Design & Reuse
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122 IP
1
140.0
InfiniNoC Interconnect
InfiniNoC is a scalable, modular Network-on-Chip (NoC) IP for many-core and chiplet-based system-on-chip (SoC) designs requiring high bandwidth, low l...
2
100.0
UCIe PHY & D2D Adapter
Neuron IP’s UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 specifica...
3
100.0
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
4
100.0
UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
5
100.0
UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
6
100.0
Universal Chiplet Interconnect Express (UCIe) Controller
Synopsys UCIe Controller IP is comprised of the Die-to-Die Adapter layer and Protocol layer for widely used protocols such as PCI Express and CXL. The...
7
70.0
40G UCIe PHY IP on Samsung SF4X
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI,...
8
60.0
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes pe...
9
60.0
Multi-Die interLink (GLink 2.3) IP
GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a ...
10
50.0
40G UCIe PHY for high-density advanced packages
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI,...
11
50.0
40G UCIe PHY for organic substrate standard packages
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI,...
12
45.0
Ncore 3 Coherent Network-on-Chip (NoC)
For scalable and area-efficient heterogeneous cache coherent systems. The Arteris Ncore Cache Coherent Interconnect IP offers unparalleled scalabil...
13
44.0
FlexNoC 5 Option For Scalability and Performance Critical Systems
Arteris IP FlexNoC Performance Option accelerates development of next-generation deep neural network (DNN) and machine learning systems. Automate and ...
14
30.0
UCIe Die-to-Die Chiplet Controller
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innova...
15
30.0
High speed NoC (Network On-Chip) Interconnect IP
OPENEDGES is the only total memory system IP company providing both memory controller and on-chip interconnect. OIC is the ORBIT high-speed On-chip In...
16
30.0
Universal Chiplet Interconnect Express (UCIe) Controller
Integrating multiple chiplets within a single package has become crucial for high-performance computing. CoMira’s UCIe (Universal Chiplet Interconnect...
17
16.0
Die-2-die interfaces for chiplets - GPIOs for 2.5D and 3D integration
Analog I/O and on-chip Electrostatic Discharge (ESD) protection. Proven on many foundries: TSMC, UMC, GF, TowerSemi, Samsung Foundry, ... Proven in ...
18
15.0
Coherent Network-on-Chip (NoC)
SkyeChip's NoC is the first in the world that is able to reconfigure routing paths after tapeout. It is a scalable and area efficient interconnect sol...
19
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
20
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
21
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
22
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
23
14.0
UltraLink Controller
Ultralink controller for high performance die-to-die interconnect on streaming, CXS, and AXI protocols The Cadence Ultralink Controller enables a pro...
24
14.0
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller i...
25
14.0
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller i...
26
11.0
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead...
27
11.0
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead...
28
10.0
UCIe based 8-bit 48-Gsps Transceiver (ADC/DAC/PLL/UCIe)
Unleash the power of the new UCIe based RF Chiplet transceiver. With NEXT Semiconductor's silicon proven 8-bit, 48-Gsps Transceiver, this product ...
29
10.0
UCIe D2D Adapter
The D2D Adapter for UCIe is a scalable adapter layer between one or more protocol components and the UCIe PHY, which ensures efficient data transfer a...
30
10.0
Chip-to-Chip IO Buffer - TSMC CLN4P
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
31
10.0
Chip-to-Chip IO Buffer - TSMC CLN5
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
32
10.0
Chip-to-Chip IO Buffer - TSMC CLN5A
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
33
10.0
Chip-to-Chip IO Buffer - TSMC CLN6FF
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
34
10.0
Chip-to-Chip IO Buffer - TSMC CLN7FF
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
35
10.0
Die-to-Die Controller IP
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accele...
36
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in GF (12nm)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
37
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
38
10.0
Mobiveil RapidIO Controller (GRIO)
Mobiveil Generic RapidIO (GRIO) controller is a highly flexible and configurable IP to provide RapidIO interface on one side and a generic interface o...
39
9.0
IPT UCIE 2.0 CONTROLLER
High-Performance UCIe Controller IP for AI, Data Center & Consumer Applications The InPsytech UCIe 2.0 (Universal Chiplet Interconnect Express) Contr...
40
8.0
TSMC CLN5FF Glink 2.0 Die-to-Die PHY
IGAD2DY01A is a high speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions：Integrated Fan-Out (InFO) with RDL ...
41
7.0
Non-Coherent Network-on-Chip (NoC)
SkyeChip's NoC is the first in the world that is able to reconfigure routing paths after tapeout. Performance (throughput and latency) optimized no...
42
5.0556
600Mbps Low Power D2D Interface in TSMC 16nm
Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or ...
43
5.0556
<4Gbps Low Power D2D Interface in TSMC 12/16nm
Custom die-to-die interface in 12/16nm process technology. The I/O cells are defined as TX only, and RX only and have two modes of operation, standard...
44
5.0556
<4Gbps Low Power D2D Interface in TSMC 28nm
Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation,...
45
4.0
UCIe 2.0 PHY for Advanced Package (4nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, 16GT/s, 24GT/s and 32GT/s wi...
46
4.0
UCIe 2.0 PHY for Advanced Package (8nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, 16GT/s, and 24GT/s with a 64...
47
4.0
UCIe 2.0 PHY for Standard Package (4nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, and 16GT/s with a 16-lane co...
48
4.0
UCIe 2.0 PHY for Standard Package (5nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, and 16GT/s with a 16-lane co...
49
4.0
UCIe 2.0 PHY for Standard Package (8nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, 16GT/s, and 24GT/s with a 64...
50
0.0
5/10/40G Ultra Low Latency MAC PCS with AXI-4 and UCIe support
This IP is optimized for AI/ML workloads and lowest possible latency.It is not meant to be a generic 1G to 10G MAC &ndash; it only supports 5G and 10G...