With the rapidly increasing connectivity demands driven by AI/ML and HPC/datacenter use cases, high-throughput die-to-die connectivity is more essential than ever. Cadence has been at the forefront of die-to-die connectivity solutions since 2018. In keeping with a rapidly broadening portfolio of die-to-die connectivity solutions, Cadence has taped out its IP subsystem for 32GT/s UCIe solution on Samsung's 4nm (SF4X) process technology. Building on eight years of expertise in die-to-die solutions and the success of multiple UCIe IP subsystem test chips, this next-generation product delivers improved performance and flexibility while maintaining the reliability and precision proven by its predecessors.
The 32GT/s UCIe solution builds upon silicon-proven IP at 32GT/s and 16GT/s speeds—the latter forming the first two UCIe transceiver publications—this is peer-reviewed and proven performance.