The semiconductor industry is at a pivotal moment, truly an inflection point where the very fabric of computing is being redefined. As the relentless march of AI propels us beyond the traditional confines of Moore’s Law, the familiar landscape of 2D SoC design is encountering its inherent limitations. The path forward, the very future of chip innovation, is now undeniably paved with 3D.
3D ICs integrate hundreds of chiplets and millions of interconnects within a single package. At this density, thermal, warpage, and other multiphysics effects can cascade across the stack, causing costly re-spins and delayed time-to-market. These 3D architectures introduce entirely new system-level hurdles that demand innovative solutions to achieve the performance and reliability we’ve come to expect. To conquer these, we need 3D IC solutions that proficiently address five critical design domains: exploration, design, analysis, reliability, and test.