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Thursday, October 8, 2026

• RaiderChip’s Edge NPU reaches more than 50 Generative AI Models with the addition of Qwen3.8-27B
• Xanadu and GlobalFoundries Announce Strategic Partnership to Accelerate Utility-Scale Quantum Manufacturing
• SkyeChip joins Rapidus ecosystem for Japan's 2nm chip platform
• Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
• From Silicon to Steel: Taiwan Takes Its Physical AI Push to Silicon Valley
• Xiphera launches nQrux® Root of Trust with Post-Quantum Cryptography
• Rambus Gets to the Root of SoC Security With Caliptra Support
• PQShield expands leadership as PQC adoption accelerates
• ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
• Synopsys Initiates $1 Billion Accelerated Share Repurchase Agreement
• EnSilica hails record annual results, shares surge
• Cadence Announces Third Quarter 2026 Financial Results Webcast
• QuickLogic Announces Inducement Grant Under Nasdaq Listing Rule 5635(c)(4)
• ​Applied Materials, Intel Partner on Next-Generation Chip Manufacturing Technology
• AMD CEO Meets Samsung, SK hynix Chiefs in Seoul
• Cirrus Logic Announces Acquisition of INVENTVM Semiconductor
• Japan-Germany partnership to advance semiconductor research

Wednesday, October 7, 2026

• Aion Silicon Named Design Solution Associate in New Rapidus CORE Ecosystem for 2nm Semiconductors

Tuesday, October 6, 2026

• Chips&Media Expands Beyond Traditional Video Codecs to Become a Multimedia IP Leader… Unveiling the ‘Data Compression (Feature Map Compression) IP’ to Resolve NPU Bottlenecks
• BOS Semiconductors to Support MIRISE Technologies’ Automotive Chiplet R&D Project
• Arteris Wins Funding to Expand Hardware Design Supply Chain Security Assurance for the Trusted and Assured Microelectronics Program

Monday, October 5, 2026

• Silicon-Proven Bluetooth® 6.3 RF IP Cores for Next-Generation Advanced Wireless SoCs - T2M
• Rapidus Unveils "Rapidus CORE", New Global Ecosystem Framework Supporting the Development and Mass Production of Cutting-Edge Semiconductors
• Panther Lake Teardown Shows Intel 18A Near TSMC N3E, Newer TSMC Nodes Still Ahead
• Synopsys Earns Five TSMC Open Innovation Platform Partner of the Year Awards for Advancing AI-Driven Semiconductor Innovation
• JEDEC® Publishes First Industry-Wide Silicon Photonics Reliability Standard for AI, Datacenter and Telecom Infrastructure
• 2.5D/3D Integration Challenges: Bare Die Testing
• Synopsys Expands Agentic AI Across Semiconductor Design With AgentEngineer and Autopilot
• Tenstorrent and Smallest.ai Partner to Bring Production-Grade Voice AI On-Prem
• SEMIFIVE Signs Turnkey Contract with Mobilint to Develop Robotics AI Chip Under 'K-On-Device AI Semiconductor' Program
• Mistral Opens German Hub in Munich to Advance Industrial AI in Europe’s Largest Economy
• Scaling AI with Wide, Parallel Interconnects
• ICTK to Acquire 56.75% Stake in WithNetworks for Security Solutions
• Nordic Rolls Out New Multiprotocol SoC for Size- and Cost-Effective IoT
• CEA-Leti and Quobly Strengthen Their Collaboration to Accelerate the Development of Next-Generation Silicon Quantum Technologies
• Silvaco CEO Dr. Walden "Wally" Rhines Inducted into the National Academy of Engineering
• Renesas Announces Establishment of New Subsidiary and Changes as Specified Subsidiary
• Inside Soitec, the French tech company powering the global semiconductor industry
• ​Korea’s Semiconductor IP Industry Starts Benefiting From On-Device AI Project
• SoftBank Completes $30 Billion OpenAI Investment, Bringing Total Commitment to $64.6 Billion
• AI Demand Lifts Entire Semiconductor Ecosystem… Q2 Foundry 2.0 Revenue Surges 25%

Thursday, October 1, 2026

• OpenAI and Synopsys Announce GPT-Synopsys: Frontier Intelligence to Revolutionize Chip Design
• Synopsys Details Growth Strategy and Long-term Financial Model at 2026 Investor Day
• TSMC’s 3-nm Ramp Looks Different in Historical Context
• Silicon Creations Receives 10th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP
• Racyics UCIe PHY IP for GlobalFoundries 22FDX reaches silicon
• Synopsys and Amazon Announce Strategic, Multi-year IP Agreement for Custom Silicon; Collaboration Also Extends to Cloud and AI-Powered Engineering
• Synopsys Powers Autonomous Engineering with a Broad Portfolio of Long-Horizon Agents and Autopilot Platform
• MIPS and Xcelsa Collaborate to Accelerate Verified, Workload-Optimized Custom Silicon
• Siemens accelerates physical testing with Simcenter Testlab
• TES Electronic Solutions Introduces a Low-Power 32 kHz Pierce Oscillator IP for Battery-Powered ASICs and SoCs
• Fraunhofer RISC-V Secure Element Accelerates Secure Chip Development After Successful Silicon Validation
• Efinix introduces 64-Bit RISC-V SoC for FPGA-based embedded systems
• Fraunhofer IPMS hosts workshop on scaling quantum chip production
• BOS Semiconductors Named to Forbes Korea’s "2026 Korea AI 50"
• Samsung expects its foundry customers to quadruple by 2029
• SEMIFIVE Secures USD 52 Million AI Accelerator Contract with U.S. Fabless Company, Validating End-to-End ASIC Model in North America
• SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems at AI Infra Summit 2026

Wednesday, September 30, 2026

• Arasan to demonstrate the industry's first MIPI SWI3S™ IP at the MIPI Member meet in Taipei

Tuesday, September 29, 2026

• BOS Semiconductors Joins Arm Total Design for Physical AI
• eMemory Recognized with TSMC Open Innovation Platform® (OIP) Partner of the Year Award for IP Solutions

Monday, September 28, 2026

• T2M Advances RISC-V CPU IP Cores Portfolio for Next-Generation AI and Intelligent Edge SoCs
• Qualcomm Says Announced 2nm Chips Will Use TSMC, Keeps Door Open to Samsung Foundry
• Vietnam is beginning to enter the "chip manufacturing" industry.
• BOS Semiconductors Opens San Jose Office, Expanding Its Presence in Silicon Valley
• From stars to atoms: CSEM and Neuchâtel’s continuing quest for precise time
• EU proposes common rating scheme to drive data centre sustainability
• Keysight Enables UC Berkeley Research to Advance 6G Over-the-Air Testing
• The AI computing power chip unicorn Yixing Intelligence has secured another 2 billion yuan in financing, accelerating the commercial implementation and ecosystem leadership of RISC-V cloud AI computing power.
• Cadence PCIe 6.0 Clears First-Pass Compliance Testing
• aiMotive and Cadence Demonstrate Layer-by-Layer Workload Placement Across Independent AI Engines
• Alchip collaborates with Synopsys to Address Scale Up and Out Bandwidth Constraints
• Samsung considers expanding 4nm capacity as HBM4 demand rises