Sony Renews and Updates License for Tensilica's Xtensa LX2 Configurable Processor
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Significant Hardware Development Cost Savings Realized by Epson from Increased Use of Processors
Yokohama, JAPAN – January 30, 2007 – Tensilica, Inc. today announced that Sony Corporation has renewed and updated its license for Tensilica’s Xtensa LX2 configurable processor.
“Sony’s engineers realize the value of using a configurable processor to lower power and significantly improve performance in hand-held, battery powered devices,” stated Chris Rowen, Tensilica’s president and CEO. “We expect the Xtensa LX2 processor core will be used in designing Sony’s future consumer product and look forward to working with them on their next-generation design projects.”
About Sony Corporation
Sony Corporation is a leading manufacturer of audio, video, game, communications, key device and information technology products for the consumer and professional markets. With its music, pictures, computer entertainment and on-line businesses, Sony is uniquely positioned to be the leading personal broadband entertainment company in the world. Sony recorded consolidated annual sales of approximately $64 billion for the fiscal year ended March 31, 2005. Sony Global Web Site: http://www.sony.net.
About Tensilica
Tensilica offers the broadest line of full designer configurability with the Xtensa processor family and controller, CPU, and specialty DSP processors on the market today, in an off-the-shelf format via the Diamond Standard Series cores. Tensilica’s low-power, benchmark-proven processors have been designed into high-volume products at industry leaders in the digital consumer, networking, and telecommunications markets. All Tensilica processor cores are complete with a matching software development tool environment, portfolio of system simulation models, and hardware implementation tool support. For more information on Tensilica’s patented approach to the creation of application-specific building blocks for SOC design, visit www.tensilica.com.
|
Related News
- Two Korean Universities License Tensilica's Xtensa Configurable Processor
- Neterion Renews Tensilica Xtensa LX Configurable Processor License
- Tensilica Licenses IBM CoreConnect Bus To Enable Xtensa Processor 'Plug and Play' in IBM SOCs; Tensilica Becomes First Configurable IP Vendor to License CoreConnect Bus
- WiLinx Licenses Tensilica's Xtensa LX2 Processor Core For Low-Power UWB Chips
- Tensilica Licenses Xtensa LX2 Configurable Processor to Marvell
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |