Qualcomm Introduces the World's Most Advanced Mobile Microprocessor
London — November 08, 2005 — QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced the new “Scorpion”™ mobile microprocessor delivering unsurpassed computing performance for wireless devices. The Scorpion core is the first microprocessor to be specifically designed and optimized for integration into the Company’s Mobile Station Modem™ (MSM™) solutions, and enables the convergence of mobile handsets with consumer electronics features by delivering superior performance and reduced power demands in mobile environments.
“QUALCOMM’s partnership with ARM as the first architecture licensee of the ARMv7 instruction set brings a new dimension to the ARM technology-compliant processor portfolio for mobile applications,” said Warren East, chief executive officer of ARM. “We look forward to seeing our joint efforts continue to enable new wireless devices with advanced data processing capabilities.”
“The integration of the Scorpion microprocessor brings an unsurpassed 1 GHz of performance and efficiency to QUALCOMM’s MSM solutions and makes it ideally suited for the next generation of the Company’s chipsets,” said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. “QUALCOMM’s long-standing leadership in the wireless market and our expansion into the microprocessor industry with the development of Scorpion enable a highly optimized solution designed for the world’s most advanced mobile devices.”
The Scorpion microprocessor provides a superior power-to-performance ratio, enabling next-generation mobile handsets to deliver processing power comparable to many of today’s personal computers. Possessing up to 1 GHz of processing speed, the Scorpion core provides up to eight times the performance of existing MSM solutions. The microprocessor features a sophisticated micro-architecture and advanced power management and circuit design techniques. The companion multimedia coprocessor to Scorpion implements ARM NEON™ technology to provide an additional 8 billion operations per second for added multimedia capabilities, a key requirement for next-generation advanced mobile devices.
QUALCOMM’s previous solutions are based on a core implementation license from ARM®, a leading technology provider for advanced digital products. The expansion of the relationship between the two companies to include an architectural license has enabled the creation of the ARMv7 architecture-compliant Scorpion microprocessor, with an industry-proven instruction set, that is fully customized and specifically designed for QUALCOMM’s MSM solutions. The Scorpion solution includes wireless-specific features that make the microprocessor extremely well-suited to mobile environments, while dynamic voltage scaling and dynamic clock scaling deliver twice the efficiency of ARM11™ family-based solutions. The Scorpion microprocessor uses 65 nanometer (nm) low-power, low-leakage technology and a number of leading-edge design approaches to deliver optimized power consumption and enable longer battery life of wireless devices.
QUALCOMM plans to announce the MSM platforms and products that will use Scorpion in 2006. For more information about the Scorpion microprocessor, please visit www.cdmatech.com/scorpion.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2005 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
|
Related News
- Qualcomm Unveils World's Most Advanced Commercial Multimode 5G Modem to Accelerate Global 5G Rollout
- CEVA Introduces the World's Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity
- Imagination Technologies and Sharp Demonstrate the World's Most Advanced Multi-Standard Mobile TV Module at MWC 2008
- Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity
- Synopsys Introduces the Industry's First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |