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Fabless / IDM News

• eASIC Announces Immediate Availability of Aeroflex Gaisler's Leon4 Processor (Mar. 04, 2010)
  eASIC today announced the immediate availability of Aeroflex Gaisler’s next generation LEON processor, the LEON4, as part of its eZ-IP Alliance Core Library. The power and size optimized LEON4 is fully software compatible with previous LEON processors, yet with a performance increase of up to 50% at the same clock frequency.
  
  
• Tabula Introduces Breakthrough Spacetime Programmable Logic Architecture (Mar. 01, 2010)
  Tabula, Inc., a privately held fabless semiconductor company developing 3-D Programmable Logic Devices (3PLD), today introduced Spacetime, a groundbreaking programmable logic architecture that uses time as a third dimension to deliver unmatched capability and affordability.
  
  
• New Freescale Processor Helps Lower Costs and Foster Innovation for Next-Generation eReaders (Mar. 01, 2010)
  Freescale Semiconductor is helping drive down the cost of next-generation eReaders with its i.MX508 applications processor, the first system-on-chip (SoC) to integrate advanced ARM Cortex™-A8 technology together with the newest hardware-based display controller from E Ink. Freescale’s highly integrated i.MX508 processor is designed to deliver the performance, energy efficiency and system cost savings necessary to help OEMs evolve and grow the dynamic eReader product category.
  
  
• STMicroelectronics Introduces SPEAr Microprocessors for Embedded-Control Applications (Feb. 25, 2010)
  STMicroelectronics unveiled four new members in the SPEAr microprocessor family, targeting embedded-control applications. Based on the latest ARM® core technology, ST’s SPEAr microprocessors enable equipment manufacturers to develop complex yet flexible digital engines at a fraction of the time and cost of competing solutions.
  
  
• Samsung Expands Green Line-up with Industry's First Volume 40nm-class 4Gigabit DDR3 (Feb. 24, 2010)
  Samsung Electronics announced today that it has begun mass producing the industry’s first low-power (green) four gigabit (Gb) DDR3 devices using 40 nanometer (nm) class process technology.
  
  
• STMicroelectronics Announces World's First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers (Feb. 22, 2010)
  STMicroelectronics today announced its 55 nanometer (nm) embedded Flash (eFlash) process technology, which will be implemented in its next-generation automotive microcontroller (MCU) chips. ST is extending its production of eFlash technology to this advanced process node at its world-class 300mm manufacturing facility at Crolles, France.
  
  
• PLX to Demonstrate World's First PCI Express Gen 3 Switch (Feb. 17, 2010)
  
  
  
• Comsys Mobile Announces Baseband Development Platform for LTE UE SoC (Feb. 16, 2010)
  Comsys Mobile today announced availability of a new platform, the ComMAX . LT8000DP is a pre-silicon development platform for integration of Comsys Mobile’s ComMAX LTE technology with ecosystem partners’ IP, for a comprehensive LTE solution in shorter time to market. It supports eUTRA FDD and TDD as well as LTE CAT4 with sustained data throughput up to 150Mbps.
  
  
• Triad Semiconductor Announces First Mixed-signal ARM Cortex-M0 Processor with 16-bit ADC and 12-bit DAC (Feb. 16, 2010)
  Triad Semiconductor today announced another first: the first ARM® Cortex™-M0 processor combined with high-resolution, high-precision analog resources: 16-bit ADC and 12-bit DAC and uncommitted op-amps.
  
  
• Broadcom Introduces 65nm 3G HSPA Chipset Solution to Enable High-Speed, Low Cost Smartphone Devices (Feb. 08, 2010)
  Broadcom today announced a new single-chip HSPA (high-speed packet access) baseband processor and a radio frequency (RF) transceiver solution that integrates all of the key 3G (third generation) cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments. The advanced baseband processor is the first to provide extremely high-speed cellular connectivity with advanced, built-in graphics capabilities, for HSUPA (high speed upstream packet access) applications.
  
  
• NetLogic Microsystems Enables Significantly Richer LTE and IPTV Network Services with the World's First Knowledge-based Processor with High-Speed Serial Interface (Feb. 01, 2010)
  High-speed serial interface delivers 340% higher I/O bandwidth-per-pin for next-generation network core, metro, edge, enterprise and data center applications
  
  
• Samsung Develops Most Advanced Green DDR3 DRAM, Using 30nm-class Technology (Feb. 01, 2010)
  Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced that the industry’s first 30-nanometer-class DRAM has just successfully completed customer evaluations, in two gigabit (Gb) densities.
  
  
• Mindspeed 3G/4G/LTE Baseband Basestation Solution Uses Latest ARM Cortex A9 MPCore in Advanced 40-Nanometer Process Technology (Jan. 25, 2010)
  Mindspeed Builds on Long-Time Collaboration with ARM, Uses Mulitple ARM Cortex Processors to Enable New Class of Scalable Basestation Designs with Best-in-Class Processing Performance
  
  
• ChipWrights' Hardware Development Kit Speeds the Design of Video Processing Applications (Jan. 22, 2010)
  ChipWrights' Hardware Development Kit provides a comprehensive design environment that includes the hardware and software necessary to develop premium audio and video processing applications, including video I/O, networking, multiple media storage interfaces, and support hardware.
  
  
• eASIC Slashes Power with Low Voltage Devices (Jan. 22, 2010)
  eASIC today announced the immediate availability of two new lower power device options for its eASIC Nextreme Family. The NX750LP and NX750 Nextreme devices are now available with operating voltage down to 1.0V thereby enabling designers to achieve up to 40% lower power consumption.
  
