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Wednesday, September 16, 2026

• New MIPI Alliance Kinematics Working Group to Standardize Streaming Format for Radar and Lidar Sensor Data

Tuesday, September 15, 2026

• Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
• TES Electronic Solutions Launches an Inductor-Less Switched Capacitor Boost‑Buck DC‑DC Converter IP.

Monday, September 14, 2026

• T2M Brings White-Box Licensing to ADC, DAC and PLL IP Cores, High-Performance, Full Modification Rights and Unlimited Usage
• Q2 Global Foundry Revenue Up 11.5%: Gap Widens Between TSMC and Samsung
• Renesas Launches 64-bit RZ/G3L and RZ/G3SE MPUs for Advanced HMI and IoT Edge Systems
• SkyeChip eyes next growth phase as homegrown IP starts to scale, Kenanga sees royalty potential
• Keysight EDA Software Expands Access for European Chip Startups
• Arm introduces new AI-native compute platform built for agentic AI and mobile graphics
• Arm unveils Arm AI Portal to accelerate optimized AI apps across the Arm compute platform
• OpenAI Samsung collaboration extends to next-generation chips
• Quintauris expands RISC-V ecosystem with new industry partnerships
• Chiplet-Based FPGAs Optimize Performance for Space Applications
• GlobalFoundries and Monolithic Power Systems form manufacturing partnership to scale high-performance power solutions
• SMIC Outgrows TSMC and Samsung With 20% Surge, Overtaking GlobalFoundries as World’s Third-Largest Foundry
• Intel Resolves 18A Yield Variability; A Storm to Engulf Samsung and TSMC?

Thursday, September 10, 2026

• Arasan furthers MIPI I3C® compliance with its participation at the I3C® interop in Taipei
• SEMI urges broader Chips Act 2.0 to boost Europe’s chip competitiveness
• BOS Semiconductors CEO Featured in Open Chiplet Atlas Community Voice
• Altera Adds Post-Quantum Security to Agilex 3 and Agilex 5 FPGAs
• GlobalFoundries’ MIPS Acies platform speeds up AI inference at the edge
• RISC-V extensions for high performance embedded computing
• SoC PLANNER: A New Generation of Automated SoC Design Exploration Managing Cost-Effectiveness and Sustainability
• QuantalRF Samples DPD-Efficient Linear Wi-Fi 7 and Wi-Fi 8 FEM with Up to 3dB More Mask-Compliant Power at 160 and 320 MHz
• Imec scales NbTiN superconducting circuits to 30nm
• Arm brings the ecosystem together to build and define the next phase of physical AI
• BOS Semiconductors Joins Arm Total Design for Physical AI
• Arm expands AI infrastructure for the agentic era with AGI CPU and Neoverse CSS N4
• EnSilica to open Space and Communications Semiconductor Centre of Excellence in Milan
• Samsung Electronics and ASML expand strategic collaboration for next-generation semiconductor manufacturing
• Intel Foundry and ASML Collaborate to Accelerate Industry Readiness for High NA EUV
• ASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
• Ceva and LG Electronics Partner to Accelerate UWB Adoption Across Automotive, Industrial and Consumer SoCs
• Qualitas Semiconductor Signs MIPI IP Integrated Solution Licensing Agreement with CoAsia SEMI

Wednesday, September 9, 2026

• RaiderChip Unites Generative AI and Autonomous Robot Control on a single NPU

Tuesday, September 8, 2026

• CAST Introduces 100 Gbps TCP/IP Hardware Stack IP Core for High-Performance ASIC and FPGA Designs
• T2M Expands WhiteBox licensing of Interface IP Cores Portfolio with Unlimited Usage and Full Modification Rights

Monday, September 7, 2026

• Comcores and AVANT Technology Partner to Expand Ethernet IP Opportunities in China and Taiwan
• How AI Is Reshaping the Global Semiconductor Patent Landscape
• Việt Nam moving deeper into global, regional semiconductor value chains
• Accelerating the UK semiconductor sector
• STMicroelectronics Stock Climbs 2.5%, Buoyed by Semiconductors
• Keysight to Showcase Expanded PNT Capabilities at ION GNSS+ 2026
• Key ASIC Berhad and CT Vision (International) Holdings Limited Sign Strategic MOU to Develop Landmark Green AI Data Centre and Integrated Renewable Energy Ecosystem in Malaysia
• Renesas Establishes Physical AI & Robotics Lab in Beijing to Accelerate Next-Generation Robotics Innovation
• Keysight Collaborates with the Centre for Assuring Autonomy at the University of York to Advance AI Safety Assurance for Software-Defined Vehicles
• Why semiconductors are critical to the future of IoT
• ai& and Tenstorrent Launch JapanFold, Bringing Open-Source, Sovereign Drug Discovery to Japan
• Silvaco Group unveils new MIPI PHY IP for GlobalFoundries 22FDX Plus and 12LP Plus
• Overcoming the thermal barrier in next-generation AI ASICs
• proteanTecs and MegaChips Collaborate to Bring Health and Performance Management Solutions to Next-Generation LSI Designs
• Samsung Teams Up with Arm to Develop 2nm On-Device AI Chip; OpenAI Rumored as Potential Customer