Integrating silicon IP into systems-on-chip is a lot harder than it used to be - but there are some emerging trends that will help, according to panelists at the EE Times System-on-Chip 2.0 virtual conference Nov. 18. Three topics stood out for me - the emergence of IP subsystems, the avoidance of multiple legal entanglements, and the integration of IP from multiple vendors.
The panel was moderated by Dylan McGrath, online editor of EE Times. Panelists included the following (sorry, no photo - this was an on-line conference).
- Rick Tomihiro, director of marketing, semiconductor IP, Xilinx
- Frank Ferro, director of product marketing, Sonics
- Steve Leibson, EDA360 evangelist, Cadence
- Kalar Rajendiran, senior director of marketing, eSilicon
The panel was conducted in a Q&A format. Below, I've selected three questions that reflect the topics mentioned above, plus some answers.
Click here to read more ...