You can see why Intel decided to accept ASML's offer to invest in it -because the difference between the plans of Intel and TSMC on when to start 450mm production, and the plans of ASML on when to produce a 450mm lithographic machine is comical.
TSMC says it intends to start trial production on 450mm wafers in 2013-14 and to be in volume production in 2015-16.
Intel says it will be getting first generation 450mm tools in 2015 and will start making ICs on it. In 2016/2017 second generation 2 tools will be delivering real productivity and Intel will then start upgrading its existing fabs."
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