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VeriSilicon Joins Power Forward Initiative to Accelerate Advanced Low-Power Design |
May. 12, 2008 |
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Analysis: VeriSilicon's HD audio IP solution |
Jan. 30, 2008 |
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VeriSilicon Introduces VZ.AudioHD: A Complete, Licensable Audio Solution for Exploding High Definition Market |
Jan. 02, 2008 |
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VeriSilicon Holdings Co., Ltd. Secures $20 Million in Financing |
Nov. 06, 2007 |
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VeriSilicon Introduces VZ.VoiceHQ Appplication Platform to Accelerate Development of Next Generation VoIP Products |
Aug. 29, 2007 |
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VeriSilicon and DTS Announce Strategic Collaboration to Proliferate DTS HD Audio Technologies |
Jul. 18, 2007 |
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VeriSilicon Selects SRS WOW HD and SRS TruSurround HD for its ZSP (R) and VZ.Audio Platform |
Jul. 17, 2007 |
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VeriSilicon Announces Agreement with IBM to Dramatically Reduce Design Time for PowerPC Based Products |
May. 09, 2007 |
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VeriSilicon and ARM Extend Partnership to Further Address Advanced Consumer and Networking SoC Designs |
May. 09, 2007 |
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VeriSilicon Launches New Families of Advanced Audio / Video Application Platforms to Accelerate Portable Multimedia Designs |
Jan. 29, 2007 |
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VeriSilicon and Chips&Media Announce a Strategic Partnership to Provide Advanced Multimedia Solutions for Consumer Devices |
Jan. 23, 2007 |
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VeriSilicon Licenses ZSP(R) G2 Processor Family to Yamaha for Advanced Multimedia Applications |
Oct. 25, 2006 |
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Sequans Communications Selects VeriSilicon's ZSP540 Processor for its WiMAX Silicon Products |
Oct. 10, 2006 |
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VeriSilicon Announces ZView Developement Environment for its Industry Standard ZSP Processors |
Sep. 26, 2006 |
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SMIC and VeriSilicon Announced Release of a Standard Design Platform for SMIC's 0.13u Low Leakage Process |
Sep. 06, 2006 |
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VeriSilicon Shipping ZSP Based ASIC for SyChip's Voice Over WLAN Module |
Aug. 08, 2006 |
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VeriSilicon Launches GSM-AMR-WB (G.722.2) Wideband Codec on ZSP(R) for 3G Wireless and VoIP Applications |
Aug. 07, 2006 |
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VeriSilicon Announces Acquisition of ZSP Digital Signal Processor Unit from LSI |
Jul. 06, 2006 |
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VeriSilicon Receives US$ 14.8M in Series-C Financing Round From US Based Leading Venture Capital Firms |
Jul. 06, 2006 |
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VeriSilicon Tapes out Flip-Chip Design With Cadence Encounter |
Jan. 24, 2006 |
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VeriSilicon and SMIC Jointly Announce Standard Design Platform for SMIC's Advanced 0.13-micron CMOS Process Technology |
Oct. 31, 2005 |
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VeriSilicon Completes Series B Financing |
Aug. 15, 2005 |
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VeriSilicon Announced Release of Library Products for HeJian Technology 0.18 and 0.25 micron Process Technology |
Mar. 15, 2005 |
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VeriSilicon Provided Backend Design Service for COMMIT 3G TD-SCDMA Chip, Achieved |
Dec. 08, 2004 |
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VeriSilicon and Magma Team to Deliver "Magma-Ready" Libraries for China-Based Wafer Foundries |
Jul. 19, 2004 |
