Chips&Media to Demonstrate High-definition Video Encoding Technology at MWC 2009
About Coda7541
Chips&Media’s Coda7541 is an optimally-unified multi-standard Hardware video codec IP core that supports to enable all kinds of video application from mobile through to DTV. It is capable of HD(1280x720p) encoding H.264, MPEG-4, H.263 and HD(1920x1080p) decoding H.264, MPEG-4, MPEG-2, VC1, DivX, RealVideo formats at 30fps. Under our advanced design technologies, not only requires ultra low-power and ultra low-clock frequency, but also provides decent flexibility in error concealment, error resilient, and multi-resolution/multiplex decoder control.
About Chips&Media
Chips&Media,Inc. is a leading video core creator based in Seoul, Korea (Republic of). Chips&Media’s video codec technologies cover the full line-up of video standards such as MPEG-2, MPEG-4, H.263, H.264/AVC, VC-1, RealVideo and AVS from D1 to HD resolution. The company has been providing its advanced ultra low power multi-codec video IP to more than 20 top-tier semiconductor companies based in US, Europe, Korea, Taiwan, China and Japan. For more information, please visit www.chipsnmedia.com.
|
Chips&Media Hot IP
Related News
- Chips&Media unveils Boda7503, High-Definition video IP solution including AVS
- Chips&Media shows Next Generation of Video Processing Technologies at MWC 2012
- Chips&Media to Demonstrate Latest IP at Mobile World Congress 2010
- A high-performance and optimized Video IP: Chips&Media at the Semiconductor360 Live 2021
- Chips&Media Adds Extraordinary Features in the Next-Generation Video Codec IPs, introducing the WAVE6 Series
Breaking News
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |