The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as key enablers of future designs.
What you'll learn:
- Where chiplets stand today and what’s holding them back.
- Different ways companies are using chiplets in system design.
- How new interconnect approaches are helping link multiple dies.
- Why industry standards will be key to wider adoption.
Chiplets have emerged as a dominant theme in discussions of next-generation system architectures. The current narrative describes a vision where design teams can mix and match dies from different sources, using standard interfaces and simplified flows to build multi-die systems.
The analogy to off-the-shelf IP components is often cited, with chiplets expected to become as accessible and interoperable as passives or even microcontrollers. However, while compelling, this narrative is still a long way from reality.