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TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETsIndustry Insights Blog - Richard Goering , CadenceOct. 18, 2012 |
TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working on 16nm FinFET technology using ARM's 64-bit V8 processor as a test vehicle.
A common thread underlying all these developments is the early and deep collaboration afforded by the OIP ecosystem, which now includes over 100 partners including EDA vendors, silicon IP providers, and design services houses. Three keynote speakers -- including two from TSMC, and one from ARM -- all spoke of deep collaboration as the key enabling force behind semiconductor technology innovation. "The pace of technology is accelerating, and we know that collaboration is the foundation that's needed to solve the problems that sit in front of us," said Rick Cassidy, president of TSMC North America, in his opening remarks.
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