MIPI C-PHY v1.2 D-PHY v2.1 TX 2 trios/2 Lanes in TSMC (16nm) for Automotive
Tezzaron Semiconductor announces a prototype memory device with record-breaking speed: 1.3 nanosecond (ns) latency, 1 ns cycle time, and a throughput of 2 Gigabits/sec on each pin
Although Tezzaron is better known for 3D semiconductor technology, it also develops memory innovations. PSiRAM™ development surged to the forefront last year with the sudden availability of a 90-nanometer manufacturing run. This opportunity, arranged by IP supplier Virtual Silicon Technologies, was a perfect fit for a PSiRAM™ prototype.
The manufacturing opportunity dictated an extremely tight schedule. Tezzaron’s engineers tackled the challenge at a breakneck pace, putting in 20-hour days, sleeping in a spare office, and working through weekends and the Christmas holidays. “It was a super-human achievement,” says Tezzaron’s CTO, Robert Patti. “72 million transistors and more than 250 custom layouts – no standard cells – and it went from concept to tape-out in only seven weeks. And it succeeded in first-pass silicon! These guys are truly incredible.”
Team leader Mark Hilbert acknowledged Virtual Silicon’s valuable assistance with layout verification, and gave credit to Cadence Design Systems tools as well: “We have years of experience with these tools; the Cadence® custom design flow was a big factor. The tool capabilities saved us a lot of time, especially with a design of this complexity.”
The PSiRAM™ prototype was built in a 90-nanometer facility, producing memory cells measuring only 0.59 square microns each. Because PSiRAM™ uses a standard CMOS logic process, it is ideal for SoC (System on Chip) processing and development; Tezzaron intends to license PSiRAM™ technology for use in SoC applications.
Tezzaron plans full production of PSiRAM™ chips next year. A 130-nanometer version is slated for the first half of 2004, followed by a 90-nanometer version late in the year.
Tezzaron Semiconductor is a privately funded corporation with headquarters in Naperville, Illinois, and a processing subsidiary in Singapore. For more information, visit www.tezzaron.com.
# # #
Related News
- Intilop delivers true Ultra-low latency 10G NIC with their 5th Gen 76 ns TCP & UDP Offload technology breaking yet another record in latency and bandwidth
- Anchor Bay Offers New Low-Cost HDMI 1.3 Deep Color Video-Processing IC for Blu-ray Players and AV Receivers
- TranSwitch Announces a Technology License Agreement for Its 3.5G HDMI 1.3 PHY IP Core
- TranSwitch announces first HDMI 1.3 PHY IP Core operating at 10.5 Gbps
- Silicon Image Supplies Samsung With HDMI 1.3 Transmitter for Blue-Ray Disc Player and HDMI 1.3 Receiver and Switches for HDTVSs
Breaking News
- PUFsecurity Unveils Next-Gen Crypto Coprocessor PUFcc7 Featuring High-speed Performance and TLS 1.3 Support
- VeriSilicon's complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification
- TASKING and Andes Announce FuSa Compliant Compiler Support for Andes RISC-V ASIL Compliant Automotive IP
- Efabless Launches an "AI Wake Up Call" Open-Source Silicon Design Challenge
- Efinix Rolls Out Line of FPGAs to Accelerate and Adapt Automotive Designs and Applications
Most Popular
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
- ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Intel and Arm Team Up to Power Startups
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
E-mail This Article | Printer-Friendly Page |