Industry Expert Blogs

The BIG news this week is small. Our team built the tiny USB 3.0 and USB 2.0 femtoPHY to save power and area. 50% less area than the previous generation picoPHY. AND CERTIFIED by the USB-IF

At a 50% smaller size, to me it’s like:

1. Being able to eat the same size 500 gram steak with all the gloriously delicious fat but at ½ the calories and ½ the triglycerides
2. Running only 2.5 kilometers but getting the healthy heart benefit of running 5 kilometers
3. Sleeping only 3.5 hours but feeling like I’ve slept for 7 hours (yes please invent this).
4. Eating a whole box of chocolate but feeling the guilt of only eating 1/2 a box of chocolates

Less power, less area, same Super speed USB for USB 3.0 and Hi-Speed USB for USB 2.0. For our many customers building mobile chips and TV chips with 2 or 4 or 8 USB PHYs, this is a huge savings in area on each chip and on each wafer. Assuming you get thousands of chips off a wafer, it adds up.

And, AND the USB 3.0 and 2.0 PHYs are SuperSpeed USB and Hi-Speed USB certified. This means they have tested for electrical and protocol and interoperability by a 3^rd party independent lab.

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