Hsinchu, Taiwan and Cambridge, UK â April 2, 2013 â ARM and TSMC (TWSE: 2330, NYSE: TSM) today announced the first tape-out of an ARMÂ® Cortexâ¢-A57 processor on FinFET process technology. The Cortex-A57 processor is ARMâs highest performing processor, designed to further extend the capabilities of future mobile and enterprise computing, including compute intensive applications such as high-end computer, tablet and server products. This is the first milestone in the collaboration between ARM and TSMC to jointly optimize the 64-bit ARMv8 processor series on TSMC FinFET process technologies. The two companies cooperated in the implementation from RTL to tape-out in six months using ARM ArtisanÂ® physical IP, TSMC memory macros, and EDA technologies enabled by TSMCâs Open Innovation PlatformÂ® (OIP) design ecosystem.
ARM and TSMCâs collaboration produces optimized, power-efficient Cortex-A57 processors and libraries to support early customer implementations on 16nm FinFET for high-performance, ARM technology-based SoCs.
âThis first ARM Cortex-A57 processor implementation paves the way for our mutual customers to leverage the performance and power efficiency of 16nm FinFET technology,â said Tom Cronk, executive vice president and general manager, Processor Division, ARM. âThe joint effort of ARM, TSMC, and TSMCâs OIP design ecosystem partners demonstrates the strong commitment to provide industry-leading technology for customer designs to benefit from our latest 64-bit ARMv8 architecture, big.LITTLEâ¢ processing and ARM POPâ¢ IP across a wide variety of market segments.â
âOur multi-year, multi-node collaboration with ARM continues to deliver advanced technologies to enable market-leading SoCs across mobile, server, and enterprise infrastructure applications,â said Dr. Cliff Hou, TSMC Vice President of R&D. âThis achievement demonstrates that the next-generation ARMv8 processor is FinFET-ready for TSMCâs advanced technology.â
This announcement highlights the enhanced and intensified collaboration between ARM and TSMC. The test chip was implemented using a commercially available 16nm FinFET tool chain and design services provided by the OIP ecosystem and ARM Connected Community partners. This successful collaborative milestone is confirmation of the roles that TSMCâs OIP and ARMâs Connected Community play in promoting innovation for the semiconductor design industry.
ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARMâs comprehensive product offering includes RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the companyâs broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. Find out more about ARM http://www.arm.com/
TSMC is the worldâs largest dedicated semiconductor foundry, providing the industryâs leading process technology and the foundryâs largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Companyâs managed capacity in 2012 totaled 15.1 million (8-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFABâ¢ facilities, four eight-inch fabs, one six-inch fab, as well as TSMCâs wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 28nm production capabilities. TSMCâs corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.