As the 3-D memory market matures, it continues to incubate new application opportunities and confront new challenges.
Some of the challenges faced by 3D memory adoption range from technology to cost and design.
On the technology front, many of the initial challenges around the interconnect reliability and scalability of through-silicon vias (TSV), interposer development and chemical mechanical polishing (CMP) have been addressed through programs like TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) program. Thermal management is still a challenge facing adoption, especially for full 3D implementations. These programs also have helped to mature and improve the test methodologies, supply chain and design flow issues that loomed very large at the initial stage of 3D adoption.
The third challenge still being faced by the industry is cost. Cost is still a major driving factor for adoption whether it is an FPGA, SoC interposer or full 3D based implementation choice.
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