Upgraded PUF-based Crypto Coprocessor (Compliant with TLS 1.3 / FIPS 186-5)
Dolphin Integration launches moDAC95-LB combining smallest silicon area and optimized Bill-of-Material
Taking into account the needed external components, a robust digital audio converter has been designed for low cost external components in a cost effective solution at the board level. The pure logic nature of moDAC95-LB now ensures the smallest silicon area with a pop-up noise reduction feature and it benefits from the patented PLL-less solution to avoid jitter due to the audio PLL.
"This audio component contributes to the portable device market segment, where both headphones and speaker are required, delivering the best trade-off between high quality, small silicon area and low Bill-of-Material", announces Hélène Colin, Dolphin Integration's Converter Product Line Manager. "We are quite confident that this daring solution will reach a wide range of customers through our Fabless partners. Not only we have squeezed the silicon area itself, but we have reduced the Bill-of-Material for an ultimate improvement of system makers’ Return on Investment".
Diverse application schematics are available to help perfectly fit various applications such as LCD monitors, positioning systems and portable devices requiring audio and video synchronization.
The complete CODEC configuration includes a digital microphone driver.
For more information about moDAC95-LB, feel free to contact Hélène COLIN, Converter Product Line Manager: jazz@dolphin-ip.com and to download our presentation sheet on www.dolphin-ip.com.
About Dolphin Integration
Dolphin Integration is up to their charter as the most adaptive creator in Microelectronics to "enable mixed signal Systems-on-Chip", with a quality management stimulating reactivity for innovation. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, resilient to noise and drastic for low power-consumption, together with engineering assistance and product evolutions customized to their needs.
|
Dolphin Design Hot IP
Related News
- Dolphin Integration's Audio converter Helium lightens both Power consumption and Bill-of-Material
- Dolphin Integration reduces silicon area by 40 % on its new audio codecs targeting wireless devices
- Mnano selects Dolphin Integration's six-channel Audio converter for its next generation of Smart Speakers
- Dolphin Integration breakthrough innovation for TSMC 180 nm BCD Gen 2 process: Up to 30% savings in silicon area with the new SpRAM RHEA
- Save up to 20 % of silicon area with Dolphin Integration's standard cell library SESAME uHD
Breaking News
- China's Intel, AMD Ban Helps Local Rivals, Analysts Say
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
Most Popular
- Intel and Arm Team Up to Power Startups
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- Renesas Introduces Industry's First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
E-mail This Article | Printer-Friendly Page |