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Blogs
From Artemis II to deep space: why space-grade chips must be built for the harshest conditions
(Thursday, June 4, 2026)
Leveraging Open-Source Edge AI Models with MosChip GenAIoT
(Wednesday, June 3, 2026)
RTLS Accuracy Starts in Antenna Design: Q&A with Antti Karilainen
(Wednesday, June 3, 2026)
Showcase at AutoSens US: Integration of TicoRAW into dSPACE high performance data logging solution enables seamless workflow
(Wednesday, June 3, 2026)
Embedded Systems Design: Hardware-Firmware Integration Under Real-Time Constraints
(Wednesday, June 3, 2026)
What Makes Ethernet IP Truly Automotive-Grade
(Monday, June 1, 2026)
Agentic AI-powered Arm Metis advances security vulnerability discovery in software
(Monday, June 1, 2026)
UWB and 6G: Why Precision Sensing Will Define the Next Wireless Revolution
(Monday, June 1, 2026)
AES in embedded systems: Understanding the most important AES modes
(Monday, June 1, 2026)
Designing the Future We Can Verify: A Vision for Multi-Die Design, STCO, and Trustworthy AI
(Monday, June 1, 2026)
Ten Years in CiA, Over Two Decades of CAN IP Reliability
(Monday, June 1, 2026)
Accelerating SoC Development with Agnisys Silicon IP Portfolio Automation
(Monday, June 1, 2026)
Edge AI-Driven Matter Controller for Next-Generation Smart Homes
(Thursday, May 28, 2026)
AI-Accelerated Vulnerability Discovery: An Emergency in Software Security. Is Hardware Next?
(Thursday, May 28, 2026)
Quantum Safe is the New Cloud Migration
(Thursday, May 28, 2026)
PAZI vs. Traditional Security: Why Conventional Security Fails in the QAAS Era
(Thursday, May 28, 2026)
Agnisys SystemRDL VS Code Extension: A Must-Have for Modern SystemRDL Development
(Thursday, May 28, 2026)
Welcoming EMA Design Automation and FlowCAD to Cadence
(Monday, May 25, 2026)
Cadence and Microsoft Present New Insights on Data Center CFD Modeling at ITherm
(Monday, May 25, 2026)
Inside CoreHW’s RTLS Productization: Veijo Korhonen, Head of Product Creation, on Building Accurate, Scalable Systems for Global Use
(Thursday, May 21, 2026)
Building what comes next: Why startups need a manufacturing-first approach to innovation
(Thursday, May 21, 2026)
A Repeatable Framework for Hardware Security Assurance
(Tuesday, May 19, 2026)
JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
(Monday, May 18, 2026)
PQC: Everything you wanted to know about post-quantum cryptography but were afraid to ask
(Monday, May 11, 2026)
A Systematic Approach to Robust LVDS Integration in Advanced Node ASICs
(Monday, May 11, 2026)
Chiplets 101: An Arteris Guide to Multi-Die Architecture
(Monday, May 11, 2026)
2.5D + 3D = “3.5D”!
(Thursday, May 7, 2026)
Providing protection against EMFI attacks
(Monday, May 4, 2026)
From deployment to open standards: Arm advances AI infrastructure for the agentic era
(Monday, May 4, 2026)
The Rise of AI Factories: Powering an Era of Pervasive Intelligence
(Monday, May 4, 2026)
Addressing AI and Advanced Packaging Challenges with Synopsys 3DIO PHY
(Monday, May 4, 2026)
How GlobalFoundries’ “virtual fabs” are redefining semiconductor manufacturing
(Monday, May 4, 2026)
Why 6.4 Gbps DDR5 Designs Fail and How to Avoid It
(Thursday, April 30, 2026)
Samsung Foundry 4nm FinFET: Scaling Built on Maturity
(Thursday, April 30, 2026)
Embedded Security explained: Cryptographic Hash Functions
(Thursday, April 30, 2026)
Announcing Arm Performix: Empowering developers with scalable performance for the age of AI agents
(Thursday, April 30, 2026)
Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions
(Monday, April 27, 2026)
SoC Evaluation Boards Evolve to Meet New Design Complexities
(Monday, April 27, 2026)
Topology and Data Movement in Multi-Die Design
(Monday, April 27, 2026)
AI has compressed the attack timeline
(Thursday, April 23, 2026)
Earth Week 2026: Advancing sustainable manufacturing for the essential technologies the world relies on
(Thursday, April 23, 2026)
Universal Browser Support for JPEG XL: Is Your Hardware Ready for the New Standard?
(Monday, April 20, 2026)
Interface IP: The Keystone for 3D Multi-Die Designs
(Monday, April 20, 2026)
Rambus DDR5 RDIMM 8000 Chipset Named Semiconductor Product of the Year from the Data Breakthrough Award
(Monday, April 20, 2026)
How GlobalFoundries is manufacturing quantum at scale
(Monday, April 20, 2026)
Why Security Can't Exist Without Trust
(Thursday, April 16, 2026)
Topology and Data Movement in Multi-Die Design
(Thursday, April 16, 2026)
Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI
(Thursday, April 16, 2026)
Google, Quantum Attacks, and ECDSA: Why There’s No Need to Panic and Why Preparation Matters Now
(Thursday, April 9, 2026)
Powering AI at scale: How HVDC and GaN are transforming hyperscale data centers
(Thursday, April 9, 2026)
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