based SoC Enabling Reduced Component Count Designs
    ParthusCeva Changes Name to CEVA, Inc.
    CEVA Announces Launch And Licensing Of Pioneering CEVA-X DSP Architecture
    Actel's Advanced Packaging Technology Delivers High-Density, Programmable Alternative to Known Good Die
    Fujitsu/Fujitsu VLSI adopts Legend Design Technology's CharFlo-Memory! Toolset for Memory Characterization
    Actel’s Protocol Design Services Group Selects HelloSoft’s Wireless LAN IP
    ARC International plc announces the resignation and departure from his position with immediate effect of Mike Gulett, Chief Executive Officer
    DCM Technologies announces availability of IEEE802.11 Mulitmode MAC on the Accelerated Technology Nucleus Plus Kernel
    HelloSoft Introduces Industry’s First Fully Customizable Wireless LAN IP Solution
    Townshend Intellectual Property LLC claims legal victory over ADI in modem suit
    NewLogic Releases its Embeddable Wireless LAN 802.11g Modem IP Core
    New ARM9E Family Core Provides Unrivalled Low-Power Performance
    LG Electronics Picks Tensilica’s Xtensa Processor For the Digital Multimedia Broadcasting Project of the Korean Government
    High-Density Packaging Solution Further Extends Actel's Reach Into Space and Military Markets
    StarCore LLC Secures Third Round of Funding
    CoWare Advances Design of Ultra Wideband (UWB) Wireless Networking Products With Library Support Through Its Signal Processing Worksystem (SPW)

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    SOI (Silicon on Insulator) Corner: Visit this new corner highlighting the benefits of Silicon On Insulator technology. In Cooperation with SOISIC


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