MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Wipro to expand IC design unit
Mark LaPedus, EETimes
3/21/2011 9:03 PM EDT
SAN JOSE, Calif. - For years, chip makers have been under pressure on two fronts. They must reduce costs but develop and ship devices in a timely fashion.
The trend has given rise to the fabless ASIC houses, such as eSilicon, Faraday, Global Unichip, Open-Silicon, among others. These companies manage an IC project for chip makers that require additional resources. Fabless ASIC houses provide IC design services in one form or another, supply chain management and other services.
Another vendor, India’s Wipro Ltd., is a big player that keeps a relatively low profile. So who is Wipro? Wipro is a large company that provides IT solutions and services, including systems integration, information systems outsourcing, software application development and maintenance, and research and development services to corporations.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation
- Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development
- Top Five MPU Suppliers Expand Share of Sales to 86% in 2021
- Total IC Unit Shipments Forecast to Climb 9% This Year
- IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- SEMIFIVE Starts Mass Production of its 14nm AI Inference SoC Platform based Product
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024