Architecting the Next Generation of AI Silicon
The semiconductor industry is no longer defined solely by transistor scaling. As Moore's law decelerates, advanced packaging has become the primary lever for achieving system-level performance gains. Within this landscape, the equation 2.5D + 3D = 3.5D—defying the instincts of basic math and physics—captures a pivotal architectural evolution: one that balances performance, manufacturability, cost, and thermal efficiency in ways neither traditional planar designs nor purely vertical stacks can.
At its core, "3.5D" integration represents a new class of heterogeneous system architecture that directly addresses the technological and economic pressures driving AI and high-performance computing (HPC) silicon today.