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Q&A: TSMC R&D VP Cliff Hou Discusses 20nm, CoWoS Multi-Die Packaging, and FinFETsIndustry Insights Blog - Richard GoeringOct. 25, 2012 |
The recent TSMC Open Innovation Platform (OIP) 2012 Ecosystem Forum marked the release of 20nm and chip-on-wafer-on-substrate (CoWoS) reference flows, as well as new insights about the giant foundry's plan for 16nm FinFETs. I blogged about the keynote speeches here. Separately, I interviewed one of the keynote speakers -- Dr. Cliff Hou, vice president of R&D -- later in the day. Excerpts from our conversation follow.
