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Monday, August 31, 2026

• Silicon-Proven PCIe Gen 5 IP Core Accelerates the Future of High-Performance SoC Connectivity
• India seeks closer Taiwan semiconductor ties
• Q2 Foundry Market Grows 29%... TSMC Dominates with 73% Share, Samsung Stuck at 7%
• Rapidus to receive $944m allocation from Japanese government for AI chip manufacturing
• TSMC Solidifies Dominance with 73% Foundry Share
• Keysight Technologies Announces Participation in Upcoming Investor Conferences
• Weebit Nano FY26: Record revenue, new customer wins
• Photonic integrated circuits: the next frontier of advanced optoelectronic devices
• SEALSQ Subsidiary IC’Alps Advances QASIC Roadmap for Custom Quantum-Resistant ASICs
• Samsung Foundry begins full mass production of Nvidia's Groq 3 LPX chip
• Arm Reveals AGI Server CPU Architecture at Hot Chips, Targeting Agentic AI Workloads
• Semifive accelerates Korea's AI chip design with turnkey ASIC platform
• Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder
• MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
• NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
• IBM and Arm: Expanding the Arm ecosystem for the next era of enterprise computing
• Cadence Design Systems Sees AI Agents Driving Chip Design Boom and Growth
• Keysight Helps AttoTude Cut Terahertz IC Design Cycles by More Than 50%
• Siemens EDA Tools Now Certified for Intel 14A, 18A-P Process Technologies
• Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027

Thursday, August 27, 2026

• A scalable, shader-programmable vector graphics GPU core for low-power MCUs
• Synopsys Posts Financial Results for Third Quarter Fiscal Year 2026
• Integrated Photonics for Wireless Applications: Enabling Free-Space Optics, 6G, and Beyond
• Achronix Announces Availability of High-Performance JESD204C IP Core for Speedster7t FPGAs
• Korea's AI ambition faces power crunch
• Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design
• BrainBoard1500 brings neuromorphic AI to embedded developers
• BrainChip’s AkidaTag Wins Global AI Award for Edge AI & IoT Intelligence
• RISC-V extensions for high performance embedded computing
• SiFive Paves the Path to Accelerated Adoption of RISC-V in the Datacenter with the BigSky Development Server
• UMC Shares Climb 6% on AI Foundry Investment Defying Market’s Semiconductor Downturn
• TSMC’s HBM-Packaging Yield Issues Help Intel, Analysts Say

Wednesday, August 26, 2026

• STMicroelectronics and NUS launch Corporate Lab to power the future of Edge AI in Singapore
• Intel Outlines Architectures for Agentic AI at Hot Chips 2026
• Photonic chip market to hit $9.3bn
• SK Hynix Next-Gen HBM Memory to Use Intel EMIB-T Packaging
• LTE Cat 1bis IP Cores for Next-Generation Cellular IoT SoC Development

Monday, August 24, 2026

• Perceptia Releases Design Kit for pPLL03 on Samsung Foundry 14LPU Platform
• SEMICON India 2026 targets full chip value chain
• Chips Act 2.0, Part 2: From Brussels to the Bench: What Chips Act 2.0 Means for Engineers
• Can Vietnam's SOEs Manufacture a Semiconductor Industry?
• Samsung Raises Advanced Chip Prices by 15% as AI Boom Gives Foundry Business New Leverage
• Keysight Technologies Reports Third Quarter 2026 Results
• BOS Semiconductors to Present Eagle-N at Hot Chips 2026
• Aion Silicon Participating in Five Global Semiconductor and AI Events
• TIER IV and Renesas target AI-native SDV platform
• Arteris: High Premium For AI Chip IP
• Alibaba’s RISC-V Chip Runs 27B AI Model Without a GPU
• Synopsys Rolls Out First Complete CXL 4.0 IP for AI Memory Connectivity
• proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
• Rapidus Targets 8-Reticle Interposers on 600 mm Advanced Packaging Panels by 2030
• TSMC Completes Development of 1.6nm A16 Process; Mass Production Set for Q4

Thursday, August 20, 2026

• Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
• Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
• Success of three megaprojects hinges on execution
• India’s C2S Program Pushes Semiconductor Design Training Toward Silicon
• SMIC lifts prices due to AI demand
• Samsung Electronics raises advanced foundry prices up to 15%, 4nm line at full capacity: Reuters
• Samsung reportedly considers converting R&D facility into 2nm HBM production line
• M31 Reports Nearly Fourfold Growth in Advanced-Node Royalties as Long-Term Investments Begin to Bear Fruit
• VeriSilicon's H1 revenue doubles but losses widen to 612 million yuan; monetizing billions in AI orders will take time
• High-Performance Standalone MJPEG IP ‘WAVE-J’ by Chips&Media Widely Adopted Across Diverse Applications
• Ceva and Actions Show Off Strengths of Bluetooth HDT in New Audio Chips
• BOS Semiconductors Tapes Out Automotive AI Accelerator 'Eagle-N'... Begins Evaluation with German and Chinese Automakers
• SkyeChip's AI expansion to yield meaningful earnings from 2029
• BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community
• StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure
• Andes Technology’s D23-SE RISC-V Processor Achieves ISO 26262 ASIL‑B and ASIL‑D Certification for Functional Safety Applications
• Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
• The changing role of the foundry