After decades of building out, semiconductor designers are now building up.
To scale performance for AI workloads and other data-intensive applications, many chipmakers are adopting architectures that integrate multiple dies in a 3D package.
These multi-die designs don’t just change system architectures and inter-die connectivity. They also dramatically increase design complexity, forcing engineering teams to completely rethink traditional approaches to connectivity, packaging, power delivery, and signal integrity.
With longstanding assumptions and best practices being upended, interface IP has emerged as the keystone for building scalable, reliable 3D multi-die designs.