I recently spoke to Ken Foust from Intel regarding his being the chair of the MIPI Sensor Working Group and the important standards work they are doing there. I also had a conversation with Peter Lefkin, the Managing Director of the MIPI Alliance about I3C.
Foust had worked closely with the MEMS Industry Group (MIG) to survey that industry regarding their thoughts on sensor interface and problems they are having in that area. Companies such as Intel, Qualcom, NXP and TI gave their valuable comments and all of them had the same “pain” points.
Lefkin said that they wanted a new interface for sensors that would be backwards compatible with I2C and SPI buses. “Mobile” products were the main concern. These are automobile communications, wearables, smartphones, tablets and touchscreens and the like.
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