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EDA360 Beyond the Chip - Package, Board, and Product CreationIndustry Insights Blog - Richard Goering , CadenceApr. 25, 2011 |
The EDA360 vision, articulated by Cadence one year ago this week, calls for an expanded view of EDA that supports complete hardware/software systems ready for applications deployment. Most of the discussion during the first year focused on silicon and embedded software. A Cadence Allegro 16.5 announcement today (April 25) illustrates how EDA360 also encompasses package and board design.
It seems obvious, as soon as you think about it, that a "complete system" would have to include packages, one or more boards, and some kind of enclosure. If you doubt that, gather up all the silicon components that will go into a cell phone before they go into packages or onto boards, and try to make a call.
