Fanout RDL routing must support tighter design margins compared to package substrate routing. Substrate routing distributes signals over larger geometries, longer paths, and many layers. Fanout RDL forces thousands of nets through a constrained interposer region at fine line-and-space, across dense bump arrays, high-speed buses, and power structures that all must coexist. Manual routing handles isolated paths, but every die placement, bump reassignment, or power-grid change triggers another round of iteration, and the process stops converging. The demo, Accelerate Multi-Die Fanout Routing with 3DIC Compiler, shows the automated path, including front-side and backside bumps, constraint-driven routing, die-to-substrate bridging, and power-plane realization, all inside the 3DIC Compiler platform.
Catalog of SIP Cores
System on Chip design resources
System on Chip design resources