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Fabless / IDM News

• Samsung using 45-nm process for ARM-11 based processor (Jun. 29, 2009)
  Samsung Electronics Ltd has started sampling its ARM11-based application processor that will be made on its 45-nm CMOS process technology.
  
  
• XMOS puts multi-core in mass market for under US$ 5 per core (Jun. 24, 2009)
  XMOS has today launched its 2nd generation of event-driven processors, the XS1-L series, targeted at the mass electronics market with a sub $5 price point. Built on a 65-nanometer process, the XS1-L1 is sampling with customers now.
  
  
• Samsung Electronics and Numonyx join forces on Phase Change Memory (Jun. 24, 2009)
  Samsung Electronics and Numonyx today announced they are jointly developing market specifications for Phase Change Memory (PCM) products, a next generation memory technology that will help enable makers of feature-rich handsets and mobile applications, embedded systems* and high-end computing devices to meet the increasing performance and power demands for platforms loaded with content and data.
  
  
• Silicon Image Introduces First Products Incorporating HDMI 1.4 Features for DTV and Home Theatre Applications (Jun. 22, 2009)
  Silicon Image today introduced the SiI9387 port processor and the SiI9334 transmitter, the first semiconductor products to incorporate the latest HDMI(R) 1.4 specification features for digital television (DTV) and home theatre applications.
  
  
• RedMere Support For HDMI 1.4 Specification (Jun. 18, 2009)
  RedMere, the leader in high-speed chip and cable technology solutions, endorses HDMI Licensing LLC 1.4 Specification announcement and confirms availability of silicon to support new active cables designs for HDMI 1.4.
  
  
• BroadLogic Paves the Way to a New Era in Narrowcast and Unicast Cable Services with the Industry's First Ultra-Dense QAM Modulator Chip (Jun. 15, 2009)
  BroadLogic today announced the TeraQAM BL85000 the industrys first ultra-dense quadrature amplitude modulation (QAM) chip for systems that transport video, voice and data signals.
  
  
• STMicroelectronics Unveils Ultra-Low-Power Technology Platform for 8-bit and 32-bit Microcontrollers, Enabling Next-Generation Power-Saving Products (Jun. 15, 2009)
  STMicroelectronics has announced details of a new ultra-low-power technology platform for building a range of 8-bit and 32-bit microcontrollers, which will enable future generations of electronic products to consume less power, meet evolving energy-efficiency standards, and operate for longer from their batteries.
  
  
• Geo Semiconductor Inc. Launches Operations (Jun. 15, 2009)
  Geo Semiconductor today announced its formation and acquisition of major IC business lines and key elements of the IP portfolio of Silicon Optix Inc., including the Realta and the Geo ICs.
  
  
• ARM Utliizes eASIC Devices to Validate Cortex-A9 MPCore Multicore Processor-Based Devices (Jun. 11, 2009)
  eASIC today announced that ARM has successfully validated it’s next-generation Cortex™-A9 MPCore™ multicore processor using eASIC’s Nextreme NEW ASICs.
  
  
• Ember Unveils Industry's Highest Performance ZigBee Chips (Jun. 08, 2009)
  Ember today unveiled the EM300 Series, its next-generation ZigBee chip family that packs the industry’s highest wireless networking performance and application code space into the lowest power-consuming chip set.
  
  
• Cavium Networks Introduces Industry Leading Integrated ECONA ARM Processor for Small Form Factor Applications (Jun. 02, 2009)
  Cavium Networks today announced the introduction of the ECONA™ CNS2135 ARM SOC solution for small form factor and low power network and storage applications.
  
  
• Sequans Introduces Second Chip in New Generation 65nm Mobile WiMAX Chip Family (Jun. 02, 2009)
  Sequans Communications has introduced the SQN1220, the second chip in its new generation series of 65nm Mobile WiMAX system-on-chip (SOC) solutions. The new chip features a high level of processing power as needed to support combination voice and data applications and targets manufacturers of voice/data CPE and gateways with a solution that eliminates the need for an external CPU or DSP.
  
  
• Qualcomm Introduces Single-Chip 802.11n Wireless LAN Solution for Handsets and Mobile Devices (Jun. 02, 2009)
  Qualcomm today introduced the WCN1312(TM) - a single-chip, high-performance 802.11n-compliant wireless local-area networking (WLAN) solution for handsets and mobile devices.
  
  
• Innovasic Semiconductor Announces the Availability of Pin-Compatible 80C186XL and 80C188XL Embedded Processors (Jun. 02, 2009)
  Innovasic Semiconductor today announced engineering samples are shipping for the IA186XL and IA188XL. The IA186XL and IA188XL are form, fit, and function compatible with the original Intel® 80C186XL and 80C188XL 16-bit high-integration embedded processors, and also serve as replacements for the Intel® base 80C186 and 80C188 devices.
  
  
• Silicon Image Launches SteelVine(R) Series 3 Core Storage Processor and SATA Port Multiplier (Jun. 01, 2009)
  Silicon Image today announced the introduction of the SiI5923 SteelVine(R) Series 3 Core storage processor and the SiI3723 SteelVine Series 3 Core SATA 1:2 port multiplier--further expanding the company's proven SteelVine storage product portfolio
  
  
• NXP Unveils Industry's Lowest Power Cortex-M3 based Microcontrollers (May. 26, 2009)
  NXP today introduced the industry’s lowest power 32-bit Cortex™-M3 based microcontrollers, maintaining its commitment to innovation in energy-efficiency and further extending the world’s broadest range of ARM-based processors.
  
  
• Scaleo chip introduces easyBCU, new highly-integrated and powerful 32-bit Flash microcontroller family for next-generation car body electronics (May. 25, 2009)
  Scaleo chip, a leading automotive System-on-Chip (SoC) company launches easyBCU™, a highly-integrated 32-bit Flash microcontrollers family for automotive Body Control Unit (BCU). This highly featured family of products complements the successful Scaleo chip car interior electronic solution, easyCAN®, delivered in millions units each year.
  
  
• Fresco Logic showcases World's First Working PCI Express to SuperSpeed USB xHCI Host Single-Chip Solution (May. 20, 2009)
  Fresco Logic unveils the world’s first working PCI Express (PCIe) to SuperSpeed USB (aka USB 3.0) Extensible Host Controller Interface (xHCI) single chip solution with a fully integrated PCIe and a USB 3.0 physical layer device (PHY).
  
  
• NEC Electronics Introduces World's First USB 3.0 Host Controller (May. 18, 2009)
  NEC Electronics today introduced the world’s first Universal Serial Bus (USB) host controller (part number µPD720200) for the new SuperSpeed USB 3.0 standard.
  
  
• XMOS starts shipment of XS1-G2 devices (May. 15, 2009)
  XMOS today announced silicon availability of its XS1-G2 programmable device. Integrating two XCores™, each containing a 32-bit processor, the XS1-G2, which is code-compatible with the XS1-G4 device, provides 800MIPs and allows complete systems to be implemented in software using interface, DSP and control code.
  
  
• Texas Instruments introduces first SuperSpeed USB-compliant transceiver test chip (May. 15, 2009)
  Texas Instruments today introduced a new 5-Gbps transceiver test chip designed to the USB 3.0 specification version 1.0. The new transceiver is capable of driving and receiving signals over 4-m USB 3.0 cables to ensure data integrity.
  
  
• SafeNet Unveils the Industry's Highest Security SoCs and Next Generation of Security Co-processors (May. 14, 2009)
  SafeNet today announced the availability of the SafeXcel-1742 and SafeXcel-1746, the next generation of the company’s proven security co-processors, and the SafeXcel-3120 and SafeXcel-3141 high-performance system on a chip (SoC) processors.
  
  
• Open-Silicon, Inc. Executes NXP Product Development in Record Time (May. 12, 2009)
  Open-Silicon today announced successful completion of the software development phase of a custom ASIC device developed for NXP Semiconductors. Open-Silicon took the design from specification through production, including software, within 13 months.
  
  
• Jennic Achieves ZigBee Compliant Platform (ZCP) Certification (May. 12, 2009)
  Jennic has gained ZigBee Compliant Platform (ZCP) certification on its recently announced JN5148 wireless microcontroller. The certification covers the JN5148 32-bit wireless microcontroller plus all of its module variants. Jennic’s in-house ZigBee stack development supports the ZigBee PRO feature set.
  
  
• eASIC Announces Low-Cost, Single-Chip High Definition H.264 Codec (May. 11, 2009)
  eASIC Corporation, a provider of NEW ASIC devices, today announced the eDV9200, a low cost single chip high-definition H.264 CODEC. At the heart of the eDV9200 is fully programmable ITU-T compliant high definition baseline H.264 CODEC that supports all resolutions including 1080p, 720p, VGA, HVGA, QVGA, CIF and QCIF and variable bit rate (VBR) or constant bit rate (CBR) capabilities.
  
  
• SiliconBlue iCE65 mobileFPGA Family Strengthens Consumer Handheld Leadership with World's First Wafer Level Chip Scale Package SRAM FPGAs (May. 11, 2009)
  SiliconBlue® Technologies today announced availability of two industry-first Wafer Level Chip Scale Package (WLCSP) options for its iCE65 mobileFPGA family. The ultra-low power, low cost features of iCE FPGAs combined with the die-sized packages in 0.5mm and 0.4mm ball pitch, provides solutions that meet the stringent size and space requirements of today’s real-world consumer mobile designs.
  
  
• Aquantia to Deliver World's First Quad 10GBASE-T Solution (May. 11, 2009)
  Aquantia, the leading developer of energy efficient 10GBASE-T solutions, today announced the validation of the world's first 40nm Quad 10GBASE-T PHY.
  
  
• NXP ships industry's highest performance Cortex-M3 based microcontrollers (May. 05, 2009)
  NXP today confirmed that the LPC1700 series is the industry’s highest performance Cortex-M3 microcontroller, based on results from the Embedded Microprocessor Benchmark Consortium (EEMBC). The EEMBC results show that the LPC1700 executes application code on average 35% faster than the leading Cortex-M3 competitors when running at the same clock speeds.
  
  
• PLX Technology Unveils Industry's First PCI Express-to-USB 2.0 Host Controller Bridge (May. 04, 2009)
  PLX Technology today unveiled the breakthrough OXPCIe200, a high-performance PCIe-to-USB 2.0 host controller bridge.
  
  
• Open-Silicon Ships More Than 40 Million Units to Customers (May. 04, 2009)
  Open-Silicon today announced that the Company has achieved a milestone by shipping more than 40 million units. This accomplishment was achieved in only the company’s sixth year of business, and fourth year of production shipments.