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Monday, April 13, 2026
Intel, Google Deepen Collaboration to Advance AI Infrastructure
TSMC March 2026 Revenue Report
NEDO Approves Rapidus’ FY2026 Plan and Budget for 2nm Semiconductor Projects
Codasip Shifts Focus to Cyber-Resilient SoCs, Divests Low-End RISC-V Business
IntoPIX Unleashes Zero‑Latency IP Video Streaming With JPEG XS, IPMX & SMPTE 2110 At NAB Show 2026
OmniTrust and Synopsys collaboration enables earlier security validation of embedded systems
RISC-V SoC supports voice-enabled IoT devices
Socionext Collaborates with Arm to Advance AI Data Center Infrastructure with Arm Total Design
BrainChip Unveils Radar Reference Platform to Bridge the ‘Identification Gap’ in Edge AI
SiFive Raises $400 Million to Accelerate High-Performance RISC-V Data Center Solutions; Company Valuation Now Stands at $3.65 Billion
Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
Intel Foundry Achieves Breakthrough with World's Thinnest GaN Chiplet Technology
Rapidus Opens Analysis Center and Rapidus Chiplet Solutions
Power Your Chiplets with 32Gbps Open AIB PHY IP Core — White-Box Licensed with Unlimited Usage and Full Modification Rights
Thursday, April 9, 2026
Cadence Announces First Quarter 2026 Financial Results Webcast
Rambus to Announce First Quarter Fiscal Year 2026 Results
BOS Semiconductors to Showcase AI Innovations at Auto China 2026
5G Adoption Tops 30%, but Revenue Growth Still Lags
Keysight and Sateliot Win European Space Agency and GSMA Foundry Challenge for 6G Innovation
Ultra Accelerator Link™ (UALink™) Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance
Silicon Choices Grow in Importance as Industrial AI Moves Closer to the Factory Floor
AD Technology targets North American AI-RAN and DRAN markets
Samsung Takes First Step Away From ARM’s Ecosystem By Working On An SSD Controller Chip Based On RISC-V Architecture
ADTechnology Pivots to 2nm Chiplet Platform by 2030
Japan's Rapidus ramps up 2nm chip plans while eyeing factories on the Moon
OPENEDGES Advances Commercialization of LPDDR6/5X Memory Subsystem IP, Targeting Next-Generation AI and HPC Markets
Wednesday, April 8, 2026
Intel Joins Musk’s TerraFab AI Chip Project
Qualcomm Joins Korea's 'Challenge AX' Program to Support AI Startups
Codasip announces strategic pivot and divestiture
Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
Tuesday, April 7, 2026
TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology
DDR5/LPDDR5/DDR4 Combo PHY & Controller IP Core in 12FFC - Eliminating Memory Interface Risk
Monday, April 6, 2026
Rambus Recognized by Forbes as One of America’s Most Successful Mid‑Cap Companies for 2026
India’s Semiconductor Leap: Four Plants to be Operational by 2026, Says Ashwini Vaishnaw
Fujitsu plans dedicated 1.4nm AI chip manufactured entirely in Japan by Rapidus — AI chip to be designed and manufactured domestically
Synopsys and ISBA partner to boost India’s startup ecosystem
Synopsys strengthens cooperation with Armenia in education and technology - Vice President
Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission
Quantum-Safe Cryptography: Companies and Players Across the Landscape [2026]
IBM Announces Strategic Collaboration with Arm to Shape the Future of Enterprise Computing
Can Your NPU Run DOOM? Chimera Can.
China’s tech self-sufficiency drive reaches new milestone with powerful RISC-V chips
Advancement of NiuXin PCIe IP: From PCIe 3.0 to PCIe 5.0, Strengthening the Foundation of Chip Interconnection
Keysight Adds Assembly Simulation to Virtual Manufacturing Portfolio
Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out
Japan’s Rapidus Races TSMC and Samsung in 1nm Chip Foundry
Thursday, April 2, 2026
Nvidia invests $2bn in Marvell for AI ASIC compatibility
Ex-Tenstorrent Execs Start Cloud Provider, AI Lab in Japan
Siemens joins European Space Agency’s EPIC initiative to empower European startups
Silvaco Announces Strategic Partnership with APEC to Advance Silicon Carbide Power Device Development
Can Synopsys' Design IP Business Return to Growth in Fiscal 2026?
Keysight Unveils Next-Generation In-Vehicle Network Test Solutions at Automotive Ethernet Congress 2026
EDGEAI to Revolutionize Smart Metering with BrainChip Akida 2 License
EnSilica selected for UK CHERI Adoption Collective
Samsung Readies PCIe 5.0 QLC SSD with a Custom RISC-V Controller
Synopsys Brings Agentic Engineering Into Focus as AI-Driven Design Tests Productivity Limits
QuickLogic Announces Contract for High Density eFPGA Hard IP Optimized for Intel 18A
Silicon Photonics Race Intensifies as TSMC Targets 2026 COUPE Production, Samsung Eyes 2029 CPO Turnkey
Samsung Electronics Launches Silicon Photonics Foundry Business
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