Ivo Bolsens, Xilinx
EETimes (2/22/2012 1:39 PM EST)
The IC industry is revving up efforts to make 2.5-D and eventually 3-D IC technology a mainstream reality.
The vision of a 3-D IC is promising, but some industry watchers believe the 2.5-D market to be more than a steppingstone to true 3-D design. They say 2.5-D technology has staying power. Leveraging it industrywide will require evolutionary, rather than revolutionary, adjustments to current design flows and the supply chain.
In its Virtex-7 2000T, Xilinx Inc. places several dice side by side on a passive silicon interposer. The 2.5-D technology has marked advantages in capacity, performance, form factor and system power consumption over traditional multichip implementations.
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