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Thursday, May 21, 2026

• GlobalFoundries advances long-term technology innovation through investment in Playground Global
• Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level
• Quantinuum Announces Collaboration with Synopsys Toward Advancing Industrial Design with Quantum Computing
• When Arm Meets RISC-V: SiPearl, Semidynamics to Co-Develop Sovereign AI Platform
• Development of High-Precision Nonvolatile Analog Computing-in-Memory Technology Enabling Ultra-Low-Power AI Hardware
• AI chip startup Tenstorrent draws takeover interest from Intel, Qualcomm
• SkyeChip to expand into AI silicon products
• Webcast: Accelerating Data: Lossless Compression for HPC, Datacenter, AI, and Scientific Data Pipelines
• CEA-Leti Publishes Its 2026 Scientific Report Highlighting Breakthroughs in Semiconductor Technologies
• Mythic Acquires Videantis, One of Europe’s Leading Digital Processor IP Companies, to Build the World’s Most Energy-Efficient AI Compute Platform

Wednesday, May 20, 2026

• Veriest Solutions Appoints Eli Dagan as Chief Executive Officer; Moshe Zalcberg Transitions to Chairman
• BOS Semiconductors Selected for CB Insights "AI100"; Joins Global Group of 11 Physical AI Companies

Tuesday, May 19, 2026

• Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
• Arteris Technology Adopted by Li Auto for Intelligent Vehicles

Monday, May 18, 2026

• Bangladesh hosts semiconductor roadshow in South Korea
• RISC-V IP Cores: Built for functional safety (ASIL-B/D), high performance, and low power operation for automotive and industrial applications.
• Gov't to invest $113.3 mil. in strategic materials firms
• SEMI and semiconductor companies call for extended investment credit
• SEMIFIVE Reports 137% YoY Revenue Growth in Q1 2026, Accelerating Its Rise as a Key Global Player in AI ASIC
• TSMC forecasts $1.5 trillion global chip market by 2030
• Celebrating 4 Incredible Years Together at BOS Semiconductors
• SkyeChip Berhad IPO: In-Depth Analysis of Malaysia’s Latest Semiconductor Listing
• Automotive silicon in the era of AI, functional safety, and cybersecurity
• Synopsys Achieves First ISO/PAS 8800 Certification for AI-Driven Automotive Systems
• Smallest.ai and Tenstorrent Partnership Democratises Voice AI - 4x reduction in cost through hardware acceleration
• Tenstorrent Unveils TT-QuietBox 2, the First RISC-V AI Workstation With a Fully Open-Source Stack to Deliver Teraflop-Class Inference
• Niuxin's domestic advanced process DDR5/LPDDR5 IPs have both achieved a breakthrough of 6400Mbps.
• The next EDA wave: Lessons from DATE 2026
• MIPI Alliance Launches Physical AI Birds of a Feather (BoF) Group Focused on Humanoids
• Keysight and SRC UK Collaborate to Advance EW Modernization with Advanced Test and Simulation
• IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
• UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays

Friday, May 15, 2026

• IC Manage GDP-AI Transforms IP Lifecycle Management with Generative and Agentic AI

Thursday, May 14, 2026

• Korean economy projected to expand 2.5% in 2026 on chips: KDI
• TSMC Board of Directors Meeting Resolutions
• eMemory Technology Inc (ROCO:3529) Q1 2026 Earnings Call Highlights: Record Revenue Growth and Strategic Expansion
• QuickLogic Announces New Seven-Figure FPGA Hard IP Contract
• HighTec EDV-Systeme and SiFive: Together strengthening the RISC-V Ecosystem for Safe and Secure Automotive and Industrial Applications
• SiFive Sets New Bar for High-Performance RISC-V with Third-Generation Performance P550 and P570 IP
• OSYX Technologies and Andes Technology Announce Strategic Collaboration on RISC-V Virtualization
• CEA-Leti Platform Offers Chipmakers Nanometre- Scale Strain Mapping
• Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project
• Siemens unveils AI-powered library characterization to accelerate semiconductor design
• LTSCT Expands Advanced Power Design Capabilities with Synopsys
• Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing
• TES Electronic Solutions GmbH is extending its on-chip sensor IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

Wednesday, May 13, 2026

• Ceva Advances Full-Stack Wireless Vision with Next Generation Bluetooth High Data Throughput and Integrated RF Design Win

Tuesday, May 12, 2026

• EXTOLL announces Availability of Industry´s first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
• Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
• Chips&Media Completes Development of Next-Gen 'AV2' HW Decoder IP