Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Sonics OCP Library for Verification Now Shipping
MILPITAS, Calif. -- October 23, 2008 -- Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, today announced the general availability of the Sonics OCP Library for Verification (SOLV). Core designers are using the SOLV package for debugging, performance tuning and validation of complex intellectual property (IP) cores using OCP interfaces.
The SOLV package includes Sonics SVA OCP Checker, OCP disassembler (ocpdis2) and OCP performance analyzer (ocpperf2). Together, this suite of tools enable validation of OCP socket interfaces and the analysis of their performance.
The Sonics SVA OCP Checker validates OCP sockets for protocol compliance during simulation and generates OCP trace files for use by post-processing tools. The tool enables users to quickly and efficiently identify OCP protocol violations at each socket. Full OCP protocol compliance checking ensures that the macro blocks interconnected are free from communication defects. The checker supports the full set of protocol compliance checks as defined by the OCP-IP community.
The OCP disassembler (ocpdis2) allows the display of OCP connection activity in a convenient, readable, report format. The data captured during simulation can be used to understand traffic conditions in the design.
The ocpperf2 processes ocpdis2-produced trace files to measure the performance of OCP transfers and burst transactions. Using this information, a designer can individually tune OCP socket performance to balance the on-chip traffic for any given application.
“Sonics is committed to helping our customers improve the quality and performance of their designs,” said Ray Brinks, vice president of engineering at Sonics, Inc. “SOLV addresses universal needs of core designers. We are seeing a large interest in this package across vertical industries.”
“The issues and challenges surrounding verification in multicore design are many, and from its inception OCP has been designed and evolved to ease some of these challenges,” said Ian Mackintosh president and chairman of OCP-IP. “We are extremely pleased to see Sonics leverage its extensive expertise to assist OCP users increasing the quality and performance of their designs.”
About Sonics
Sonics Inc. supplies critical semiconductor intellectual property for SoCs. Its customers see the benefits of high design predictability and increased design efficiency. Sonics solutions address the growing complexity found in consumer products with voice, data and video features. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba leverage Sonics’ technology in leading products in the wireless, digital multimedia and communications markets. For more information, see www.sonicsinc.com.
|
Related News
- Verification Library Accelerates OCP System Designs
- OCP-IP Announces Availability of Mentor Graphics CheckerWare Library of Verification IP
- Qualis and Sonics Partnership Produces OCP-Compliant Domain Verification Component
- Imperas releases new updates, test suites, and functional coverage library to support the rapid growth in RISC-V Verification
- Imperas leads the RISC-V verification ecosystem as the first to release an open-source SystemVerilog RISC-V processor functional coverage library
Breaking News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |