Industry Expert Blogs

This year’s OIP was much more lighthearted than I remember which is understandable. TSMC is executing flawlessly, delivering new process technology every year. Last year's opening speaker, David Keller, used the phrase “Celebrate the way we collaborate” which served as the theme for the conference. This year David’s catch phrase was “Insatiable computing trend” which again set the theme.

First up was Dr. Cliff Hou’s update on the design enablement for TSMC’s advanced process nodes. Cliff again hit on the Mobile, HPC, IoT and Automotive markets with a focus on 55ULP, 40ULP, 28HPC+, 22ULP/ULL, 16FFC, and 12FFC. Speaking of 16FFC, TSMC’s Fab 16 in Nanjing, China is on track to start production in the second half of 2018 approximately two years after the ground breaking. This will be the first FinFET wafers manufactured in China which is another first for TSMC. China represents the largest growth opportunity for TSMC so this is a very big deal.

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