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Monday, July 13, 2026

• 12FFC MIPI A-PHY Tx/Rx IP for Next-Gen Automotive SoCs
• Alok Jain: The Engineer Who Never Wanted to Be a Manager
• InfiniNode secures EUR 2 million financing to advance on-chip data movement technologies for next-generation compute systems
• BOS Semiconductors Named One of Forbes Korea's 2026 FAST-GROWING STARTUPS 50
• Photonics projects shine a light on Europe’s future innovation
• Keysight Delivers New High-Performance 4x100GE Network Cybersecurity Test Platform
• Choosing Between RTOS and Bare-Metal for Edge IoT Devices: A Guide from SignOff Semiconductors
• EU unveils action plan for AI and cybersecurity
• SiPearl CEO Philippe Notton on Europe’s AI processors, chiplets, and semiconductor sovereignty
• The Dawn of Agentic AI Super-Agents
• Sony joins MIPI Alliance board
• Enabling Next-Generation Data Center Infrastructure for Agentic AI: Introducing the Rambus DDR5 9600 Server RDIMM Chipset
• Tesla-Samsung AI5 Chip Hits Tape-Out at Taylor Fab on 2nm Process
• Rapidus to match TSMC on 2-nanometer chip pricing, Japan firm’s president says

Friday, July 10, 2026

• INCIRT Announces Availability of Its PLL Series in the GlobalFoundries (GF) GlobalSolutions™ Ecosystem

Thursday, July 9, 2026

• CAST Expands Functional Safety IP Line with ASIL B Ready SENT/SAE J2716 Receiver Core
• India approves 12 semiconductor manufacturing projects with investments totalling around US$17.2 billion
• Top Semiconductor Companies To Watch In 2026
• Global Semiconductor Sales Increase 9.2% Month-to-Month in May
• Samsung’s chipmaking division posts first monthly profit in three years
• SEALSQ and GlobalFoundries Partner to Accelerate Post-Quantum Cryptography and Quantum Computing Technologies
• Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era
• Samsung Begins Mass Production of PM1763 SSD Optimized for Next-Generation AI Infrastructure
• SUSE, Openchip partner to develop European RISC-V hardware
• MIPS on the RISC-V Shift: ‘Physical AI Is Agentic AI at the Edge’
• Keysight Targets the Hidden Cost of UI Test Authoring and Maintenance
• Samsung Electronics Delays Mass Production of CXL 3.1 Memory Modules
• MOSIS 2.0 and GlobalFoundries Partnership: A Strategic Alliance for Semiconductor Innovation
• Rapidus Pursues 2-nanometer Semiconductor Production in Japan
• TSMC Highlights 2nm and Advanced Packaging Progress

Wednesday, July 8, 2026

• Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
• TAKUMI starts licensing new Warping IPs "TW270" and "TW290"
• »Made in Germany« Security Chip Serves as a Root of Trust for Connected Devices
• Ceva Wins Landmark AI Licensing Deal with Major U.S. Software and AI Platform Company

Tuesday, July 7, 2026

• SkyeChip Advances Custom Interface IP Engagement with Cerebras for Wafer-Scale AI Platforms
• CAST Licenses TCP/IP Hardware Stack Core for Keysight FieldFox Handheld Spectrum Analyzers
• Discuss Silicon-Ready UCIe IP at DAC 2026, Long Beach, California

Monday, July 6, 2026

• In the AI-native era, what exactly are autonomous vehicles competing on?
• Malaysia launches program to accelerate next generation of homegrown semiconductor firms
• China's semiconductor companies speed up IPOs in 2026, as A-share market fuels bid for chip self-reliance
• Vietnam advised to prioritize Edge AI, IoT and chiplet technologies
• SemiFive Records First Overseas Mass Production Revenue
• KSIA Welcomes New Domestic Semiconductor Investment Plan
• Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
• Qualcomm's Tenstorrent Deal Looks Less Likely
• Imec extends auto chiplet program to edge computing
• Allegro DVT contributes to European automotive chiplet
• Chips&Media to Supply APV IP for Future Google Smartphones
• VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
• RISC-V Accelerates Physical AI Chips
• Rambus Targets AI PCs With 9,600 MT/s Client Memory Chipset
• TES Electronic Solutions Introduces a Split‑Pi Boost‑Buck DC‑DC Converter IP for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
• Nordic expands nRF Cloud with firmware vulnerability scanning
• Keysight and WIN Semiconductors Collaborate to Cut Design Risk for High Frequency RF Components
• Electronics Digital Twin platform from Synopsys for accelerating physical AI development
• Socionext Addresses Datacenter Infrastructure Customer Demands for Advanced SoCs on TSMC A14 Technology
• US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging
• Samsung Reaffirms 1.4nm Chips for 2029 and Adds an Enhanced SF1.4+ Node

Thursday, July 2, 2026

• Vietnam advised to prioritize Edge AI, IoT and chiplet technologies
• Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
• Allegro DVT plays a pivotal role in groundbreaking CHASSIS Automotive Base Die development
• Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
• Synopsys Debuts ESUN IP for Breaking AI ‘Slowest Packet’ Bottleneck
• Perforce Intelligence Advances Control and Trust for AI Workflows
• BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors
• StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
• Wave Photonics Announces Synopsys OptoCompiler Compatibility for PDKs hosted on its PDK Management Platform
• Chiplets past, present, and future: how advanced packaging is shaping silicon
• Samsung Unveils AI Foundry Ecosystem Push
• Samsung resumes 1.4nm chip development, targets 2029 mass production