  
• Qualcomm and AMD Lead List of Top 25 Fabless IC Suppliers (Jan. 21, 2010)
  Cellular phone chip supplier Qualcomm remained the number one fabless IC supplier, registering $6.6 billion in sales in 2009, a 2% increase. The most impressive gain by a large (i.e., greater than $1.0B in sales) fabless IC suppler in 2009 was MediaTek, which registered a strong 22% increase in sales to $3.5 billion.
  
  
• LSI Expands Custom IP Portfolio for Enterprise Networking and Storage Applications (Jan. 20, 2010)
  LSI today announced the addition of the multicore-capable PowerPC 476 microprocessor core and high-speed, embedded DRAM memory blocks to its industry-leading portfolio of custom silicon intellectual property (IP).
  
  
• SiTune unveils Ultra low power Mobile Analog CMOS TV Tuner for power sensitive devices (Jan. 19, 2010)
  SiTune announced its latest generation of state of the art Global Analog CMOS TV tuners based upon its P2TUNE architecture. STN-55T2000 is a highly integrated LOW-IF Tuner that delivers best performance for PAL/SECAM/NTSC for terrestrial and Mobile applications with best in class power consumption.
  
  
• Triad Semiconductor Announces Availability of World's First Configurable ARM Cortex-M0 Mixed-signal ASIC Solution (Jan. 12, 2010)
  Triad Semiconductor today announced the first system-on-chip (SoC) to integrate the world-class ARM® Cortex™-M0 with the via-configurable analog and digital functions needed to rapidly and inexpensively deliver embedded mixed-signal solutions.
  
  
• Atmel Reduces System Cost in Industrial Applications With High-Quality Video Decoding ARM926-Based Microprocessor (Jan. 11, 2010)
  Atmel today announced the SAM9M10, a high-performance ARM926EJ™-based embedded microprocessor (MPU) that integrates a video decoder and 2D acceleration (scaling, rotating, color space conversion, picture in picture) to provide high-quality video performance in industrial embedded applications.
  
  
• Marseille Reinvents Fabless Semiconductor Development, Unveils Virtual Tape-Out Methodology (Jan. 07, 2010)
  Marseille Networks today unveiled its Virtual Tape-Out methodology that uses virtualization for prototyping a chip’s design in the end consumer device prior to manufacture
  
  
• Nuvoton launches NuMicro Family - 32-bit Microcontroller based on ARM Cortex-M0 (Jan. 07, 2010)
  NuMicro® family adopts the newest processor of ARM® Cortex™-M0, featured with smallest size, lowest power consumption, optimized instruction set. As a powerful microcontroller, NuMicro® Family is equipped with various built-in analog, mixed-signal components, and all kinds of high-speed communication interfaces, which enables users to upgrade their existing products from 8051 to NuMicro® Family easily.
  
  
• Ambarella A5s with High-Speed CPU and Low-Power 45nm Technology Makes Pocket-Sized Hybrid Cameras a Richer User Experience (Jan. 07, 2010)
  A5s Combines Full High-Definition Video, Megapixel Photography, Internet Sharing, Long Battery Life, and Best-in-Class Graphical Interface Capabilities
  
  
• Cavium Networks Introduces a New Family of PureVu Single Chip H.264 Processors That Break the Price-Performance Barrier for Mass Market Adoption in Wireless Displays, Home Video Distribution, and Video Conferencing (Jan. 06, 2010)
  Cavium Networks today announced a new family of full HD (1080p60) system-on-a-chip (SoC) H.264 video processors for consumer and enterprise applications.
  
  
• eSilicon Takes Achronix 1.5 GHz FPGA Design to Production (Dec. 17, 2009)
  eSilicon and Achronix Semiconductor today revealed that they have successfully taken the Achronix Speedster 1.5 GHz FPGA to commercial production. Achronix selected eSilicon to leverage eSilicon’s world-class physical design and supply chain expertise.
  
  
• STMicroelectronics Unveils High-Performance System-on-Chip for Next Generation of Integrated Broadcast and Broadband-Internet Digital TVs (Dec. 16, 2009)
  Consumer equipment makers to benefit from highly integrated chip with world-class Faroudja(TM) video/audio enhancements, delivering full high-definition digital TV processing and accelerated Internet TV support
  
  
• Atmel Highly-Integrated Cortex-M3-based Flash MCUs Improve Impedance Matching and Lower Power Up to 50 Percent (Dec. 15, 2009)
  Atmel today announced the SAM3S series. This series includes 18 general-purpose Cortex®-M3 based Flash microcontrollers that improve impedance matching, simplify PCB design and save 50 percent power at 1 MHz operation with a consumption of only 2.3 mW.
  
  
• NXP Introduces Advanced 3DTV Processor (Dec. 14, 2009)
  NXP Semiconductors today announced the availability of the PNX5130, the industry’s first video co-processor enabling 3DTV, frame-rate conversion (FRC) and local backlight dimming in a single chip. By eliminating the need for external FPGA devices to support 3DTV, NXP is providing a highly cost-effective post-processing solution that will enable manufacturers to bring competitively priced 3D-enabled TV sets to the mainstream consumer market.
  
  
• Genesys Logic Will Display USB 3.0 Products at CES 2010 (Dec. 07, 2009)
  GL3310 USB 3.0 to SATA Bridge Controller and GL3520 USB 3.0 Hub Controller will be on display during CES 2010
  
  
• Atmel Launches Low-cost LF RFID IC with OTP Functionality and Unsurpassed Read Performance for Small-sized Access Control Systems (Nov. 19, 2009)
  Atmel today announced the availability of the LF OTP (One Time Programmable) transponder IDIC® ATA5575M1. The ATA5575M1 provides OTP functionality, which simplifies the production process and provides increased flexibility compared to read-only devices.