Industry Expert Blogs

The high functional integration of system-on-chip designs today is driving the need for new technological approaches in semiconductor design. Anyone who owns a Samsung Galaxy S4, HTC One or comparable smartphone can see the benefits of integrating onto one chip all the computing functions that were traditionally separate, discrete chips on a PC computer motherboard. For next-generation devices, developers are driving even greater computing power, higher resolution graphics, and improved media processing into the integrated SoCs that enable these systems. This high level of integration is causing on-chip communications and transaction handling to become a system constraint within the SoC, limiting the achievable performance of SoCs no matter how optimized the individual CPU, GPU and other IP blocks.

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All indications point to ever-higher levels of integration and further SoC advancements in the years to come. This will enable even more functions to be added, making systems more sophisticated, smaller, more power-efficient, and more cost-effective. Yet there is still one critical area of the chip design that needs to be addressed: The on-chip interconnect fabric.

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