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Tuesday, June 23, 2026

• T2M’s Cellular IP Core Portfolio: Accelerate SoC Innovation with Faster Time-to-Market, Lower Risk, and Superior PPA.
• BOS Semiconductors to Showcase Physical AI Technologies at electronica Shanghai 2026
• Brite Semiconductor Releases 40nm 16-bit 4Msps High-Performance SAR ADC IP, Powering Industrial and Automotive Applications

Monday, June 22, 2026

• Intel Announces Leadership Appointment at Intel Foundry to Accelerate Development and Manufacturing
• Linking Demand, Design, and Manufacturing to Build a Device-Specific Chip Ecosystem
• Memory Market in 2026 Set to Quadruple Compared to 2025
• Qualcomm is reportedly considering a Tenstorrent acquisition for up to 10 billion dollars: Jim Keller’s AI and RISC-V company in focus
• SecureSoC strengthens cybersecurity, security of supply and semiconductor expertise in Finland
• Floadia Releases Automotive Embedded Flash IP on TSMC 180BCD Gen3 Platform
• Space Industry Is Standardizing on RISC-V
• AI compute is only as useful as the memory architecture feeding it — Semidynamics brings its full inference stack to ISC HPC 2026
• Rambus Rolls Out Memory Chipset to Unburden AI PCs
• Samsung Foundry Reportedly in Talks with AMD for 2028 CPU Production as BYD, Google Consider Its Services
• Report: Intel Partners With Taiwan’s UMC on 3nm Chips, Taking Direct Aim at TSMC’s Foundry Dominance
• Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor ManufacturingNew collaboration provides framework between the Japan government and Italy

Thursday, June 18, 2026

• Floadia Releases Automotive Embedded Flash IP on TSMC 180BCD Gen3 Platform
• Introducing Tessent UltraSight - a complete functional monitoring & debug solution for SoCs
• Qualcomm Shares Rise on Tenstorrent Deal Talks and AI Push
• Fraunhofer calls for faster technology transfer to strengthen Germany
• Analog Bits to Present at EE Times Virtual Event, "The Road To Chiplet Scalability" on June 24th, 2026
• Fraunhofer IPMS unveils Q‑Dice: Quantum Random Number Generator delivering multi‑Gbps true randomness for secure applications
• Imagination Technologies Brings GPU Expertise to CHASSIS’ New Chiplet Project
• Europe’s first sovereign chip manufacturing flow could reshape the IoT supply chain
• Gov’t joins hands with Samsung to support AI chip development
• Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions
• Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation
• Xiphera contributes to SecureSoC, strengthening Finland’s cybersecurity, security of supply, and semiconductor expertise
• CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI
• Baya Systems partners with Openchip for RISC-V systems
• UK Semiconductor Centre and Rapidus partner to expand access to advanced chip technologies
• Intel Foundry Details Process Milestones and Future Innovation at VLSI Symposium
• ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration

Wednesday, June 17, 2026

• Chips&Media Signs Next-Gen 'AV2' Video IP Licensing Deal with North American Big Tech, Strengthening Global Standards Leadership
• MIPI Alliance Welcomes Sony Semiconductor Solutions as a Promoter Member
• Agile Analog collaborates with Xiphera for Post-Quantum Cryptography challenge

Tuesday, June 16, 2026

• Allegro DVT’s Pulsar Decoder IP adds support for AV2 video codec
• Quintauris and Nuclei Cooperate to Ensure Automotive Real-Time RISCV Readiness with RT-Europa

Monday, June 15, 2026

• TES offers new voltage buffer IPs with various driving capabilities for X-FAB’s XT018 technology
• TGE200: M33-Class Performance RISC-V MCU IP Core with Unified Software Ecosystem for Secure IoT Edge Computing, and Embedded Systems
• Keysight Joins Siemens Digital Industries Software Solution Partner Program as a Software and Technology Partner
• Samsung CEO Sees Foundry Profitability in 2028
• TSMC May 2026 Revenue Report
• SemiFive CEO Says Company Targets 200 Billion Won in Sales This Year
• ADTechnology Hires 50 Engineers in Largest Recruitment Drive
• SignOff Semiconductors Achieves ISO 9001:2015 Certification for Semiconductor Chip Design and Embedded Solutions
• Celera Semiconductor Acquires Portugal-Based SiliconGate, a Global Leader in Analog IC Design
• ICTK Selected to Lead 7 Billion-Won Security SoC Project
• GlobalFoundries and Qualinx demonstrate first European sovereign manufacturing flow for security‑critical semiconductors
• Arm delivers a step-change in mobile gaming with Neural Dawn, showcasing the first use of Arm Neural Technology and Unreal Engine MegaLights on mobile
• Dnotitia Releases DNA 3.0, an Enterprise-Ready AI Language Model Family
• RISC-V Targets Data Centers, Edge AI, Space
• Axelera AI and Andes Technology Partner to Power Next-Generation "Europa" AI Platform with High-Performance RISC-V AX65 Cores
• Imec advances III-V chiplet integration with RF silicon interposer
• The Chiplet Puzzle: Balancing Design Flexibility, Yield, and Packaging Risks in 2026 Read more at: https://www.bisinfotech.com/balancing-design-flexibility-yield-and-packaging-risks-in-2026/
• Strong AI Demand and Early Consumer Electronics Inventory Build Drive Top 10 Foundries to 3.7% QoQ Revenue Growth in 1Q26
• CEA‑Leti Advances European FD-SOI Innovation with GlobalFoundries’ Collaboration in the FAMES Pilot Line
• Samsung and Nvidia Partnership Upgrade: HBM4E, HBM5 and Autonomous Driving Chip Foundry Enter Substantial Discussions
• Analogue Insight Opens Early Customer Engagement for Low-Power 1–32 Gbps NRZ Transmitter and Receiver IP in GlobalFoundries 45SPCLO for Integrated Co-Packaged Optics

Thursday, June 11, 2026

• Chips Act 2.0 Puts Demand at Center of Europe’s Semiconductor Strategy
• Sunplus Monthly Consolidated Sales Report -May 2026
• BOS Semiconductors Appoints Dr. Dirk Reimer as Senior Vice President, Sales & Business Development EMEA
• VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
• GlobalFoundries and Qualinx demonstrate first European sovereign manufacturing flow for security‑critical semiconductors
• RISC-V Summit Europe 2026: Industry and Academia Unite in Bologna to Advance Open Hardware
• Siemens and Infineon leverage silicon carbide technology to advance electrical protection in data centers and factories
• Samsung Says Nvidia Partnership Extends Beyond HBM to Foundry Collaboration