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Blogs
Multi-Protocol Communication Systems Deliver a Richer User Experience
(Thursday, July 9, 2026)
Asset Lifecycle Management at the Edge
(Thursday, July 9, 2026)
SemiWiki Executive Interview with Chris Morrison, VP Product Marketing at Agile Analog
(Wednesday, July 8, 2026)
Microsoft accelerates quantum-safe timeline for adoption by 2029
(Monday, July 6, 2026)
Why crypto-agility requires real governance
(Monday, July 6, 2026)
The Three Phases of AI Adoption
(Thursday, July 2, 2026)
Advancing UCIe Performance: Enabling 40G for Next-Generation Multi-Die Designs
(Thursday, July 2, 2026)
Why DACs are so crucial in modern chip design
(Tuesday, June 30, 2026)
India as the Emerging Global Semiconductor GCC Hub
(Monday, June 29, 2026)
TEVIOS Becomes Official Distributor of intoPIX AV Solutions
(Monday, June 29, 2026)
The quantum countdown: what the new White House EO 14409 means for PQC
(Monday, June 29, 2026)
What the Cyber Resilience Act means for the future of chip design
(Monday, June 29, 2026)
Advancing Flash Memory Performance for the Edge AI Era
(Monday, June 29, 2026)
DDR Verification Challenges in Modern Chip Design
(Monday, June 29, 2026)
When does it make sense to move from a monolithic ASIC to a chiplet-based design?
(Monday, June 29, 2026)
Beyond Moore’s Law: Heterogeneous Computing and AI SoCs
(Monday, June 29, 2026)
The Post-Quantum Cryptography Mandate: Building Cryptographically Agile Systems for the Quantum Era
(Thursday, June 25, 2026)
Building the Digital Cockpit: From Hardware to AI
(Thursday, June 25, 2026)
Addressing DV Professionals’ Need to Reduce Verification Errors in Complex Designs
(Wednesday, June 24, 2026)
International Women in Engineering Day and the importance of mentors
(Tuesday, June 23, 2026)
New PQCC solution analysis guide provides a framework for transition
(Monday, June 22, 2026)
Cyber Defense Magazine: Securing The Unseen Why Data in Motion is the Next Cybersecurity Frontier
(Monday, June 22, 2026)
India’s 2029 Vision for National Quantum Resiliency
(Monday, June 22, 2026)
How AI and Edge Computing Are Accelerating RISC-V Adoption
(Monday, June 22, 2026)
Why Physical AI Needs a New Generation of Embedded Memory
(Monday, June 22, 2026)
How to Close Timing at 7nm: 5 Lessons Every Physical Design Team Should Know Why Timing Closure at 7nm Is Different
(Monday, June 22, 2026)
Global Semiconductor Industry: The Engine Powering the AI Era
(Friday, June 19, 2026)
UCIe Full Signal Integrity Analysis Flow
(Thursday, June 18, 2026)
Cadence Accelerates Digital Twin–Driven Data Center AI Modernization with HPE
(Wednesday, June 17, 2026)
Process Design Kits: How Synopsys and Intel Foundry Are Accelerating Customer Success
(Monday, June 15, 2026)
ENISA publishes draft of Agreed Cryptographic Mechanisms version 3
(Thursday, June 11, 2026)
AES in embedded systems: Understanding the most important AES modes
(Thursday, June 11, 2026)
Mitigating the Single-Source Trap
(Thursday, June 11, 2026)
Challenges in CSR Design and Verification Signoff
(Thursday, June 11, 2026)
What Is EMI Shielding? The Ultimate 6-Step Practical Guide
(Monday, June 8, 2026)
More than compression — wavelet scaling
(Monday, June 8, 2026)
From Artemis II to deep space: why space-grade chips must be built for the harshest conditions
(Thursday, June 4, 2026)
Leveraging Open-Source Edge AI Models with MosChip GenAIoT
(Wednesday, June 3, 2026)
RTLS Accuracy Starts in Antenna Design: Q&A with Antti Karilainen
(Wednesday, June 3, 2026)
Showcase at AutoSens US: Integration of TicoRAW into dSPACE high performance data logging solution enables seamless workflow
(Wednesday, June 3, 2026)
Embedded Systems Design: Hardware-Firmware Integration Under Real-Time Constraints
(Wednesday, June 3, 2026)
What Makes Ethernet IP Truly Automotive-Grade
(Monday, June 1, 2026)
Agentic AI-powered Arm Metis advances security vulnerability discovery in software
(Monday, June 1, 2026)
UWB and 6G: Why Precision Sensing Will Define the Next Wireless Revolution
(Monday, June 1, 2026)
AES in embedded systems: Understanding the most important AES modes
(Monday, June 1, 2026)
Designing the Future We Can Verify: A Vision for Multi-Die Design, STCO, and Trustworthy AI
(Monday, June 1, 2026)
Ten Years in CiA, Over Two Decades of CAN IP Reliability
(Monday, June 1, 2026)
Accelerating SoC Development with Agnisys Silicon IP Portfolio Automation
(Monday, June 1, 2026)
Edge AI-Driven Matter Controller for Next-Generation Smart Homes
(Thursday, May 28, 2026)
AI-Accelerated Vulnerability Discovery: An Emergency in Software Security. Is Hardware Next?
(Thursday, May 28, 2026)
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