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PoV on Understanding the Shift Towards Chiplet Architecture in SoC Design
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Cadence and Toyota Advance Automotive Simulation on NVIDIA AI Infrastructure
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Addressing chip design challenges with ADCs
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When AI Moves the World: Building a Chiplet Standard for Physical AI
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Mastering Semiconductor Chip Design: Tools, Techniques, and Best Practices
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Trusted AI Agents Must Be Anchored in Silicon
eMemory Technology Inc.
Articles
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Directory-Based Coherency at Scale: From 8 Cores to 256 Agents
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Clock Domain Crossing Sign-Off with Microarchitecture Analysis: 20X Better Precision
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Multiple neuromorphic chips, one grid, no new middleware
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Harnessing the power of AMBA CHI: The Protocol Powering Modern CPU Clusters
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Why Open-Source Software Is Essential in the Software-Defined Vehicle Era
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Detect, Diagnose, and Debug using Sensors and Functional Monitoring
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Practical AI Silicon on Mainstream Node using LPDDR
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From Specification to Silicon: Using PUFrt to Address Caliptra Root of Trust Integration Challenges
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Cache Coherency 101: Why It Matters in Multi-Core SoCs
Signature IP Corporation
Why SoC Interconnects Have Outgrown the Bus
SignatureIP Engineering Team
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Today on Design And Reuse
Samsung targets 2nm M2800 as Qualcomm evaluates its foundry
- October 26, 2026
Samsung Prepares Next-Gen 8nm Foundry Technology with Major Improvements
- October 26, 2026
UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
- October 26, 2026
Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI
- October 26, 2026
Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness
- October 26, 2026
Agnisys and Axiomise Collaborate to Accelerate NoC Design and Formal Sign-off
- October 26, 2026
D&R Events
IP-SoC EU 26
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, 2026
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IP-SoC South Korea 26
- September 15
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, 2026
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IP-SoC China 26
- September 10
th
, 2026
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IP-SoC Silicon Valley 26
- April 23
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, 2026
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Foundry
Samsung targets 2nm M2800 as Qualcomm evaluates its foundry
- October 26, 2026
Samsung Prepares Next-Gen 8nm Foundry Technology with Major Improvements
- October 26, 2026
UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
- October 26, 2026
All News >>
Design Platform and Service
Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI
- October 26, 2026
Synopsys at NVIDIA GTC Berlin: Delivering Engineering Precision with Speed
- October 22, 2026
Cadence AI Super Agents Enable Nokia to Accelerate Electronic System Design on Millennium M2000 Supercomputer
- October 22, 2026
All News >>
Chiplet / Multi-Die
Tenstorrent Releases Open Source Beta of the Open Chiplet Atlas® (OCA) Harness
- October 26, 2026
Agnisys and Axiomise Collaborate to Accelerate NoC Design and Formal Sign-off
- October 26, 2026
Taiwan's Egis, France's SiPearl team up on chiplet CPU
- October 26, 2026
All News >>
RISC-V
Sound Ecosystem and Scenario Breakthroughs: Seven Sub-forums of RISC-V China Summit Jointly Explore New AI Opportunities
- October 26, 2026
Qualcomm buys RISC-V startup Akeana to push into AI and data-center chips
- October 22, 2026
Tenstorrent at The Open Frontier: RISC-V Everywhere
- October 19, 2026
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Artificial Intelligence
BrainChip Unveils AKD1500 SPI Chip, Bringing Neuromorphic AI to Everyday Edge Devices
- October 26, 2026
Processor IP brings generative AI to edge devices
- October 26, 2026
Cadence Unveils Europe's First Sovereign AI Platform for Semiconductor, System and AI Factory Design in Collaboration with NVIDIA
- October 22, 2026
All News >>
Security
Embedded Security Market Advances as Fraunhofer Validates 22 nm RISC-V Secure Element for Next-Generation Connected Devices
- October 26, 2026
PUFsecurity secures OCP SAFE approval for PUFrt semiconductor IP
- October 22, 2026
Codebat Publishes Development Timeline for Its NIST CAVP-Validated ML-DSA Hardware Engine
- October 20, 2026
All News >>
Audio / Video
Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release
- October 26, 2026
intoPIX to Demonstrate JPEG XS, IPMX and SMPTE ST 2110 Solutions at NAB Show New York 2026
- October 15, 2026
Faraday Powers Intelligent Sensing with New 14nm MIPI C/D Combo PHY IP
- October 13, 2026
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Business
After TSMC, Samsung Is Also Reportedly Planning To Hike Chip Prices Amid Demand Surge Fueled By Nvidia, Apple, Tesla And Others
- October 26, 2026
Japan govt to invest extra 400 billion yen in Rapidus
- October 26, 2026
Qualcomm Wins Key Claims Against Arm, but Damages Total Just $2
- October 22, 2026
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Design IP
Silicon-Proven 112G SerDes IP Core with WhiteBox Licensing for China's AI and Networking Market
- October 26, 2026
TES Electronic Solutions Introduces a Low-Power 32 kHz Pierce Oscillator IP for Battery-Powered ASICs and SoCs
- October 1, 2026
eMemory Recognized with TSMC Open Innovation Platform® (OIP) Partner of the Year Award for IP Solutions
- September 29, 2026
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Automotive
DAMO Academy's XuanTie E908A Is an Automotive RISC-V CPU IP Aimed at ASIL-B and ASIL-D Designs
- October 22, 2026
ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
- October 8, 2026
All News >>
Networking
Taming the AI Training Beast: Why Ethernet Will Write the Next Chapter of AI
- October 22, 2026
Silicon-Proven Bluetooth® 6.3 RF IP Cores for Next-Generation Advanced Wireless SoCs - T2M
- October 5, 2026
All News >>
Processor
Intel Refers to its 3D V-Cache Analog as "BFC"
- October 15, 2026
All News >>
eFPGA / FPGA
QuickLogic Secures Six-Figure eFPGA IP Contract for Automotive Industrial SoC
- October 13, 2026
D&R Events
IP-SoC EU 26
- December 8
th
-9
th
, 2026
Registration Open >>
IP-SoC South Korea 26
- September 15
th
, 2026
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IP-SoC China 26
- September 10
th
, 2026
Now Open !!! >>
IP-SoC Silicon Valley 26
- April 23
rd
, 2026
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