Design Reuse
Search EETimes
Silicon IP Verification IP Software IP Wanted IP !!! Free Download IP Analytics (Restricted Access) FPGA Board / Kit Design Services Foundries Main IP/SoC Products Embedded Systems Design Platform / Structured ASIC Foundries FPGA / CPLD Fabless / IDM Deals Legal Business Financial Results People ESL Design Commentary / Analysis Main Silicon IP / SoC Verification IP FPGA / CPLD Embedded Systems Design Platform / Structured ASIC ESL Design ESL Design Standards & Best Practice Structured ASIC Verification IP Main On Cores Embedded Systems EDA Tools IP Cores Tool Demos D&R Partners Research / Market Reports Events Calendar Webcasts / Podcasts Online Bookstore


LSI Logic Announces Cached DSP Cores for Innovative Wireless, Voice and Multimedia Systems


Related News

Related

Breaking News

Most Popular (Updated Daily)

New Cores Featuring Cached Memory Offer Increased Design Flexibility

MILPITAS, Calif. -- Feb. 14, 2006 -- LSI Logic Corporation (NYSE: LSI) today announced the ZSP410, ZSP520 and ZSP560 additions to its family of ZSP(R) licensable digital signal processor (DSP) cores. Featuring cached memory, the new cores provide designers greater flexibility in choosing how to distribute instructions and data between on-chip and external memory, enabling them to implement more robust ASICs and System-on-Chip (SoC) designs. For applications such as IP phones, ATA modules, portable media players and 2/2.5/3G handsets, large programs can be managed with greater efficiency by storing most of the program code and data off-chip providing additional benefit in the form of chip cost savings.

Compatible with LSI ZSP400, ZSP500 and ZSP540 cores, the new ZSP cores are also supported by a broad selection of applications software* for voice, video and audio applications, making them ideal for the networking, imaging and audio markets. Voice software tailored for the cores includes all of the popular G.7XX Codecs, as well as algorithms for functions such as echo cancellation, tone detection and caller ID generation. Multiple audio and video standards are supported as well, such as H.264, MP3, AACPlus, WMA and AC3.

"The LSI ZSP cores are recognized and proven embedded DSP technology for telephony, audio, video and wireless applications, as well as emerging markets such as voice over WiFi and 3G," said Prasad Kalluri, senior director, DSP Product Division, LSI Logic. "Our new cores expand our system-level solutions by providing a flexible memory architecture that enables designers to create innovative products while managing the cost, performance and power consumption trade-offs that are critical for today's designs."

Availability

The ZSP410 core is available immediately. The ZSP520 core and ZSP560 core availability is currently limited to strategic engagements, with general availability in August. All cores are offered as synthesizable IP blocks. The cores are also supported by an extensive array of third-party software development and hardware development products and capabilities through the ZSP Solution Partner Program ( http://www.zsp.com/partners/ ).

* Products implementing certain standards may be subject to third party patent rights. The purchase of such products does not, by itself, convey a license or right under the third party patents. Purchaser must obtain a separate license from the appropriate patent owner.

About LSI Logic Corporation

LSI Logic Corporation is a leading provider of silicon-to-system solutions that are used at the core of products that create, move and store digital information. LSI offers a broad portfolio of capabilities including custom and standard product ICs, host bus and RAID adapters, storage area network solutions and software applications. LSI products enable leading technology companies in the Consumer, Communications and Storage markets to deliver some of the most advanced and well-known electronic systems in the market today. More information is available at www.lsi.com.




   

Contact LSI Logic Corp.

Fill out this form for contacting a LSI Logic Corp. representative.

Your Name:
Your E-mail address:
Your Company address:
Your Phone Number:
Write your message:
   

 



E-mail This Article Printer-Friendly Page