Drop in Semiconductor Investment Signals Soft Semiconductor Market
SAN JOSE, Calif. (November 3, 2008) – The Global Semiconductor Alliance (GSA) has released its Q3 2008 Semiconductor Funding, IPO and M&A Report. This comprehensive quarterly report includes detailed trend analysis, regional breakdowns and end-market breakdowns of semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) data for fabless companies, integrated device manufacturers (IDMs), semiconductor suppliers and solar suppliers.
The report findings confirm the observation that venture capitalists are investing less in fabless and IDM companies because of higher design costs and consolidation, with the number and value of fabless and IDM funding deals decreasing for two consecutive quarters. In Q3 2008, 21 fabless and IDM companies raised $231.6 million, a dollar amount decrease of 44 percent quarter-over-quarter (QoQ) and 57 percent year-over-year (YoY). The total number of fabless and IDM transactions closed in Q3 2008 decreased 13 percent QoQ and 45 percent YoY.
When analyzing M&As involving fabless and IDM companies, the volume and value of announced deals accounted for 55 percent and 34 percent of the overall Q3 2008 semiconductor M&A total, respectively.
Key statistics from the report include:
-
Thirty-five semiconductor companies (i.e., fabless companies, IDMs, semiconductor suppliers and solar suppliers) raised $511.7 million in Q3 2008, a dollar amount decrease of 4% QoQ and 36% YoY. The total number of semiconductor deals closed in the quarter decreased 10% QoQ and 44% YoY.
-
As a result of the weak economy and the increased cost and time required to go public, for the third consecutive quarter, the semiconductor IPO market, which includes fabless/IDM companies, semiconductor suppliers and solar suppliers, saw no venture-backed companies go public. However, one semiconductor company did file in Q3 2008 – Avago Technologies.
-
For the third consecutive quarter, M&A activity continued to decrease with 31 semiconductor M&As (i.e., M&As involving a fabless company, IDM or semiconductor supplier) – a decrease of 11% QoQ, but a 15% increase YoY.
Availability
The report is complimentary to GSA members and can be accessed by visiting: http://www.gsaglobal.org/publications/fundings/index.asp.
Non-members can purchase the report for $300 through GSA’s online store.
About GSA:
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org
|
Related News
- Achronix FPGAs Add Support for Bluespec's Linux-capable RISC-V Soft Processors to Enable Scalable Processing
- indie Semiconductor Announces Strategic Investment in AI Processor Leader Expedera
- Biden-Harris Administration Announces Preliminary Terms with Intel to Support Investment in U.S. Semiconductor Technology Leadership and Create Tens of Thousands of Jobs
- Global Semiconductor Sales Decrease 8.2% in 2023; Market Rebounds Late in Year
- Semiconductor Market: Rebound Expected in 2024, But Challenges Lie Ahead
Breaking News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |