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Thursday, June 19, 2025

• BT Group Joins the CHERI Alliance to Advance Cybersecurity Innovation
• Keysight Enables AMD to Showcase Electrical PCI Express® Compliance up to 64 GT/s
• CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits

Wednesday, June 18, 2025

• Siemens collaborates with Samsung Foundry on advanced node product certifications and EDA innovation
• DCD-SEMI Joins MIPI Alliance and Unveils Latest I3C IP at MIPI Plugfest Warsaw 2025

Tuesday, June 17, 2025

• Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution
• Nordic Semiconductor accelerates edge AI leadership with acquisition of Neuton.AI
• Xylon Celebrates 30 Years of Innovation in Embedded Electronics
• Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
• Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

Monday, June 16, 2025

• SmartDV Introduces Advanced H.264 and H.265 Video Encoder and Decoder IP
• Safety Without Security Is an Illusion in the Age of Autonomous Vehicles
• Advanced MIPI IP Cores for Automotive, IoT, Consumer, Imaging & Display SoCs
• InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC

Sunday, June 15, 2025

• Samsung, TSMC set stage for fierce race in 2nm chip tech

Friday, June 13, 2025

• Chinese regulator holds off on clearing $35B Synopsys-Ansys merger - report
• Nordic Semiconductor to showcase cutting-edge cellular IoT solutions at MWC Shanghai 2025
• Risks of Lack of Strategy for AI in Supply Chains
• Ai drives power management into top ten fabless chip list
• Samsung Foundry Struggles With 3nm Yields at 50% as TSMC Climbs Past 90%
• M31 Ranked in the Top 5% of TPEx-Listed Companies in the Corporate Governance Evaluation for Four Consecutive Years

Thursday, June 12, 2025

• Imec achieves record-breaking RF GaN-on-Si transistor performance for high-efficiency 6G power amplifiers
• Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025
• PCI-SIG® Announces PCIe® Optical Interconnect Solution

Wednesday, June 11, 2025

• Qualcomm opens new AI R&D center in Vietnam
• Honda Reportedly Plans Rapidus Investment to Secure Advanced Chips Beyond TSMC Deal
• UK plans $1bn AI supercomputer
• Synopsys Achieves PCIe 6.x Interoperability Milestone with Broadcom's PEX90000 Series Switch at PCI-SIG DevCon 2025
• Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission
• Cadence Advances Design and Engineering for Europe's Manufacturers on NVIDIA Industrial AI Cloud
• OPENEDGES Collaborates with Renesas on Memory Subsystem IPs for Next-Generation MPU Platform Development
• Synopsys Achieves PCIe 6.x Interoperability Milestone with Broadcom's PEX90000 Series Switch at PCI-SIG DevCon 2025
• Siemens' PAVE360 to support new Arm Zena Compute Subsystems
• VeriSilicon's AI-ISP Custom Chip Solution Enables Mass Production of Customer's Smartphones
• CFX's 130nm EEPROM IP Passes Customer Product-Level Evaluation, Ready for Mass Commercial Adoption
• Numem Addresses AI's Dirty Secret: Memory Is the Real Bottleneck
• IP Cores, Inc. ships new FFT4T Streaming Multi-Channel FFT Core
• Elliptic Labs' AI Platform Now Optimized for Ceva's NeuPro-Nano NPU - Enabling Smarter Edge Devices

Tuesday, June 10, 2025

• TSMC May 2025 Revenue Report
• BOS Semiconductors, Selected for the 2025 Innovation Premier 1000
• IAR Platform Accelerates Embedded Development with Updated Toolchains for Arm and RISC-V
• Faraday Unveils FlashKit™-22RRAM: an eNVM-based SoC Development Platform for IoT
• Silicon Proven DisplayPort 1.4 Tx & Rx PHY IP Cores, Ready to license in 12/28/40/55nm
• sureCore launches comprehensive suite of silicon services
• Qualitas Semiconductor Successfully Develops UCIe v2.0-Compliant PHY IP, Enabling Up to 512Gbps Die-to-Die Connectivity
• IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
• VeriSilicon's Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications
• Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V

Monday, June 9, 2025

• How to Optimize Energy Consumption in IoT Devices
• Samsung's Gap with China's SMIC in Foundry Market Narrows to Mere 1.7%
• IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs
• VeriSilicon's Scalable High-Performance GPGPU-AI Computing IPs Empower Automotive and Edge Server AI Solutions
• Sarcina Technology advances photonic package design to address key data center challenges
• Qualcomm To Acquire UK's Alphawave For US$2.4 Billion

Sunday, June 8, 2025

• Andes Technology Unveils AndesAIRE™ AnDLA™ I370: A Next-Generation Deep Learning Accelerator for Edge and Endpoint AI